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Sep 13, 2023 111 likes •196 views

Under the Hood: Chips Powering Next-Gen IoT Devices Mike Noonen Silego Technology Mike Noonen Sales & Business Development CEO (interim) & Board Director Founder & Chairman, Silicon Catalyst EE Times / EDN Start-up of the Year

SLIDE 1

Under the Hood: Chips Powering Next-Gen IoT Devices Mike Noonen Silego Technology

SLIDE 2

Mike Noonen

Sales & Business Development CEO (interim) & Board Director Founder & Chairman, Silicon Catalyst EE Times / EDN Start-up of the Year EVP, Worldwide Sales, Marketing, Design, & Products, GlobalFoundries EVP, Global Sales & Marketing, NXP Semiconductors SVP, Worldwide Sales & Marketing, National Semiconductor Global Semiconductor Alliance, Board of Directors

SLIDE 3

Ambiq Micro Subthreshold Logic

Subthreshold operation can reduce energy usage by up to 13X

Energy (E) consumed is directly proportional to the square of the voltage (V) used:

E ~ V2

1.8 V 0.5 V Voltage Time

1 1

ENERGY ENERGY

Conventional Semiconductors

1.8 V 0.5 V Voltage Time

1 1

ENERGY ENERGY

Ambiq’s SPOT approach

Threshold Voltage

ENERGYSAVINGS

Active Mode 30µA/MHz Sleep Mode 100nA ARM Cortex- M4F core

Source: Ambiq Micro Corporate Overview

SLIDE 4

GlobalFoundries FDSOI

Ultra-thin Buried

Oxide Insulator Fully Depleted Channel for Low Leakage

FD-SOI

Planar process similar to bulk

70% lower power than 28HKMG 20% smaller die than 28nm bulk planar 20% lower die cost than 16/14nm

Frequency vs. Total Power

1.80 1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.60 0.80 1.00 1.20 1.40

Total Power (normalized) Freq. (normalized)

50% lower power at

same frequency

40% faster

performance at same power

Low Vdd operation

(down to 0.4 volts)

FBB Advantage:

Software-controlled body-bias enables dynamic tradeoffs between power, performance and leakage

30% Faster 50% Less Power 40% Faster 50% Less Power

Source: GF 22FDX Intro

SLIDE 5

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Next Generation Device Specification

CPU Freq. 1.5+ GHz Vdd 0.6v
SRAM up to 16Mb
-25C to +85C
Integration Path: BLE, WiFi, PMIC

Smart Watch User Case 40LP 28SLP FinFET 22FDX 22FDX +FBB

Freq. @ ISO power

1 1.5 2.8

2.6 3.0

Battery Life (Days) 4.6 6.4 11.6

13.9 20.0

40nm wearable device today

4X battery life increase with higher performance

– h

22FDX Case Study – Smart Watch

Source: GF 22FDX Intro

SLIDE 6

Silego Configurable Mixed-Signal ICs

1000 Customer Designs Completed ~2.5B Units Shipped

SLIDE 7

Configurable Mixed-Signal is a Better Way To Design Wearable & IoT Devices

™

1.0 x 1.2 mm STQFN 8-pin package 1.6 x 1.6 mm STQFN 12-pin package 1.6 x 2.0 mm STQFN 14-pin package 1.6 x 2.5 mm STQFN 14-pin package 2.0 x 3.0 mm STQFN 20-pin package 2.0 x 2.2 mm STQFN 14-pin package

Gree ™

GreenPAK is ideal for

Functional replacement of popular mixed-signal standard products, often in combination. Providing reliable hardware safety and reset functions for software coded devices, such as SoCs and Microcontrollers.

Easy Development Tools

GUI similar to schematic capture Complete Hardware Dev Kit

™

SLG4K123