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Analytical Clustering Score with Application to Post-Placement Multi-Bit Flip-Flop Merging
Chang Xu1, Peixin Li1, Guojie Luo1, Yiyu Shi2, and Iris Hui-Ru Jiang3
{changxu, gluo} @ pku.edu.cn
Application to Post-Placement Multi-Bit Flip-Flop Merging Chang Xu 1 - - PowerPoint PPT Presentation
Analytical Clustering Score with Application to Post-Placement Multi-Bit Flip-Flop Merging Chang Xu 1 , Peixin Li 1 , Guojie Luo 1 , Yiyu Shi 2 , and Iris Hui-Ru Jiang 3 {changxu, gluo} @ pku.edu.cn 1 Outline Background Multi-bit
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{changxu, gluo} @ pku.edu.cn
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𝟑 𝒈𝒅𝒎𝒍
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2-Bit Flip-Flop Source: ICCAD’10 Chang et al.
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(a) Common clock tree (b) Simplified clock tree with MBFF
UMC 55nm process Faraday cell library
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FF
Input pin Output pin
FF FF FF TVFR
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FF TVFR TVFR1 TVFR2 2-bit FF
Input pin Output pin
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TVFRs Intersection Graph Complete Graph TVFRs
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Random Choice!
Illustration to Interval Graph Source: ISPD’11 Jiang et al.
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Difference
Signal wirelength degradation (for Integra)
C1-C6 TVFD/AFFD FF ratio Vga (IWLS 2005) TVFD/AFFD FF ratio
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𝑚 𝒚, 𝒛 − 𝑔 𝑑 𝒚, 𝒛
TVFRs
2-bit group 3-bit group
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𝑂
TVFRs
𝑶𝒌 = 𝟑
𝑮𝑮𝒌 𝑮𝑮𝒋 𝑶𝒋 = 𝟒
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𝑑 = −𝑛𝑏𝑦𝑔 𝑑 = −𝑛𝑏𝑦 𝑗=1 𝑂
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2
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𝐺𝐺
𝑗
𝐺𝐺
𝑗
𝐺𝐺
𝑗
𝐺𝐺
𝑗
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500 1000 1500 2000 2500 3000 3500 500 1000 1500 2000 2500 3000 3500
(a) Initial FFs’ distribution
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NLP Loc. (b) FFs’ distribution after analytical clustering
𝒈𝒅: maximizes MBFF group numbers 𝒈𝒎: pulls FFs towards their “optimal locations” in terms of WL
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(a) Proximity relation after analytical step A B C D I H E F G A B C D I H E F G (b) Discrete clustering A B C D I H E F G (c) Discrete refinement (d) Final MBFF groups A B C D I H E F G
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S(C,D) S(G,F) S(E,G) S(I,H) S(A,C) S(A,B) S(I,E) (a) Proximity relation after analytical step A B C D I H E F G (b) First-pass clustering A B C D I H E F G
S(I,E) (c) second-pass clustering A B C D I H E F G (d) Final MBFF groups A B C D I H E F G S(H,F)
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500 1000 1500 2000 2500 3000 3500 500 1000 1500 2000 2500 3000 3500
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NLP Loc.
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Final Loc.
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500 1000 1500 2000 2500 3000 3500
NLP Loc. Final Loc.
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𝑚 𝒚, 𝒛 − 𝑔 𝑑 𝒚, 𝒛
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Circuit Integra Ours PWR WLR RT (s) PWR WLR RT (s) C1 82.8 96 0.01 83.5 77.4 0.42 C2 80.9 102 0.01 82.3 76.4 0.97 C3 80.8 104 0.01 82.3 74.9 3.14 C4 81.0 104 0.02 82.4 75.6 10.59 C5 80.7 105 0.05 82.1 76.4 16.66 C6 80.7 105 1.11 82.3 82 217.4 Avg. 1 1.33 1 1.02 1 252
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Effect of Different Bound Factors to Power Ration and WL Ratio
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Comparable power reduction 43% WL reduction compared with Bound-Integra
Circuit Bound-Integra Ours PWR WLR RT (s) PWR WLR RT (s) Tv80 78.11 109.2 0.01 78.10 95.7 0.94 Wbconmax 78.26 128 0.03 78.02 105 2.3 Pairing 78.00 132 0.03 78.00 109 6.61 Dma 78.04 124 0.05 78.02 96 5.43 Ac97 78.02 120 0.02 78.02 96 4.88 Ethernet 78.00 217 0.63 78.00 88 24.5 Avg. 1 1.43 1 0.99 1 84
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