Circuits in Emerging Nanotechnologies
Rinaldo Castello University of Pavia Thomas Ernst CEA-LETI Seok-Hee Lee SK-Hynix Subhasish Mitra Stanford University Ion O’Connor Ecole Centrale de Lyon Chair: Adrian Ionescu, EPFL
Circuits in Emerging Nanotechnologies Rinaldo Castello University - - PowerPoint PPT Presentation
Circuits in Emerging Nanotechnologies Rinaldo Castello University of Pavia Thomas Ernst CEA-LETI Seok-Hee Lee SK-Hynix Subhasish Mitra Stanford University Ion OConnor Ecole Centrale de Lyon Chair: Adrian Ionescu, EPFL Rinaldo Castello
Rinaldo Castello University of Pavia Thomas Ernst CEA-LETI Seok-Hee Lee SK-Hynix Subhasish Mitra Stanford University Ion O’Connor Ecole Centrale de Lyon Chair: Adrian Ionescu, EPFL
FROM INTEGRATED CIRCUITS TO INTEGRATED SYSTEMS
THOMAS ERNST Montreux Symposium on emerging trends in electronics 1/12/2014
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Today The packaging evolution Heterogeneous Era ! Si/Smart Interposers ! Memory on Logic ! Logic on analog ! MEMS on logic ! RF/ANALOG ! 3D imagers ! Biochips 0 -10 years The alternative to “More Moore” scaling ! Logic-on-Logic : (Monolithic and 3D-Stacked) ! Monolithic 3D memories ! PHOTONICS ! RF/MEMS – ANALOG ! Biochips ! Novel substrates
5- 15 years Advanced concepts ! Novel computing paradigms ! Beyond CMOS hybridization ! Bio-inspired 3D process
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Seok-Hee Lee R&D Division, SK hynix
Memory demand split across multiple sub-segments
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Low Cost Low Power High Speed
Higher Tr. Performance (High Speed)
Automotive PC / Server Smart Devices Wearable Devices DRAM
Jox [A/cm2] Tox [Å] Nitrided SiO2 Jox Limit for DRAM Tr Jox Limit for Logic Tr HKMG Tox [Å] Gate Length of Peripheral Tr. [nm] [Source : ITRS 2003~2007] Logic Tr DRAM Tr HKMG 25nm node
Transistor for Higher performance & Lower Power
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Low Power DRAM design Technique example
Power Gating Multi-VTH Dynamic Body Bias
Objective Reduce leakage currents by inserting a switch transistor into the logic stack Reduce leakage power where speed is not needed by high Vt transistor Controlling body bias, high speed & lo w leakage current can be achieved Scheme
Vdd Logic Cell Virtual Ground sleep Vdd Logic Cell Switch Cell L L L L L L L L H L L L L L L H Q&(+!"2,,-N!Q&(+!V,$`$(,!
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Solutions for Higher Performance & Higher Density
Density
Conventional Stacking # High Density, Low Performance Non-Stacking # High Performance, Low Density Wire Bonding
Memory Requirements . Lower Power . Higher Performance . Higher Density
[16Gb TSV, SK Hynix : 40nm 2Gb x 8]
Performance
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TSV-Stacking # High Density High performance Low power # but, High Cost & Process Difficulty
High Reliability & Low Cost DRAM
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Item Objective Effect, Status Issues DFR (Design For cell Reliabilit y) Advanced Refresh Refresh Compensate Retention Time Degr adation Increase IDD Smart Refresh Refresh Improve LtRAS VBB Temp Modulation Write Write Recovery Time POD (Post Over Drive) Refresh Compensate Sensing Margin Increase IDD On chip ECC Error Correction Area Overhead PPR (using ARE) Error Aging Fail
Department of EE & Department of CS Stanford University
27
28
3D Resistive RAM Massive storage Carbon nanotube FET compute elements STTRAM L2, L3, … Carbon nanotube FET (or even silicon) compute elements
Monolithic 3D Inter-layer vias: 1,000X TSV density
thermal thermal
29
CNT: d = 1.2nm
d
CNFET
Sub-litho pitch
CNFET (Stanford fab) Si FETs (foundries)
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[Shulaker Nature 13, ISSCC 13, IEDM 14]
30 [Wei IEDM 13, Shulaker VLSI Tech. 14, IEDM 14]
VOUT (V) VIN (V)
1 2 3 1 2 3
Inter-layer digital circuits
Conventional vias, no TSVs Process temp. < 250 oC
CNT
Silicon FETs Resistive RAM CNFETs Logic + memory Resistive RAM
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Rinaldo Castello University of Pavia Thomas Ernst CEA-LETI Seok-Hee Lee SK-Hynix Subhasish Mitra Stanford University Ion O’Connor Ecole Centrale de Lyon Chair: Adrian Ionescu, EPFL