Stevenage Circuits Group Incorporating: Stevenage Circuits Tru-Lon - - PowerPoint PPT Presentation

Stevenage Circuits Group

Incorporating:

Stevenage Circuits Tru-Lon Printed Circuits

March 2011

The Organisation

Stevenage Circuits formed 1971 Tru-Lon integrated into the Stevenage site March 2011 Group privately owned £11m turnover, potential £15m turnover £11m turnover, potential £15m turnover 150 staff / 70,000 square feet 24 / 7 working hours since November 2010 ~£20m worth equipment Dedication to investment Full range of products including PTFE processing

Key Staff

• Stuart Spink

CEO

• Mark Brown

HR Director

• Rob Brown

Sales and Marketing Director

• David Brown

Operations Director

• Jeremy Rygate

Engineering Director

• Rosemary Burt

Company Secretary

• Rosemary Burt

Company Secretary

• Tim Gee

Operations Manager

• Jonathan Calver

Process Engineering Manager

• Beverley Cording

Quality Management Systems Manager

• Lee Naylor

CAM Supervisor

• David Wyllie

Sales Manager

• David FitzGerald

Area Sales Manager

• John Wood

Area Sales Manager

• Alaistar Waddell

Area Sales Manager

Key Staff

Continued...

Phil Firth Engineering Manager Paul Estwick Quality Control Manager Paul Estwick Quality Control Manager Neil Butler Internal Sales Marc Holloway IT Manager

Qualifications currently held

Underwriters Laboratories - UL94V0 (Rigid FR4, Flexi- Rigid, Flexible, Rigid Polyimide) BS EN ISO 9001:2008 (Quality System Approval) ISO14001 (Environmental) ISO14001 (Environmental) IPC Class 3 manufacture and test (Int. standard) COSHH (System of controlling hazardous substances) CECC/IECQ (BS123000)

D/S, M/L, Flexis, Flexi Rigid FR4, Reinforced Polyimide, Flex Polyimide Blind, buried, laser or mechanically drilled Variety of finishes

CECC

Certificates:

CECC (cont)

Capability

Qualifications currently sought

IPC Class 3 – formal release May 2011 AS9100 (Aerospace Approval) March 2011

Investment in 2010 / 2011

Thin core cut sheet laminator Loaders / unloaders (LDI, DES, pre-treat lines) Orbotech Discovery AOI 5 x Orbotech InCAM Front End systems 5 x Orbotech InCAM Front End systems New Class 10,000 clean room ESI Laser drill upgrade Effluent plant Visper Automatic Final Inspection machine Total cost ~ £1.5m

Product sectors

Military Aerospace Medical Telecoms Telecoms Security Entertainment Sport Domestic Automotive UK, Europe and further

Product mix

Rigid 12-22 Layer Miscellaneous PTH PTH Flexible Flexi-Rigid Rigid 4-10 Layer

Examples

Military

49,500 holes 10 levels blind / buried Reinforced polyimide Reinforced polyimide Tg 260 deg C 4 oz copper Controlled depth rout

Aerospace

D/S Flexi 50 micron blind laser drilled vias

in 125 micron pads

Examples (cont)

in 125 micron pads

Super finish (Ni / Pd / Au) Flexible solder resist 90 micron track / gap

Medical

Implant - 2mm x 1mm laser routed 4 layer rigid, 2 x blind

Examples (cont)

4 layer rigid, 2 x blind vias Inserted into capsule, then swallowed 4 layer F/R Flexible O/L Track height 18 microns 100 micron track / gap to +/- 6 microns Adhesiveless flexi Track pitch to +/- 12 microns

Telecoms

Edge plated fingers

Microwave - PTFE alternatives

All laser drilled and LDI 4 layer, 1-2, 2-3, 3-4, 1-4 drilling All laser drilled

Examples (cont)

All laser drilled and LDI.6 layer. 1-2, 2-3, 3-4, 4-5, 5-6, 1-6 drilling

Security

25 micron PTHs in 50 micron tracks with 50 micron gaps

Examples (cont)

Examples (cont)

Entertainment

6 layer Flexi - Rigid

Photogragh reproduced kind permission of Active Silicon www.activesilicon.co.uk who specialise in the design, manufacture and supply of specialist digital imaging products and technologies

Research

6 layer stepped flexible with 1-2, 2-3, 3-4, 4-5, 5-6, 1-6 drilling

Examples (cont)

Others

Stepped boards Flying leads

Metal backed PTFE

Special Equipment

• 4 x Laser drill - UV YAG
• 2 x Laser Direct Image (LDI) – 2 mil Track / Gap and Solder Resist
• Auto-align outer layer & solder resist printers
• Vacuum and High Temp bonding presses for PTFE
• Specialist routers (Tru-Lon) for thick metal backing (Brass, Copper,

Aluminium)

• Post etch punches and X-ray drill
• Post etch punches and X-ray drill
• Permanganate and Plasma desmear / clean
• Vacuum laminator
• Multi-seat Perfectest for layer registration data
• Ink jet printer for serialisation / legend
• Resin fill machine
• Polar TDR Impedance measurement
• Struers microesectioning system (auto-profiling and sectioning)

Special Software

Genesis 2000 CAM stations (10 licences) InCAM (5 licences) – latest State of the Art CAM software Softwires PCP 2000 CIM system dedicated to PCB manufacture Lab Wizard for chemical analysis Lab Wizard for chemical analysis Track Pro for calibration Pirana for maintenance In-house software for Capacity Planning Polar SI 8000 (Impedance modelling) InStack (Simultaneous Impedance and Build-up modelling) Q-Pulse for document control

Genesis 2000 CAM

Controlled Impedance

Laser drill

ESI 5200 UV YAG

Laser drill microsections

• All laser drilled into

reinforced polyimide

Blind vias Buried via PTH

Laser drill techniques

Illustrations (c) 2004 Electro Scientific Industries, www.esi.com, used with permission.

Blind holes

Stage 1 Stage 2

Through holes

Laser drill SEMs

Photos (c) 2004 Electro Scientific Industries, www.esi.com, used with permission.

Laser direct imaging (LDI)

Orbotech

Outer Layer and Solder Resist exposure

Bacher - auto registration

Visper Automatic Final Inspection machine

Class 10,000 clean room (Feb 2011)

Materials

Woven Glass Reinforced (Rigid)

Standard FR4 (Tg 135°C) incl. Halogen free FR4 suitable for lead-free assembly

High Tg FR4

High Tg FR4

• Withstands higher temperatures (Tg 175°C and

210ºC)

Stablcor

• Low CTE in X/Y, low weight, high stiffness, high

thermal conductivity

Polyimide

• High Tg of 260 °C, low TCE (z), low Df

Materials

Suitable for lead-free assembly could be:

>Tg 150°C (Standard FR4 is 135°C) >Td 330 °C (Standard FR4 is 300°C) >Td 330 °C (Standard FR4 is 300°C) >T260 15minutes (Standard FR4 is 4

mins)

IPC define as IPC 4101B/99, 101, 121,

124, 126, 129

Materials (IPC defined for lead-free)

IPC IPC IPC IPC-

• 4101B

4101B 4101B 4101B 99 99 99 99 101 101 101 101 121 121 121 121 124 124 124 124 126 126 126 126 129 129 129 129

ANSI ANSI ANSI ANSI FR4 FR4 FR4 FR4 FR4 FR4 Fillers > 5% Fillers > 5% Fillers > 5% Fillers > 5% Yes Yes N/A N/A Yes N/A Tg Tg Tg Tg >150°C >110°C >110°C >150°C >170°C >170°C Td Td Td Td >325°C >310°C >310°C >325°C >340°C >340°C CTE 50 CTE 50 CTE 50 CTE 50-

• 260

260 260 260° ° ° °C C C C <3,5% <4% <4% <3,5% <3,0% <3,0% T260 T260 T260 T260 >30min >30min >30min >30min >30min >30min T288 T288 T288 T288 >10min >5min >5min >10min >15min >15min

Materials (cont)

Random Aramid Reinforcment (Rigid)

Epoxy or polyimide based Easily laser ablatable Easily laser ablatable Improved, repeatable dimensional stability Ideal for sequential build up (SBU)

Resin only

e.g. RCC (Resin Coated Copper) ideal for laser drilling outer layers must be attached to a rigid core

Materials (cont)

High frequency applications

PTFE

• Optimum frequency range 1-90 GHz
• Optimum frequency range 1-90 GHz
• Low Dk ~ 2.3
• Low Df ~ 0.001
• Metal backed

PTFE alternatives

• Optimum frequency range 100MHz - 15GHz
• Dk ~ 3.38 / 3.48
• Df ~ 0.0022 / 0.004

Materials (cont)

Flexible

Polyimide (Kapton™) base and coverlays Epoxy, acryllic, pure polyimide adhesives Epoxy, acryllic, pure polyimide adhesives Single, double sided and multilayer structures Thin and low weight

Materials (cont)

Copper

2µm - 140µm copper thickness Can be used for electrical and thermal Can be used for electrical and thermal

conductivity

Thick copper can be used for rigidity if placed

near outer layers

Copper / Invar / Copper (used for restraining

purposes for TCE matching)

Materials (cont)

New generation laminates

Hole filling pre-preg with High Tg Enhanced Epoxy for Tg > 210 deg C Enhanced Epoxy for Tg > 210 deg C SI glass for optimum signal integrity and

precise impedance

We are constantly examining new materials

with our suppliers, who are always prepared to discuss further requirements with our customers

Board types / technologies

• M/L up to 24 layers (releasable to BS123000 series)
• Sequentially built and Stepped boards
• Flexi and flexi rigid
• Exotic materials e.g. metal backed PTFE (Copper, Aluminium, Brass)
• Buried Resistors using Ohmega-Ply(+/- 15% std, +/-10% special)
• Buried Capacitors using 3M’s licence free material
• Buried vias (mechanically or laser drilled)
• Buried vias (mechanically or laser drilled)
• Blind vias (mechanically or laser drilled)
• Copper filled blind microvias
• Microvias (< 0.15mm diameter)
• Resin filled through vias
• Laser profiling
• Controlled Impedance (+/- 10% std, +/- 5% special)
• Edge plated fingers and plated 1/2 holes
• Variety of finishes
• Embedded fibre optics

Research and Development

Dedicated Process Engineering Dept. Optical Waveguides Stretchable PCBs Stretchable PCBs Embedded components

Processes available

Metalisation by Direct Plate (Shadow) or Electroless Electrolytic copper plate by Pulse or DC plating Finishes:

Ni / Au Ni / Au Immersion Tin HASL (leaded and unleaded subcontract) Ni / Pd / Au (sub-contract) Tin / Lead Silver Electroplated Hard and Soft Gold

Processes available (cont)

Spray coat green, red and blue solder resist plus other colours available by screen printing Flexible coverlay Laser routed sheet polyimide (or post ablate) Photoimageable flexible solder resist (brown, black, white) Photoimageable flexible solder resist (brown, black, white) Photoimageable dry film Extensive conveyorised lines and auto load / unload machines to “de-skill” processes Laser structuring (copper pattern and solder resist) Complete Engineering back-up from product conception to post delivery

Resin filled vias

Copper filled vias

Copper filled vias Example with stacked vias

Design Rules and Structures

3 mil track / gap if plated (2 mil track and gap as special) 2 mil track / gap if unplated 2 mil registration solder resist to copper pattern 3 mil minimum webbing solder resist 3 mil minimum webbing solder resist 6 mil PTH to copper track / plane 16:1 aspect ratio for PTHs (Thickness : Finished Hole Size) 1:1 aspect ratio for blind holes (Thickness : FHS) Buried resistors (+/- 15% std, +/-10% special or in parallel) Controlled Impedance (+/- 10% std, +/- 5% special)

Copper feature to be at least

Layer

0.175mm away from drilled hole

1 Track (75 micron) 2 3 4 5

Standard PTH technology

6 7 8

Pad size at least 0.20mm bigger than drilled hole Drilled hole diameter 0.15mm minimum. Finished Hole Size (FHS) 0.1mm less. Aspect ratio (thickness : FHS) 16:1 maximum.

PTH Laser drilled blind vias 1-2, 7-8

Layer

Capture pad size to be at least 0.20mm more than drilled hole Target pads can be 0.2mm diameter

1

for 0.1mm hole

2 3 4

Laser drilled blind vias

5 6 7 8

Target pad size to be at least 0.1mm more than drilled hole Laser vias can exit to surface mount pads

• n outer layers, with very little solder loss.

Drill diameter 0.025mm - 0.2mm (0.1mm - 0.15mm typical) Aspect ratio 1:1 max after plating

PTH Buried vias 2-3, 6-7

Layer

Pad size to be at least 0.25mm more than drilled hole

1 2 3 4

Buried vias

5 6 7 8

Drilled hole diameter 0.025 - 0.2mm Can be laser drilled Aspect ratio 16:1 maximum

L aser b l in d seq u e n t ial b o n d

Buried PTH Laser drilled blind hole 1-2, 7-8 (resin filled) as described earlier

Layer 1 2 3 4

Buried PTH Laser drilled blind hole 1-2, 7-8 (resin filled) as described earlier

Layer 1 2 3 4 5

Laser blind sequential bond

4 5 6 7 8

PTHs from 1-8 are optional. If not required, outer layers can contain only surface mount pads All vias must exit to pads, so 2-7 holes must have pads on 2 and 7

6 7 8

PTHs from 1-8 are optional. If not required, outer layers can contain only surface mount pads All vias must exit to pads, so 2-7 holes must have pads on 2 and 7

PTH Blind vias 1-4, 5-8

Layer 1 2 3 4 5

Blind sequential bond

5 6 7 8

"Double multilayer" with blind holes filling and plating over All vias must exit to pads, so 1-4 and 5-8 holes must have pads on 4 and 5

Double laser blind sequential (2 bonds):

Buried PTH Laser drilled blind holes 1-2, 2-3, 6-7, 7-8

Layer 1 2 3 4 5 6 7 8

D o u b l e l aser b l in d seq u en t ia l

Buried PTH Laser drilled blind holes 1-2, 2-3, 6-7, 7-8

Layer 1 2 3 4

Buried PTH Laser drilled blind holes 1-2, 2-3, 6-7, 7-8

Layer 1 2 3 4

Double laser blind sequential (3 bonds)

4 5 6 7 8

Etc………

5 6 7 8

Etc………

1 ) L amin a t e as s u p pl ied b y man u f ac t u r er

Copper FR4 Copper

How a PCB is made…..

2 ) C o a t l a min at e w it h p h o t o r e s is t

Photoresist Copper FR4 Copper Photoresist

3 ) Pin t o o l e d n e g a t iv e in n e r l a y e r f il m

Film Photoresist Copper FR4 Copper Photoresist Film What is clear will end up copper e.g. pads and tracks

4 ) Ex p o s e w it h U V l ig h t

Film Photoresist Copper FR4 Copper Photoresist Film

5 ) R e mo v e f il m a n d d e v e l o p

• f f u n e x p o s e d r e s is t

Photoresist Copper FR4 Copper Photoresist

6 ) Et c h o f f c o p p er n o t p r o t e c t e d b y r e s is t

Photoresist Copper FR4 Copper Photoresist

7 ) St r ip o f f p h o t o r e s is t

Copper FR4 Copper ….. to get an etched inner layer pair e.g. layers 2/3

8 ) B o n d l ay e r s t o f o r m 6 l a y er b o ar d

Copper foil 1 Pre-preg Copper 2 Laminate Copper 3 Pre-preg Copper 4 Laminate Copper 5 Pre-preg Copper foil 6 Full copper foil on outer layers

9) Drill and Permanganate Desmear

Copper foil 1 Pre-preg Copper 2 Laminate Copper 3 Pre-preg Copper 4 Laminate Copper 5 Pre-preg Copper foil 6

1 0 ) D ir ec t me t al is at io n pr o c e s s

Copper foil 1 Pre-preg Copper 2 Laminate Copper 3 Pre-preg Copper 4 Laminate Copper 5 Pre-preg Copper foil 6 Conductive graphite added (only remains on non copper)

1 1 ) C o at w it h p h o t o r es is t

Photoresist Copper foil 1 Pre-preg Copper 2 Laminate Copper 3 Pre-preg Copper 4 Laminate Copper 5 Pre-preg Copper foil 6 Photoresist

1 2 ) Pin t o o l e d p o s it iv e o u t e r l a y e r f il m

Film Photoresist Copper foil 1 Pre-preg Copper 2 Laminate Copper 3 Pre-preg Copper 4 Laminate Copper 5 Pre-preg Copper foil 6 Photoresist Film What is black will end up copper e.g. pads and tracks

1 3 ) Ex p o s e w it h U V l ig h t

Film Photoresist Copper foil 1 Pre-preg Copper 2 Laminate Copper 3 Pre-preg Copper 4 Laminate Copper 5 Pre-preg Copper foil 6 Photoresist Film

1 4 ) R e mo v e f il m a n d d e v e l o p

• f f u n e x p o s e d r e s is t

Photoresist Copper foil 1 Pre-preg Copper 2 Laminate Copper 3 Pre-preg Copper 4 Laminate Copper 5 Pre-preg Copper foil 6 Photoresist

1 5 ) El ec t r o p l at e c o pp er a n d t in

Plated tin Plated copper Copper foil 1 Pre-preg Copper 2 Laminate Copper 3 Pre-preg Copper 4 Laminate Copper 5 Pre-preg Copper foil 6 Plated copper Plated tin

1 6 ) St r ip o f f p h o t o r es is t

Plated copper Copper foil 1 Pre-preg Copper 2 Laminate Copper 3 Pre-preg Copper 4 Laminate Copper 5 Pre-preg Copper foil 6 Plated copper

1 7 ) Et c h a w a y c o p p e r n o t p r o t e c t e d b y t in

Plated copper Copper foil 1 Pre-preg Copper 2 Laminate Copper 3 Pre-preg Copper 4 Laminate Copper 5 Pre-preg Copper foil 6 Plated copper

1 8 ) St r ip t in

Plated copper Copper foil 1 Pre-preg Copper 2 Laminate Copper 3 Pre-preg Copper 4 Laminate Copper 5 Pre-preg Copper foil 6 Plated copper ….. and we have a working PCB!

1 9 ) C o a t w it h s o l d e r r e s is t

Solder resist Copper 1 Pre-preg Copper 2 Laminate Copper 3 Pre-preg Copper 4 Laminate Copper 5 Pre-preg Copper 6 Solder resist

2 0 ) Pin t o o l e d p o s it iv e s o l d e r r e s is t f il m

Film Solder resist Copper 1 Pre-preg Copper 2 Laminate Copper 3 Pre-preg Copper 4 Laminate Copper 5 Pre-preg Copper 6 Solder resist Film

2 1 ) Ex p o s e w it h U V l ig h t

Film Solder resist Copper 1 Pre-preg Copper 2 Laminate Copper 3 Pre-preg Copper 4 Laminate Copper 5 Pre-preg Copper 6 Solder resist Film

2 2 ) R e mo v e f il m a n d d e v e l o p

• f f u n e x p o s e d r e s is t

Solder resist Copper 1 Pre-preg Copper 2 Laminate Copper 3 Pre-preg Copper 4 Laminate Copper 5 Pre-preg Copper 6 Solder resist

2 3 ) A d d f in is h (e.g . N i / A u ) t o e x po s ed c o pp er

Surface mount pad Nickel / Gold Solder resist Copper 1 Pre-preg Copper 2 Laminate Copper 3 Copper 3 Pre-preg Copper 4 Laminate Copper 5 Pre-preg Copper 6 Solder resist Leaded component pad / via

Thank you for the interest shown

For further information please: Visit our website www.stevenagecircuits.co.uk Email: Email:

sales@stevenagecircuits.co.uk info@tru-lon.co.uk

Phone:

01438 751800 (Stevenage Circuits) 01763 248922 (Tru-Lon)