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The Design of SNAP2
National ASIC Design Engineering Center, Institute
- f Automation, Chinese Academy of Sciences
Presenter: Qiuxiang Fan Email: qiuxiang.fan@ia.ac.cn
The Design of SNAP2 National ASIC Design Engineering Center, - - PowerPoint PPT Presentation
The Design of SNAP2 National ASIC Design Engineering Center, Institute of Automation, Chinese Academy of Sciences Presenter: Qiuxiang Fan Email: qiuxiang.fan@ia.ac.cn 1 Outline Introduction Powerful FPGA High-Speed Interface
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Presenter: Qiuxiang Fan Email: qiuxiang.fan@ia.ac.cn
45 connectors
connector
45 connectors
connector
SIZE:233X160mm (6U standard) SIZE:233X160mm (6U standard)
Mechanical Dimension of Snap2 Mechanical Dimension of Snap2
KU115:
transceiver bandwith
count
chip memory available
pairs(Differential pairs<=2mil,Relative propagation delay<=10mil, )
rate)
(1)ADC1x3200-12 (2)ADC1x5000-10 (3)ADC8x250-8 (4)ADC8x250-14 (1)ADC1x3200-12 (2)ADC1x5000-10 (3)ADC8x250-8 (4)ADC8x250-14
(2)DAC1x5500-12 (1)2x40GE module
FPGA and Zynq Configuration The configuration circuit of Snap2 system is highly flexible: 1.User can configure the FPGA and Zynq through JTAG respectively for development and debug; 2.Both FPGA and Zynq have a Quad SPI flash for configuration. After power up, FPGA and Zynq can load or boot themselves automatically from Quad SPI flash; 3.User can reconfigure FPGA through the Ethernet port connected to FPGA; 4.User can reconfigure Zynq through the Ethernet port connected to Zynq; 5.Zynq can configure FPGA through the SelectMAP interface of FPGA.
1)Zynq as system controller Flexible work mode:
through SPI bus
2) Microblaze as system controller
FFT FFT Correlator Correlator PFB PFB
System bootload control System bootload control High speed Interface Information High speed Interface Information Power voltage & Current information Power voltage & Current information Board temperature information Board temperature information Original AD data display Original AD data display
FPGA
are from SMA connectors
160mm X 2mm
system controller
2IFHGA2104 is used for high-speed
interconnect : compatibility with Virtex UltraScale+ XCVU9P- 2IFLGA2104
Jie Hao Jingbin Mu Yafang Song Yuting Li Leichen Zhou Lin Shu Hui Feng Dou Wang Chengcheng Li Qiuxiang Fan Zhifeng Lv Sai Ma Meiting Zhao Liangtian Zhao
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Email: qiuxiang.fan@ia.ac.cn