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4. MOS: Device Operation and Large Signal Model Lecture notes: - - PowerPoint PPT Presentation

4. MOS: Device Operation and Large Signal Model Lecture notes: Sec. 4 Sedra & Smith (6 th Ed): Sec. 5.1-5.3 Sedra & Smith (5 th Ed): Sec. 4.1-4.3 ECE 65, Winter2013, F. Najmabadi Operational Basis of a Field-Effect Transistor (1)


slide-1
SLIDE 1
  • 4. MOS: Device Operation and

Large Signal Model

Lecture notes: Sec. 4 Sedra & Smith (6th Ed): Sec. 5.1-5.3 Sedra & Smith (5th Ed): Sec. 4.1-4.3

ECE 65, Winter2013, F. Najmabadi

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SLIDE 2

Operational Basis of a Field-Effect Transistor (1)

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (2/29)

P-type semiconductor Insulator Metal Dopent ions Holes (majority carries)

Consider the hypothetical semiconductor below: (constructed similar to a parallel plate capacitor)

Electrical contact

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SLIDE 3

Operational Basis of a Field-Effect Transistor (2)

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (3/29)
  • If we apply a voltage v1 between electrodes, a

charge Q = C v1 will appear on each capacitor plate.

  • The electric field is strongest at the interface with the

insulator and charge likes to accumulate there.

  • Holes are pushed away from the insulator

interface forming a “depletion region”.

  • Depth of depletion region increases with v1.

Depletion Region (no majority carrier)

  • If we increase v1 above a threshold value (Vt),

the electric field is strong enough to “pull” free electrons to the insulator interface. As the holes are repelled in this region, a “channel” is formed which contains electrons in the conduction band (“inversion layer”).

  • Inversion layer is a “virtual” n-type material.

Depletion Region (no majority carrier)

Inversion layer (“channel”)

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SLIDE 4

Operational Basis of a Field-Effect Transistor (3)

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (4/29)

With inversion layer (v1 > Vt):

  • A current will flow in the channel
  • Current will be proportional to electron

charge in the channel or (v1 − Vt )

  • Magnitude of Current i2 is controlled by

voltage v1 (a Transistor!)

  • We apply a voltage across the p-type semiconductor:

(Assume current flows only in the n-type material, ignore current flowing in the p-type semiconductor)

No inversion layer (v1 < Vt):

  • No current will flow
slide-5
SLIDE 5

Operational Basis of a Field-Effect Transistor (4)

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (5/29)
  • We need to eliminate currents flowing in the p-type, i.e.,

current flows only in the “channel” which is a virtual n-type.

  • Body-source and body-drain junctions should always be in reverse bias for FET to work!
  • Make n-type material terminals (set up diodes between terminals & p-type “body”)
  • Heavy doping of the n-type terminals provides a source of free electrons for the channel.
  • Make insulator layer as thin as possible to increase the electric field.
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SLIDE 6

Channel width (L) is the smallest feature on the chip surface

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (6/29)

MOSFET implementation on a chip MOSFET “cartoons” for deriving MOSFET characteristics MOSFET (or MOS): Metal-oxide field-effect transistor NMOS: n-channel enhancement MOS

slide-7
SLIDE 7

NMOS i-v Characteristics (1)

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (7/29)
  • To ensure that body-source and body-drain junctions are reversed bias, we

assume that Body and Source are connected to each other and vDS ≥ 0.

  • We will re-examine this assumption later
  • Without a channel, no current flows (“Cut-off”).
  • For vGS > Vtn, a channel is formed. The total

charge in the channel is ) SiO (for F/m 10 45 . 3 9 . 3 insulator

  • f

y permitivit : insulator

  • f

Thickness : area unit per e Capacitanc : ) (

2 11 −

× = = = = = = ε ε ε ε

  • x
  • x
  • x
  • x
  • x
  • x
  • x

tn GS

  • x

t t C L W C C

  • V

v WL C CV |Q|

Overdrive Voltage: VOV = vGS –Vtn

slide-8
SLIDE 8

NMOS i-v Characteristics (2)

  • vGS > Vtn A channel is formed
  • Apply a small vDS between drain & source.
  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (8/29)
  • A current flows due to the “drift” of electrons

in the n-channel:

DS OV

  • x

n D DS tn GS

  • x

n D

v V L W C i v V v L W C i ) ( µ µ = − = For small vDS, MOS acts as a resistance with its conductivity controlled by VOV (or vGS). V L W C g v g i

OV

  • x

n DS DS DS D

with µ = =

slide-9
SLIDE 9

NMOS i-v Characteristics (4)

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (9/29)
  • When vDS is increased the channel becomes narrower

near the drain (local depth of the channel depends on the difference between VG and local voltage).

Triode Mode

[ ]

2

5 .

DS DS OV

  • x

n D

v v V L W C i − = µ

  • When vDS is increased further such that vDS = VOV ,

the channel depth becomes zero at the drain (Channel “pinched off”).

  • When vDS is increased further, vDS > VOV , the

location of channel pinch-off remains close to the drain and iD remains approximately constant.

Saturation Mode

2

5 .

OV

  • x

n D

V L W C i µ =

slide-10
SLIDE 10

NMOS i-v Characteristics (5)

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (10/29)

For a given vGS (or VOV)

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SLIDE 11

NMOS i-v Characteristics Plot (1)

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (11/29)
  • NMOS i-v characteristics is a surface

* Plot for Vt,n = 1 V and µnCox (W/L) = 2.0 mA/V2

) , (

DS GS D

v v f i =

slide-12
SLIDE 12

NMOS i-v Characteristics Plot (2)

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (12/29)

Looking at surface with vGS axis pointing out of the paper* *Note: surface was truncated (i.e., vGS < 5 V)

slide-13
SLIDE 13

NMOS i-v Characteristics Plot (3)

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (13/29)
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SLIDE 14

Channel-Width Modulation

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (14/29)
  • The expression we derived for saturation region

assumed that the pinch-off point remains at the drain and thus iD remains constant.

  • In reality, the pinch-off point moves “slightly”

away from the drain: Channel-width Modulation

( )

A DS OV

  • x

n D

V v V L W C i / 1 1 5 .

2

= + = λ λ µ

slide-15
SLIDE 15

Body Effect

  • Recall that Drain-Body and Source-Body diodes should be reversed biased.
  • We assumed that Source is connected to the body (vSB = 0) and vDS = vDB > 0
  • In a chip (same body for all NMOS), it is impossible to connect all sources

to the body (all NMOS sources are connected together.

  • Thus, the body (for NMOS) is connected to the largest negative voltage

(negative terminal of the power supply).

  • Doing so, changes the threshold voltage (called “Body Effect”)
  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (15/29)

( )

| 2 | | 2 |

, F SB F tn tn

V V V φ φ γ − + + =

  • In this course we will ignore body effect as well as other second-
  • rder effects such as velocity saturation.
slide-16
SLIDE 16

P-channel Enhancement MOS (PMOS)

  • A PMOS can be constructed analogous to an NMOS: (n-type body), heavily

doped p-type source and drain.

  • A virtual “p-type” channel is formed in a P-MOS (holes are carriers in the

channel) by applying a negative vGS.

  • i-v characteristic equations of a PMOS is similar to the NMOS with the

exception:

  • Voltages are negative (we switch the terminals to have positive voltages: use

vSG instead of vGS ).

  • Use mobility of holes, µp , instead of µn in the expression for iD
  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (16/29)
slide-17
SLIDE 17

MOS Circuit symbols and conventions

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (17/29)

PMOS NMOS

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SLIDE 18

MOS i-v Characteristics Equations

NMOS (VOV = vGS – Vtn)

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (18/29)

[ ]

[ ]

DS OV

  • x

n D OV DS OV DS DS OV

  • x

n D OV DS OV D OV

v V L W C i V v V v v V L W C i V v V i V λ µ µ + = ≥ ≥ − = ≤ ≥ = ≤ 1 5 . and : Saturation 2 5 . and : Triode : Off

  • Cut

2 2

PMOS (VOV = vSG – |Vtp|)*

[ ]

[ ]

SD OV

  • x

p D OV SD OV SD SD OV

  • x

p D OV SD OV D OV

v V L W C i V v V v v V L W C i V v V i V λ µ µ + = ≥ ≥ − = ≤ ≥ = ≤ 1 5 . and : Saturation 2 5 . and : Triode : Off

  • Cut

2 2

*Note: S&S defines |VOV |= vSG – |Vtp| and uses |VOV |in the PMOS formulas.

slide-19
SLIDE 19

MOS operation is “Conceptually” similar to a BJT -- iD & vDS are controlled by vGS

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (19/29)

Controller part: Circuit connected to GS sets vGS (or VOV ) Controlled part: iD & vDS are set by transistor state (&

  • utside circuit)
  • A similar solution method to BJT:
  • Write down GS-KVL and DS-KVL, assume MOS is in a particular state, solve

with the corresponding MOS equation and validate the assumption.

  • MOS circuits are simpler to solve because iG = 0 !
  • However, we get a quadratic equation to solve if MOS in triode (check MOS in

saturation first!)

slide-20
SLIDE 20
  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (20/29)

Example 1: In the circuit below, RD = 1 k, and VDD = 12 V. Compute vo for vi = 0, 6, and 12 V. (µnCox (W/L) = 0.5 mA/V2 , Vt = 2 V, and λ = 0 )

DS D DS D D DD GS i

v i v i R V v v + = + = = = 10 12 : KVL

  • DS

: KVL

  • GS

3

V 12 10 12 : KVL

  • DS
  • ff
  • Cut

V 2 : KVL

  • GS

3

= = → + × = = → → = < = =

DS

  • DS

D t GS i

v v v i V v v correct Assumption V 4 V . 8 V . 8 10 4 10 12 : KVL

  • DS

mA . 4 4 10 5 . 5 . 5 . V 4 : Saturation Assume

3 3 2 3 2

→ = > = = = → + × × = = × × × = = = ≥

− − OV DS DS

  • DS

OV

  • x

n D OV DS

V v v v v V L W C i V v µ

Part 1: vi = 0

V 4

  • ff
  • Cut

in Not V 2 6 : KVL GS = − = → = > = = −

t GS OV t GS i

V v V V v v

Part 2: vi = 6 V

  • DS

v v =

slide-21
SLIDE 21
  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (21/29)

Example 1: In the circuit below, RD = 1 k, and VDD = 12 V. Compute vo for vi = 0, 6, and 12 V. (µnCox (W/L) = 0.5 mA/V2 , Vt = 2 V, and λ = 0 )

DS D DS D D DD GS i

v i v i R V v v + = + = = = 10 12 : KVL

  • DS

: KVL

  • GS

3

incorrect Assumption V 10 V 13 V . 13 10 . 25 10 12 : KVL

  • DS

mA . 25 10 10 5 . 5 . 5 . V 10 : Saturation Assume

3 3 2 3 2

→ = > − = − = → + × × = = × × × = = = ≥

− − OV DS DS DS OV

  • x

n D OV DS

V v v v V L W C i V v µ V 10

  • ff
  • Cut

in Not V 2 12 : KVL

  • GS

= − = → = > = =

t GS OV t GS i

V v V V v v

Part 3: vi = 12 V

  • DS

v v =

slide-22
SLIDE 22
  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (22/29)

Example 1: In the circuit below, RD = 1 k, and VDD = 12 V. Compute vo for vi = 0, 6, and 12 V. (µnCox (W/L) = 0.5 mA/V2 , Vt = 2 V, and λ = 0 )

DS D DS D D DD GS i

v i v i R V v v + = + = = = 10 12 : KVL

  • DS

: KVL

  • GS

3

  • DS

v v =

[ ]

48 24 ] 20 [ 10 5 . 5 . 10 12 10 12 : KVL

  • DS

2 5 . V 10 : Triode Assume

2 2 3

  • 3

3 2

= + − + − × × × × = + × = − = = <

DS DS DS DS DS DS D DS DS OV

  • x

n D OV DS

v v v v v v i v v V L W C i V v µ V 10 = − =

t GS OV

V v V

Part 3 (cont’d): vi = 12 V

mA 8 . 9 10 12 V 10 V 2 . 2 ) (incorrect 10 V 8 . 21

3

= → + × = = < = = = > = =

D DS D OV DS

  • OV

DS

  • i

v i V v v V v v

slide-23
SLIDE 23

NMOS Transfer Function (1)

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (23/29)

vi can be applied directly to MOS There is no need for a RG . Circuit Equations:

  • vGS = vi
  • NMOS iv characteristics: iD = f (vGS , vDS )
  • KVL:

vo = vDS = VDD − RD iD

slide-24
SLIDE 24

NMOS Transfer Function (2)

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (24/29)

2) Just to the right of point A:

  • VOV = vGS − Vt is small, so iD

is small.

  • vDS = VDD − RD iD is close to VDD
  • Thus, vDS > VOV and NMOS is in

saturation. 1) For vGS < Vt , NMOS is in cutoff: iD = 0 & vDS = VDD − RD iD = VDD

slide-25
SLIDE 25

NMOS Transfer Function (2)

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (25/29)

3) As vGS increases:

  • VOV = vGS − Vt and iD become larger;
  • vDS = VDD − RD iD becomes smaller.
  • At point B, vDS = VOV

4) To the right of point B, vDS < VOV = vGS − Vt and NMOS enters triode. Point B is called the “Edge of Saturation”

slide-26
SLIDE 26

NMOS Transfer Function (2)

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (26/29)

2) Just to the right of point A:

  • VOV = vGS − Vt is small, so iD

is small.

  • vDS = VDD − RD iD is close to VDD
  • Thus, vDS > VOV and NMOS is in

saturation.

3) As vGS increases:

  • VOV = vGS − Vt and iD become larger;
  • vDS = VDD − RD iD becomes smaller.
  • At point B, vDS = VOV

1) For vGS < Vt , NMOS is in cutoff: iD = 0 & vDS = VDD − RD iD = VDD 4) To the right of point B, vDS < VOV = vGS − Vt and NMOS enters triode. Point B is called the “Edge of Saturation”

slide-27
SLIDE 27

Graphical analysis of NMOS Transfer Function (1)

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (27/29)
  • KVL equation is a plane in this space.
  • Intersection of KVL plane with the iv

characteristics surface is a line.

  • NMOS operating point is on this line

(depending on the value of vGS.)

DS D D DD DS GS D

v i R V v v f i i-v + = = : KVL ) , ( : sitics Characteri NMOS

  • If we look from the bottom (iD

axis out of the paper), we can see the transfer function.

slide-28
SLIDE 28

Graphical analysis of NMOS Transfer Function (2)

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (28/29)
  • Every point on the load line

corresponds to a specific vGS value.

  • As vGS increases, NMOS

moves “up” the load line.

Looking from the bottom Looking parallel to vGS axis

slide-29
SLIDE 29

NMOS Functional circuits

  • F. Najmabadi, ECE65, Winter 2013, Intro to MOS (29/29)
  • Similar to a BJTs in the active mode,

NMOS behaves rather “linearly” in the saturation region (we discuss NMOS amplifiers later)

  • Transition from cut-off to triode can

be used to build NMOS switch circuits.

  • Voltage at point C (see graph)

depends on NMOS parameters and the circuit (in BJT vo = Vsat)!

  • We can also built NMOS logic gate

similar to a RTL. But there is are much better gates based on CMOS technology!