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Semiconductor Detectors Stefan Heindl and Martin Printz KSETA Doctoral Researchers Workshop, Lauterbad, 17.10.2013 Institut fr Experimentelle Kernphysik KIT University of the State of Baden-Wuerttemberg and www.kit.edu National Research

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KIT – University of the State of Baden-Wuerttemberg and National Research Center of the Helmholtz Association

Institut für Experimentelle Kernphysik www.kit.edu

Semiconductor Detectors

Stefan Heindl and Martin Printz KSETA Doctoral Researchers Workshop, Lauterbad, 17.10.2013

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  • S. Heindl, M. Printz – Semiconductor Detectors

Institut für Experimentelle Kernphysik

Large Hadron Collider (LHC)

Proton Proton collisions @ 8 TeV Four experiments: ATLAS, CMS, ALICE and LHCb

Jura Genf 100 m 9 km

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Compact Muon Solenoid (CMS)

+z

Interaction point Beam axis

Myon detectors in magnet yoke Tracker: Determination of trajectories Superconducting coil (3,8 T): Deflection of charged particles Calorimeters: Determination of energies

21 m long, 16 m high, 12500 t

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Silicon Tracker – The Heart of CMS

200m2 of silicon-only Tracker with pixel and strip sensors provide up to 13 track points for Momentum determination Charge assignment Vertex reconstruction

2.4m

Si sensors FE electronics Carbon fibre support Power + Data

TEC Module

10x20cm2

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Higgs candidate ZZ event (@ 8 TeV) with 2 µ and 2 e

Why?

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Why?

CMS collaboration has 3500 members Physicists, PhD students, engineers, technicians and administrative staff Working together for one goal: Nobel Prize 2013 for F. Englert and P. Higgs: Higgs boson discovered by ATLAS and CMS collaborations at CERN “So that I may perceive whatever holds The world together in its inmost folds”

(Goethe, Faust 1)

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  • S. Heindl, M. Printz – Semiconductor Detectors

Institut für Experimentelle Kernphysik

LHC planning

Future of LHC: Two planned upgrades for all LHC experiments At CMS: Phase 1: Exchange of pixeldetector, new readout for calorimeters, … Phase 2: Exchange of complete silicon tracker, new L1 trigger system, extension of myon system, …

Phase 1 Phase 2

LS 1 LS 2 LS 3

1*1034 8*1033 2*1034 >8*1034

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Institut für Experimentelle Kernphysik

Silicon Sensor

Depletion zone (at pn-junction) created by application of reverse bias voltage Traversing charged particles create electron-hole pairs e-h pairs are separated by electric field Drifting charge induces signal on AC coupled strips Readout electronics wire bonded to strips Working Principle

SiO2

Mini strip test sensor (2.5x3.5cm2)

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Institut für Experimentelle Kernphysik

Silicon Strip Sensor

Layout:

  • F. Hartmann, Evolution of Silicon Sensor Technology

in Particle Detectors, Springer 2008

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PHASE II: UPGRADE OF THE CMS TRACKER

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Institut für Experimentelle Kernphysik

Phase II Upgrade – Why Upgrade?

Tracker lifetime designed for runtime of the LHC Upgrade of the LHC: HL-LHC (2022) Higher Luminosity (particles / area / time) ~100 primary vertices / 40MHz Requirements Radiation hard sensors (increase of fluence) Thinner sensors (less radiation length) High granularity and trigger contribution LHC HL-LHC

New Tracker necessary for upgraded LHC!

[1] Pixel: Casse et al. 2008 [2] Strips: Rohe et al. 2005 [DOI 10.1016/j.nima.2009.01.196]

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CMS High Pileup Run 2012: 78 reconstructed vertices

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Sensor R&D Activities

Campaign within CMS Tracker Collaboration (total 17 institutes) Radiation hardness study of different silicon base materials: Floatzone (FZ), Magnetic Czochralski (MCz) and Epitaxial (Epi) Different bulk doping: p- and n-type Different thicknesses: e.g. 200 and 320 µm 164 wafers with identical layout from one vendor (Hamamatsu)

Diodes Test structures Pixel sensors Geometry variations Strip sensors

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Sensor R&D Activities

Layout example: 6“ „ITE wafer“, completely designed inhouse Foundry: ITE Warsaw

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Sensor R&D Activities

Layout example: 6“ „ITE wafer“, completely designed inhouse Foundry: ITE Warsaw

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Institut für Experimentelle Kernphysik

Sensor R&D Activities

Reason for sensor degradation: Defects Radiation damage introduces defects in the silicon crystal Increase of leakage current (a) Generation of space charge: increase of depletion voltage (b) Trapping of charge carriers: reduction of signal and collected charge (c)

Vacancy and interstitial atom

(a) (b) (c)

Energy-band model

  • f silicon
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Institut für Experimentelle Kernphysik

Irradiation

Intentional irradiation of sensors Five different fluences chosen corresponding to five Tracker radii Protons and neutrons Proton irradiation at Zyklotron AG, Karlsruhe Neutron irradiation at TRIGA reactor, Ljubljana

[M. Guthoff, 2012]

@3000fb-1

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Probestation

Self-built semi-automatic probestation: Commercial setup: >100k€ (without devices)

PC Lightproof housing Electrometers Power supplies LCR meter Screen Microscope with camera Cooled movable jig Relays ISO-box HV supply

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Probestation

Relay schematics:

Jig Electrometer LCR meter HV supply ISO- box

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Probestation

LabVIEW control software:

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Sensor Qualification

Measurement of electrical characteristics Leakage current Depletion voltage Strip properties

with Probestation

Before irradiation After irradiation Depletion Voltage

Current-Voltage Capacitance

  • Voltage
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Sensor Qualification

Measurement of electrical characteristics Leakage current Depletion voltage Strip properties

with Probestation

Before irradiation After irradiation Depletion Voltage

Current-Voltage Capacitance

  • Voltage
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Radiation Hardness – Current

Increase of leakage current proportional to fluence: Currents in both n- and p-type material scale the same Additional thermal power needs to be cooled CO2 cooling at -20°C foreseen for Phase II upgrade At lower T  lower ΔI Prevent / control annealing

Δ𝐽 𝑊 ∝ F𝑓𝑓

T=20°C

Expectation

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Voltage needed to create depletion zone increases Thicker sensors require higher voltages Vdep in p-bulk sensors increases faster due to acceptor-like defects

Radiation Hardness – Depletion Voltage

T = -20°C f = 1kHz

>1000V

0.0 5.0x10

14

1.0x10

15

1.5x10

15

200 400 600 800 1000 FZ320N FZ320P FZ200N FZ200P MCZ200N MCZ200P

Depletion Voltage (V) Fluence (n

eq /cm²)

N-bulk P-bulk

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Strip Readout System (Signal) – ALiBaVa

XYZ stages Collimator for 90Sr source Sensor Daughterboard Peltier cooling Water cooling for Peltiers Scintillator for triggering Isolation and shielding Measure performance of sensors with real signals

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Radiation Hardness – Electron Signal

S/N is important for final readout chip Noise is better in thinner sensors (less leakage current) MIP creates ~80 e/h pairs per µm of silicon Thinner materials  lower signals in the beginning About same performance at higher fluences

0.0 5.0x10 14 1.0x10 15 1.5x10 15 5000 10000 15000 20000 25000

FZ320N FZ320P FZ200N FZ200P MCZ200N MCZ200P

Electron signal (e-) Fluence (neq/cm2)

900V

Minimal Signal for Readout Electronics

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Institut für Experimentelle Kernphysik

Basic Material Characterization

Picolaser Setup (TCT)

Measurement of current created by particle tracks in the device (diodes) Charge created by Laser

Laser fiber Diode Peltier cooling + pre-cooling XYZ Table Signal Readout

Sketch of TCT

Laser openings

backside frontside

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Transient Current Technique (TCT)

Red Laser (680nm) generates charge carriers just beneath the surface, absorption length ~4µm Observe drift of charge carriers (current) of only one type through the diode Measurements used for verification of simulations

  • f electric fields

𝑤𝑒𝑒 ∝ 𝐹

Electrons, fast Holes, slow

E Y

U1 U2

, 𝑤𝑒𝑒 < 𝑤𝑛𝑛𝑛

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Simulation studies

we are performing simulation studies as well with two different Software Frameworks in order to reproduce measurements and investigate possible sensor performance before expensive and long production P-stop P-stop

Fig.: electric field distribution depending

  • n p-stop isolation geometry
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Simulation studies II

  • here examplarily shown interstrip

capacitance simulations of different sensors compared to experimental results

  • after correct reproduction and

parametrization it is possible to predict performance of new sensor geometries

region 5 region 7

TEST ID: 15010 TEST ID: 15016

  • Simulation dp = 1.5 μm
  • Qf = 5e10 cm-2

Initial dip not produced by simulation

  • Simulation dp = 1.5 μm
  • Qf = 5e10 cm-2

region 7

  • Simulation dp = 1.5 μm
  • Qf = 2.7e10 cm-2

TEST ID: 15016

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CMS Trigger Concept

Fig.:78 reconstructed pile-up events

L=1034cm-2s-1 σinel(pp) ≈ 70 mb

  • > Event rate = 7 x 108 Hz

Δt = 25 ns = 25 x 10-9 Hz-1

  • > Events/25ns = 17.5

not all bunches full (2835/3564)

  • > Events/crossing = 22

109 events per per second x event size of about 1Mbyte  ≈ 1TByte/sec data amount not processible  fast algorithms needed for selection of interesting events while suppressing less interesting events

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CMS Trigger System

40 MHz input rate to Level 1 Selection can‘t be done in 25ns  pipelined trigger 100 KHz Level 1 output rate 100 Hz written to tape Event size 1-2 Mbytes Level-1 Trigger: ⇒ Custom made hardware (ASICs) High Level Trigger: ⇒ PC farm (~1000 units) using reconstruction software and event filters similar to the

  • ffline analysis
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Tracker Trigger

Reduction of data volume 90% of tracks have pT<1GeV, 97% pT<2GeV Preselection of cluster widths Low momentum tracks are bent more in the magnetic field Working principle of Tracker Trigger Hits in 2 sensors close together provide geometrical cut on pT Measuring Δ(Rφ) over ΔR (sensor spacing) Optimize selection window and sensor spacing

low pT high pT e.g. search window = 3 strips

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Track Trigger Modules

Stacked sensor modules Correlation between hits in 2 sensors close together Strips read out at the edge Correlation done on readout chips Cut in X-Y plane allows to select pT treshold 2 module types foreseen for the Tracker 2 Strip Sensors pT module Pixel + Strip pT module

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CMS Tracker Layout

Design for the CMS Tracker: trigger modules only Inner radii: PS modules Outer radii: 2S modules

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Institut für Experimentelle Kernphysik

CBC: CMS Binary Chip

upgraded outer Tracker will be read out binary only; advantages: Simplifies readout architecture, simpler on-chip logic Occupancy independent data volume No ADC Lower power Can be emulated off-detector Simpler overall system Designed in IBM 130nm CMOS process

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CBC overview

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Beam tests

Tool for testing tracking detectors Role of beam tests in high energy physics: Conceptual design, choice of detectors/technologies Technical design, prototype construction and testing Calibrations Data taking Analysis, systematic studies DUT

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Beam tests II

Facility for detector testing CERN, Fermilab, DESY, ... example: DESY II syncrotron converted Bremsstrahlung from fibre targets in DESY II rate about 1 kHz/cm2 energies 1-6 GeV

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Beam tests III

in order to study new sensors we need a tool to know where exactly the particle hit the Device Under Test take the DATURA pixel telescope from DESY II: DUT high resolution: ~1um sensitive area: 1x2 cm2

  • 6 high resolution planes (Pixel Sensors: Mimosa26)
  • DUT placed in the center
  • smallest feature size in HEP sensors is ~10 μm
  • resolution here: ~1µm
  • see substructre of detectors
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Gigabit Link Interface Board (GLIB)

Xilinx Virtex-6 4 builtin SFP+ I/O, each bidirectional 6.5 Gbps 1 Gbit/s Ethernet RJ45 (Micro-TCA connector) 2 mezzanine connectors with FMC format Interface to GBTs development of a DAQ chain firmware with XILINX ISE sw for individual beam test specification integrate the communication with readout chip integrate external trigger signals

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PHASE I: MODULE PRODUCTION FOR THE CMS TRACKER

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now new

Simulation

CMS Phase I Upgrade

Increase in luminosity (2·1034 cm-2s-1) Readout chip rate-limited, innermost layer gets inefficient due to radiation damage New readout chip with digital data processing Four layers in barrel part: more points for track reconstruction Smaller radius of innermost layer: better resolution of primary vertices Less material in active volume: less multiple scattering

Material budget (in X0) now (3 layers) new (4 layers)

29 mm 68 mm 109 mm 160 mm Radien

η Radiation length

[H.-C. Kaestli]

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Production of Pixel Modules

Fourth layer of barrel part to be built in Germany Production of 50% of modules in Karlsruhe (~380)

HDI Silicon pixel sensor Base Strips (Si3N4)

Parts of a module: (16 x 4160 = 66560 Pixel)

26 mm 66,6 mm

Workflow in Karlsruhe: Bonding ROC - Sensor Gluing of components Wire bonding ROC/Sensor and TBM/HDI Functional test

TBM Module of current CMS pixel detector

Wire Bonding Bump B.

Cable

[H.-C. Kaestli]

16 ROCs (readout chips)

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Production of Pixel Modules

Planned module production line:

placed on ESD-protected tables inspection microscope

  • n mounting rail

vacuum reservoir glueing jigs made by UNI HH and IEKP

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Production of Pixel Modules

Planned module production line:

placed on ESD-protected tables inspection microscope

  • n mounting rail

vacuum reservoir glueing jigs made by UNI HH and IEKP

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Wire Bonding

Connection of silicon strip sensors to readout chips, readout chips to PCBs,

  • etc. difficult due to small pad sizes

Suitable technique: Wire bonding (wire diameter 25 µm) Bond placing either manually or automatically via pattern recognition Connection done with ultrasonic welding

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Wire Bonding

Achievable precision: 75 µm pitch

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Bump Bonding

Wire bonding not suitable for pixelated sensors Large number of connections on small surface area required (CMS pixel: 4160 connections per cm²) Solution: Bump bonding

Sandwich structure: readout chip sitting below silicon sensor

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Bump Bonding

Three different methods of bump deposition Chemical deposition and reflow: substantial effort, lots of equipment Solder-jet deposition: expensive (350k€) Wire stud deposition: reuse of existing gold wire bonder

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Gold Stud Bumping

SEM

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Bonding (Flip Chip Process)

Bumped parts need to be flip-chipped Finetech Fineplacer FEMTO Sub-micron accuracy Verification of process with X-ray imaging, energy-dispersive X-ray spectroscopy (EDX), polished cut images and SEM

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Thank you.

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BACKUP

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Summary

New CMS Tracker during the upgrade of LHC (>2022) Huge effort to find suitable sensor materials for this environment Decision on a sensor material in 2013 200µm and p-bulk reasonable Contributions of IEKP to Irradiations Sensor characterization (probestation) Signal and S/N measurements (strip readout system) Further activities Basic material investigation (Transient Current Technique) Investigation of trigger module concept CMS Tracker will be ready for the HL-LHC with Improved radiation hard sensors Less material budget Higher granularity Trigger Contribution