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LPI Solder Mask for FPC/ COF / Rigid-flex / ThinPCB PSR-9000 - PowerPoint PPT Presentation

Apr 21, 2023 •665 likes •810 views

2007.3.10 LPI Solder Mask for FPC/ COF / Rigid-flex / ThinPCB PSR-9000 FLX501 (UL: under application) 1 TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD. TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD. 2007.3.10 High Density Design

  1. 2007.3.10 LPI Solder Mask for FPC/ COF / Rigid-flex / ThinPCB PSR-9000 FLX501 (UL: under application) 1 TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD. TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD.

  2. 2007.3.10 High Density Design Rule Cover-layer limitation Solder mask (mass production) Adhesive bleed Registration 100 ～ 200um accuracy 伊藤（ 0.5 ） 100um ～ 300um 140um Registration Min. opening accuracy ～ 500um +/- 40um Min. corner R φ 500um ～ 100um Minimum gap ～ 1000um For high-density FPC, LPI solder mask is the most cost-effective solution! 2 TAIYO INK MFG. CO., LTD. TAIYO INK MFG. CO., LTD. TAIYO INK MFG. CO., LTD. TAIYO INK MFG. CO., LTD.

  3. 2007.3.10 Material Comparison Cover-layer film: LPI Solder mask: • High accuracy • Dimension change • High yield • Alignment inaccuracy No adhesive bleeding • Adhesive bleeding • High density suitable • Difficult for high-density • No mold • Hot press time & trouble – Cost-saving • Punching cost – For small-size production • Mold cost & management – Quick turn – No mold management 3 TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD. TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD.

  4. 2007.3.10 LPI Solder Mask Concerns 1. LPI solder mask process flow 2. Handling crack in PCB process 3. Surface finishing (ENIG) resistance 4. Visual/color difference after PCB post-process & assembly 4 TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD. TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD.

  5. 2007.3.10 1. Process Flow (TR61719) 酸處理 ・ 化学 刷磨 基板前處理 Chemical-etching, Soft-etching, Jet-scrub, acid cleaning 兩面印製時 網印 SCREEN 油 墨 印 刷 預烤 ( 箱型爐 ・ Jack-type tunnel oven ) 預 烤 80 ° C / 20~30min (Max. 50min) 曝 光 曝光 ( 紫外線照射 ) 400~600mJ/cm 2 顯 影 顯影 ( 1wt% Na 2 CO 3 30 ° C) 90~120sec 後烘烤 ( 箱型爐 ・ 隧道式爐 ) 後 烘 烤 150 ° C / 60min 5 TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD. TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD.

  6. 2007.3.10 2. Handling Crack What causes handling crack; •Operator: Rough handling •Process: Line-jamming, roll pressure, spray •Solder mask: due to tackiness & brittleness TR61710 solved both problems. ※ Customer-A result Existing solder mask PSR-9000 TR61719 37% 0% (cracked pc/pnl) (no cracks) 6 TAIYO INK MFG. CO., LTD. TAIYO INK MFG. CO., LTD. TAIYO INK MFG. CO., LTD. TAIYO INK MFG. CO., LTD.

  7. 2007.3.10 3. ENIG resistance Solder mask thickness: 18um (on Cu) Ni/Au thickness: Ni 5um/Au 0.03um （ ※ Customer-B Test coupon) • No Ni/Au intrusion • No peel-off 7 TAIYO INK MFG. CO., LTD. TAIYO INK MFG. CO., LTD. TAIYO INK MFG. CO., LTD. TAIYO INK MFG. CO., LTD.

  8. 2007.3.10 4. Cu Discoloration In atmosphere, copper becomes discolored due to oxidation resulted from temp. and humidity. 4Cu+O2 → 2Cu2O 2Cu+O2 → 2CuO After soldermask process, few steps of thermal history exist such as stiffener attachment, Ag/Al paste over-coating, etc… Such process, respectively, requires baking at above 160-degree for more than 1 hour in general. Through the processes, Cu will be decolorized. Thus Cu below soldermask will be also oxidized as air penetrates soldermask when such thermal process is implemented. 8 TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD. TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD.

  9. 2007.3.10 4. Minimize Cu Oxidation 1. Soldermask thickness • 15-20um on Cu 2. Soldermask pre-treatment • Anti-tarnish step 3. N2-purge • during baking/reflow process 9 TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD. TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD.

  10. 2007.3.10 4. Cu color change In Atmosphere Initial (after Post-cure) Lead-free Reflow: 260C* 10sec 9-time In N2-purge 10 TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD. TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD.

  11. 2007.3.10 LPI Solder Mask Comparison Status ＠ 2006/11 Item I-series 9000A02 FLX101 FLX501 △ △ △ ◎ Handling crack ◎ ○ ○ XX Tackiness, film-mark ○ ◎ ○ ○ Pre-cure Window △ △ ○ ○ Warpage △ △ ○ ◎ ENIG, chemical resistance ○ △ ○ ◎ Heat resistance △ △ △ ○ Bendability △ ○ ○ X Electrical property Halogen-Free Y/N N YES YES 11 TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD. TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD.

  12. 2007.3.10 Solder Mask Property-1 PSR-9000 PSR-4000 PSR-9000 A02 FLX101 FLX501 Cross hatch Adhesion PASS PASS PASS peeling No scratch on Pencil Hardness 5H 5H 5H copper Rosin flux Solder Heat PASS PASS PASS Floating 260C Resistance 10sec x 1time 10vol% H 2 SO 4 Acid Resistance PASS PASS PASS 20degC/ 30min 10wt% NaOH Alkaline Resistance PASS PASS PASS 20degC/ 30min Solvent Resistance PGM-AC PASS PASS PASS Electro’less Ni 3um, PASS PASS PASS Au 0.03um Ni/Au Plating 12 TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD. TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD.

  13. 2007.3.10 Solder Mask Property-2 PSR-9000 PSR-4000 PSR-9000 A02 FLX101 FLX501 IPC comb type (B pattern) Initial Initial Initial 25- 65degC cycle, 0%RH Insulation 5.0 × 10 13 Ω 8.3 × 10 12 Ω 3.9 × 10 13 Ω DC 100V for 7 Days. Resistance Conditioned Conditioned Conditioned Measure @ DC 500V for 1min 2.0 × 10 11 Ω 4.5 × 10 11 Ω 5.3 × 10 11 Ω value at room temp. Dk 3.1 3.3 Checking @ 1MHz Df 0.03 0.02 Checking 77C 68C Tg (CTE) TMA (a1/a2 ppm) Checking (85/172) (75/171) Young’s Tensile method 2700MPa 2500MPa 2500MPa Modulus Elongation Tensile method 57MPa 56MPa 47MPa Tensile Tensile method 5.1% 4.4% 5.1% Strength 13 TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD. TAIYO TAIYO INK MFG. CO., LTD. INK MFG. CO., LTD.

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