PbSn60 Solder Bumping PbSn60 Solder Bumping by Electroplating by - - PowerPoint PPT Presentation

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PbSn60 Solder Bumping PbSn60 Solder Bumping by Electroplating by - - PowerPoint PPT Presentation

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Pixel 2000, Genova Pixel 2000, Genova, June 5-8, 2000 , June 5-8, 2000 PbSn60 Solder Bumping PbSn60 Solder Bumping by Electroplating by Electroplating Juergen Wolf Wolf Juergen Fraunhofer IZM Fraunhofer IZM Berlin, Germany Berlin,

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SLIDE 1

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

PbSn60 Solder Bumping PbSn60 Solder Bumping by Electroplating by Electroplating

Juergen Juergen Wolf Wolf

Fraunhofer IZM Fraunhofer IZM Berlin, Germany Berlin, Germany

Fraunhofer

Institut Zuverlässigkeit und Mikrointegration

Pixel 2000, Pixel 2000, Genova Genova, June 5-8, 2000 , June 5-8, 2000

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SLIDE 2

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

Technology: Technology:

Solder Bumping Solder Bumping

Si read out chip (6“) Si3N4 passivation I/O pad size: 12 µm pitch: 50 µm Al wire bond pads not bumped no 2nd soldering level

Substrate Substrate Metallization Metallization

Si (4“); 200-250 µm thickness Si3N4 / SiON passivation UBM for FC on I/O Al-pads

[thin film multi layer (MCM-D)]

Flip Chip Bonding Flip Chip Bonding

PbSn 60; size: ø 25µm UBM: Ti:W/Cu/ep.Cu Electroplating Build up: metal: Ti:W/Cu + ep.Cu dielectric: BCB (MCM-D)

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SLIDE 3

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

PbSn Solder Bump Structure

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SLIDE 4

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

PbSn- Bumping - Processflow

Resist Stripping and wet Etching

  • f the Plating Base

Sputter Etching and Sputtering

  • f the Plating Base / UBM

Spin Coating and Printing

  • f Photoresist

Electroplating of Cu and PbSn Reflow

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SLIDE 5

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

PbSn Bumping Process Flow PbSn Bumping Process Flow in Detail in Detail

incomming optical inspection cleaning SRD electroplating Cu

Technische Universität Berlin

Research Center of Microperipheric Technologies

sputtering platingbase sputtering platingbase ion etching (Ar) Ti:W (200 nm) / Cu (300 nm)/

  • ptical inspection

electroplating PbSn60 pre-conditioning (etching) pre-conditioning (plasma O2) photoresist photoresist spin on / prebake/ exposure / develope/ postbake

  • ptical inspection

resist thickness control measurement rinse (DI water) 3 x rinse (DI water) warp & sheet resistance control

# 2

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SLIDE 6

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

PbSn Bumping Process Flow PbSn Bumping Process Flow in Detail ( in Detail (cont cont.) .)

Technische Universität Berlin

Research Center of Microperipheric Technologies

photoresist stripping photoresist stripping (1) (1) ( (aceton aceton) )

  • ptical inspection

dicing UBM etching Ti:W (H2O2)

  • ptical inspection

# 2

photoresist stripping photoresist stripping (2) (2) ( (aceton aceton) ) photoresist stripping photoresist stripping (3) (3) ( (aceton aceton) ) UBM etching Cu (CuCl2) ) photoresist photoresist spin on / bake reflow reflow

  • ptical inspection

bump shape control high measurement resist stripping resist stripping 3x ( 3x (aceton aceton) )

  • ptical inspection

(100 %) selection & sorting Flip Chip Bonding

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SLIDE 7

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

Solder Bumping Pb40Sn60

PbSn60 Solder Bumps (diameter: 25 µm; pitch 50 µm) UBM: Ti:W/Cu / ep.Cu (5µm)

Technische Universität Berlin

Research Center of Microperipheric Technologies

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SLIDE 8

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

Solder Bumping Pb40Sn60

PbSn60 Solder Bumps (diameter: 25 µm; pitch 50 µm) UBM: Ti:W/Cu / ep.Cu (5µm) after Reflow after electroplating

Technische Universität Berlin

Research Center of Microperipheric Technologies

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SLIDE 9

Solder Bumping Pb40Sn60

Read out BiCMOS Si-chip (Uni Bonn) with Solder Bumps (diameter: 25 µm; pitch 50 µm) after Reflow UBM: Ti:W/Cu / ep.Cu (5µm)

Technische Universität Berlin

Research Center of Microperipheric Technologies

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

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SLIDE 10

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

Solder Bump Reflow

Oxidelayers must be removed to allow solderball formation Use of aggressive fluxes must be avoided Melting point: Tm = 314°C (95/5 wt% Pb/Sn), Tm = 183°C (37/63 wt% Pb/Sn

Reflow methods:

Heating under active atmosphere Using Flux (RMA)

Some fluxless reflow methods:

Heating under reducing atmosphere

  • 100 % H2
  • 95 % N2 / 5 % H2 ( not sufficant )

( Reflow in vaccum ) ( Reflow after Sputteretching or RIE)

Process: Pb40Sn60 (PbSn5) Heating in a organic medium up to 240 (350) °C followed by cleaning procedure

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SLIDE 11

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

Solder Bump Reflow

Process: Pb40Sn60 (PbSn5) Heating in a organic medium up to 240 (350)°C followed by cleaning procedure

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SLIDE 12

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

Flip Chip Assembly Process Flow Process Flow

Solder Bumping

Read out chip

Wettable Metallization

Detector Substrate Inspection Dicing Cleaning & Inspection Inspection Loading Substrate Loading Chip Alignment

4 µm x/y accuracy

Placement Unload Module / Single Tile Reflow Soldering

240° C peak temperature, activated atmosphere

Unload Module / Single Tile

Technische Universität Berlin

Research Center of Microperipheric Technologies

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SLIDE 13

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

Equipment @ IZM

Solder Bumping (6“-8“)

Electroplating

Technische Universität Berlin

Research Center of Microperipheric Technologies

Sputtering LLS 802 (Balzers) Lithography ACS 200 (Karl Suss) MA 200 (Karl Suss) EQUINOX (Semitool) Optical Inspection RIE System Ten 1107 (Matrix) NSX 90 (August) Dicing DAD 341(Disco) Reflow LRP 200 (RENA)

July 2000

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SLIDE 14

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

Equipment @ IZM

Flip Chip Bonding

Technische Universität Berlin

Research Center of Microperipheric Technologies

Flip Chip Bonder FC 950 (Karl Suss) X-ray Inspection X-ray (Feinfocus) FC 250 (Karl Suss)

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SLIDE 15

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

Inspection / Yield / Issues Inspection / Yield / Issues

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SLIDE 16

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

Optical Bump Inspection

Automated Defect Inspection System NSX-90 August Technology

Inspection time: ≈ 120 min / wafer all bumps (ATLAS FE-B/D [6“])

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SLIDE 17

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

Inspection Sites

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SLIDE 18

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

Defect Classes

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SLIDE 19

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

Defect Classes

Particle Particle Bump Position Missing Bump Small Bump Large Bump

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SLIDE 20

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

Bump-Profile for Atlas Bump Inspection

Bump Size / Position: Defect Code: Minimum Size: 0.027 mm → → → → Small Bump Maximum Size: 0.032 mm → → → → Large Bump Tolerance +/-: 0.005 mm → → → → Bump position

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SLIDE 21

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

1 reflow 2 reflow 3 reflow 4 reflow

5 10 15 20

bump size 25µm wafer 17 center wafer 17 edge wafer 10 center wafer 10 edge

bump shear force (g) reflow numbers

Bump shear variation as multiple reflows Bump shear variation as multiple reflows

(25 (25µ µ µ µ µ µ µ µm size bumps) m size bumps)

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SLIDE 22

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

Cross-sectional images as multiple reflows Cross-sectional images as multiple reflows

reflow 1 reflow 2 Cu: 4.0µ µ µ µm Cu: 3.8µ µ µ µm reflow 3 Cu: 3.6 µ µ µ µm

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SLIDE 23

Juergen Wolf High Density Interconnect & Waferlevel Packaging

Phone: +49-(0)30-314-72887 E-Mail: wolf@izm.fhg.de

High Density Flip Chip Detector Module

pixel detector module for proton proton interactions at the Large Hadron Collider at the European Laboratory for Particle Physics Cern Topics: 16 ICs; 46080 PbSn Solder Bumps; pitch: 50 µm

Technische Universität Berlin

Research Center of Microperipheric Technologies