IC Obsolescence Solutions Tuesday, October 03, 2017 Company - - PowerPoint PPT Presentation

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IC Obsolescence Solutions Tuesday, October 03, 2017 Company - - PowerPoint PPT Presentation

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IC Obsolescence Solutions Tuesday, October 03, 2017 Company Overview March 12, 2015 IC FOOTPRINT CONVERSION ADAPTERS REPLACE OBSOLETE ICs WITHOUT RE-SPINNING YOUR PCB An IC Adapter is a small PCB designed that: Has a circuit and

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SLIDE 1

Company Overview – March 12, 2015

IC Obsolescence Solutions

Tuesday, October 03, 2017

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SLIDE 2

IC Obsolescence Solutions

IC FOOTPRINT CONVERSION ADAPTERS

REPLACE OBSOLETE ICs WITHOUT RE-SPINNING YOUR PCB

An IC Adapter is a small PCB designed that:

  • Has a circuit and components to emulate the original IC
  • Has interconnect/IO that matches the original IC
  • Is designed to be assembled to your existing PCB using

standard SMT assembly process Also Known As:

  • Interposers
  • Footprint conversion adapters
  • Modules
  • Daughter card
  • Mezzanine card
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SLIDE 3

IC Obsolescence Solutions

WARNING: OBSOLESCENCE CAN HAPPEN AT ANY TIME

WHY RESPIN… WHEN YOU CAN ADAPT!

Utilize latest generation silicon in your system Purchase product you need, when you need it Quick turn development / minimize legacy engineering Qualify by similarity – form, fit & function

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IC Obsolescence Solutions

WHY RESPIN… WHEN YOU CAN ADAPT!

WARNING: OBSOLESCENCE CAN HAPPEN AT ANY TIME

Outdated IC Package Bare PCB in Tact Updated IC Package Matched to Footprint System Updated with Latest IC Technology

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SLIDE 5

IC Obsolescence Solutions

WHY USE AN IC ADAPTER?

Production-Worthy Solution for IC Obsolescence or Shortages:

  • Without the cost or effort of redesigning a motherboard
  • Without expensive last-time buy purchases
  • Without risky gray-market purchases
  • With minimal product requalification and test requirements

(component change vs. new board design) ie. Quicker Time to Market Unit Cost Reduction: New device with adapter is often less expensive than existing device Fan-Out: Adapters can ‘fan-out’ fine pitch components to a larger pitch to avoid increasing motherboard layer count and eliminating microvias and blind/buried vias

TSOP to SOJ BGA Fan-Out Adapter Multi IC to QFP

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SLIDE 6

IC Obsolescence Solutions

CDIP PDIP SIP QFN LQFP PQFP CQFP TQFP DIP SSOP VSO PMFP SOC SOJ SDIP TSOP PLCC QFP SQFP HSOP HTSSOP CSP/WLP SOIC PGA HBGA BGA ISI adapters can be made to replace any standard IC package

ISI CAN ADAPT TO ANY FOOTPRINT

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SLIDE 7

IC Obsolescence Solutions

BGA ADAPTERS

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SLIDE 8

IC Obsolescence Solutions

LEADFRAME ADAPTERS

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IC Obsolescence Solutions

PGA/DIP/SIP ADAPTERS

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IC Obsolescence Solutions

FOOTPRINT CONVERSION ADAPTERS

OVERVIEW OF ADAPTER DESIGN PROCESS

  • 1. Customer provides project information
  • Mechanical drawings of ICs and target footprint
  • Net list or schematic
  • Routing requirements; matched/maximum signal lengths, differential pair,

controlled impedance, ground planes, etc.

  • X, Y, Z dimensional requirements
  • Any specific reliability requirements
  • Quantities required for prototypes and production
  • 2. ISI provides quotation for NRE, prototypes and production
  • 3. Customer orders NRE & prototypes
  • 4. ISI designs module/adapter and submits design to customer for approval
  • 5. Customer approves design
  • 6. ISI builds prototypes
  • 7. Customer verifies function and in some cases reliability of module/adapter

solution, places order for production requirements

  • 8. ISI builds turn-key solution to production schedule
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SLIDE 11

IC Obsolescence Solutions

FOOTPRINT CONVERSION ADAPTERS

ADAPTER DESIGN EXAMPLES

In many cases, more than one component is necessary to replace the

  • riginal IC. For example, many adapters require bypass capacitors and/or

voltage regulators. ISI has come up with many innovative solutions to allow multiple components to fit into the available x,y and z space.

Example A: The new device(s) will fit into the same area as the

  • riginal chip. Adapter has new device(s) on top side, and I/O to the

motherboard on the bottom side Example B: The new device and components will not fit into the same area as the original chip. I/O to the motherboard is lengthened to allow placement of devices on both sides of the adapter. Example C: Adapter must extend above surrounding components to accommodate all components. I/O to the motherboard is lengthened and components can be placed on both sides

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IC Obsolescence Solutions

Max Overall Height: 0.580” Max Top Side Height: 0.312”

INTERPOSER DESIGN PROCESS

Max Bottom Side Height: 0.095” Max Height: 0.085” (*Except Where Specified) Max PCB Thickness: 0.068” Board Separation Height: 0.200” Min Air Gap: 0.020”

Keep Out Area

*Height: 0.095”

Motherboard PGA Pins & Socket used to add ‘z-height’ Interposer PCB

Interposer is designed to fit in available space:

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SLIDE 13

IC Obsolescence Solutions

INTERPOSER MANUFACTURING PROCESS

Interposer assembly is typically done in multi-up panels

3 x 5 Interposer Panel

When possible, we pre-manufacture the ‘connector’ and use it as a sub-component.

  • Carriers are plastic (injection molded) or laminate

(multi-head high speed drillers/routers)

  • Pins are parallel loaded and pressed for coplanarity.
  • Leads are formed for QFP / SOIC style packages

PGA SOIC / SOJ DIP QFP / PLCC MicroPGA

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IC Obsolescence Solutions

INTERPOSER MANUFACTURING PROCESS

Step 1: SMT Bottom Side

Populate interconnect

Screen Solder

MPM - SPM

Placement

Fuji CP-732 & QP-351

Reflow

Heller 1800, 1809

Step 2: SMT Top Side

Populate QFPs

Individual QFP FlexFrame

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SLIDE 15

IC Obsolescence Solutions

INTERPOSER MANUFACTURING PROCESS

Step 3:

Singulate with Router

Inspection

  • Visual to IPC A-610 Class III
  • Mechanical / Dimensional to

Drawing (including leads)

  • X-Ray of hidden solder joints

(as required)

  • Inspection templates (as

required)

  • Nikon Nexiv Automated

Optical/Laser CMMs for lead flatness, coplanarity & true position as required Testing (as required)

  • Functional
  • Boundary Scan / JTAG
  • DC Parametric
  • Test patterns

Packaging / Labeling

  • JEDEC Tray
  • Tape & Reel
  • Custom (MacGyver)
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IC Obsolescence Solutions

WHY CHOOSE ISI FOR IC ADAPTERS?

ISI is quickly approaching 30 years experience and currently designs and manufactures more than 100 new designs each year

ISI has our own high volume manufacturing facility allowing us to be cost competitive for high volume applications

ISI has developed and manufactures our own unique interconnect to accommodate any IC footprint (FlexFrame, BGA, PGA, etc.)

ISI Adapters are designed for to be used in high-volume automated SMT manufacturing lines using standard SMT processes

ISI Adapters have been tested and qualified for use in the most demanding applications, including military and commercial aircraft, automotive, ruggedized embedded computing systems

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THANK YOU!

Contact ISI to engage on your next project:

741 Flynn Road / Camarillo, California 93012 (805) 482-2870 www.ISIPKG.com Address: Phone: Website:

» Bob Garon

(630) 707-0991 bob.garon@molex.com Cell: Email: Midwest USA

» Brian Witzen

(919) 633-0798 brian.witzen@molex.com Cell: Email: Eastern USA (714) 993-9618 (714) 261-3733 dave.gagnon@molex.com Office: Cell: Email: Western USA

» Dave Gagnon