Research/Design Manu. Facilities Design/Sales/Support partner for EMEA: Advances in Die Extraction and Re-Packaging for Obsolete Semiconductors
Who is GCI/Force GCI/Force Provides High- Reliability Electronic Components for Oil/Gas Drilling in Harsh Environments GCI/Force Engineers Integrated Circuit Obsolescence Solutions for Military and Commercial Applications GCI/Force Manufactures and Services Products On Site 2 of 23
Why a Demand for our Obsolescence Solutions? Inadequate Overlap between Component Product Lifecycles and Required Lifecycle of End Product/System Common in Military Electronic System Platforms (Thousands of Commercial ICs are Obsoleted Every Year) Also seen in Commercial Systems (e.g, Medical) � 3 of 23
Solution for Obsolescence - DER™ If one Package Footprint or Type is Obsolete, but the Die can still be Located in Another Package Footprint, the Die can be Extracted and Re-Assembled As Needed (DER TM ) - Or the DER TM Process Can be Used to Inventory Functional Die. 4 of 23
Solution For Obsolescence - DER TM Die Extraction and Re-Packaging Considerations: - What is the End Application?: (Bare Die, Hybrid, Monolithic.MCM) - Original Package, Target Package Selection, Bond Map, etc. - Plastic SOIC to Ceramic TSOP (Hermetic ) 5 of 23
Die Extraction & Re-Packaging (DER TM ) Remove Die from Original Low-Reliability, Low-Temp Plastic Casing Re-Assembly into High-Reliability Ceramic Package of any Footprint using Proprietary Processes Hermetic Packaging Hybrids & OR Multi- Chip Modules 6 of 23
DER TM Technology Extraction Technology Provides Very Clean Front-Side and Back-Side Surfaces Relies on Chemical and Mechanical Processes Which Are No More Aggressive Than Those Used During Wafer Fabrication - Extremely Clean Bond Pads - No Inadvertent Etching - Die Back-Side Surface Free - Die Surface Free of of Contaminants and Returned Contaminants to Original Mirror Finish 7 of 23
Conventional Bonding During Re-Packaging 8 of 23
Re-manufactured Part Process Flow Commercial CMOS ASYNCHRONOUS FIFO Military CMOS ASYNCHRONOUS FIFO REMANUFACTURED PART DONOR • PERFORMANCE/RELIABILITY GCI7201LA50XEB • 28 Pin CERDIP • Qualified • IDT7201LA5OP OBSOLETE • 28 Pin PDIP PART • Purchased from Franchised Distributor • IDT7201LA50XEB • 28 Pin CERDIP 9 of 23 PRODUCT FLOW
DER TM Process Improvements – Pad Re-Plating , Now DEER TM Pad Re-Conditioning Using Gold Ball Removal Followed by ENEPIG (Electroless Nickel, Electroless Palladium, Immersion Gold) Plating - DEER TM Potential Original Poor Ball Bond Quality/Reliability is Removed Subsequent Bonding is Non-Compound with More Consistent and Reliable Bond Pull Strength New Bond Pad Surface Eliminates Possibility of Kirkendall Voiding with Gold Bond Wire at Operating Temperatures Above 150 ° C General Appearance of Kirkendall or Horsting Voiding at Bond Pad Location - Specifically at Gold Ball to Aluminum Bond Pad Interface the following dielectrics can be formed: Au 5 Al 2 , Au 4 Al, Au 2 Al and AuAl 2 10 of 23
DER TM Process Improvements – Pad Re-Plating (DEER TM ) Process Flow for Pad Re-Conditioning Following Extraction Targeted Thicknesses: 4 um Ni, 0.25 um Pd, 0.04 um Au 11 of 23
Gold Ball Removal, Pad Re-Plating with Electroless Ni/Pd/Au Process DEER TM Aluminum Pad Reconditioning for an Extracted Die (Target Total Plate Up is 4 - 5 um) 12 of 23
GCI’s Ni/ Pd/Au Pad Re-Plating Performance at 250 ° C 10000 Hours to Failure @ 250°C 1000 Hours 100 10 1 1 2 3 4 5 Packaging Options Packaging Option Key: 1 – Standard Plastic (25h) 2 – Extraction, Standard Ceramic Assembly (DER TM ) (95h) 3 – Extraction, Hi-Temp Ceramic Assembly (DER TM ) (600h) 4 – Extraction, Ni/Pd/Au Process, Hi-Temp Ceramic Assembly (DEER TM ) (+6000h) 5 – Extraction, Ni/Pd/Au Process, Standard Ceramic Assembly (DEER TM ) (+2500h) 13 of 23
Ni/Pd/Au Pad Performance at 250 ° C Avg. Bond Std. Mean- Plastic Pull Strength Dev. 3 SD Mean Device as Received: 7.154g 1.03g 4.06g Control Device After Pad Re-Conditioning: T=0 13.302g 1.52g 8.74g 6.8g T=168 (250°C) 12.650g 1.26g 8.89g 3.2g T=1000 (250°C) 11.540g 0.90g 8.50g 1.0g T=2000 (250°C) 10.913g 0.76g 8.65g 0.0g Data Reflects 16 Data Points for Each Component 14 of 23
Ni/Pd/Au Pad Re-Plating Performance at 250 ° C Bond Pull Strength vs. Time at 250 ° C for ENEPIG Pad Plating, DEER TM 15 of 23
U.S. Department of Defense DER Research (Air Force) SMD QCI Reliabilit Military 100% Group C Ext. Original New Counterfeit Variability y HERM 3-T Screen/ QCI 1K Hour QCI 2K Hour F-16 P/N (GEN#) Package Package Analysis Analysis Study DER ASSY Electrical Group A Group B Life Group D Life 28-pin Ceramic- Authorized AT28C64B SOIC 28 Pin Distributor Memory Device Plastic SideBraze - Franchised PASS PASS 100% 100% PASS PASS PASS PASS PASS PASS Authorized XC4013XL 160-pin Distributor Field Programmable TQFP Ceramic- - Gate Array Plastic 144 CQFP Franchised PASS PASS 100% 100% PASS PASS PASS PASS 7/10/17 PASS • DER PROCESS PASSED “V” LEVEL TESTING PER MIL -PRF-38535 AND MIL-STD-883 / 5004 & 5005 QCI AND PERFORMS BEYOND 2000 HOUR LIFE TEST. • QCI LIFE TEST EXTENDED FROM 2,000 HOURS TO 4,000 HOURS TO MEET DLA’S NEW TECHNOLOGY INSERTION LIFE TEST REQUIREMENT. • TO DATE THE RESULTS SHOW G CI’S DER PROCESS IS HIGHLY RELIABLE AFTER SUCCESSFUL SCREENING AND QCI IN ACCORDANCE WITH MIL-PRF-38535, MIL-STD- 883/5004/5005. • 100% SCREENED PARTS ARE AVAILABLE FOR LRU AND SYSTEM LEVEL TESTING TO THE USG. • GCI HAS SUCCESSFULLY QUALIFIED A DER PART IN ACCORDANCE WITH MIL-PRF-38535, MIL-STD-883/5004/5005 AND THE NAVY IS PRESENTING A SUCCESS STORY AT THE NOVEMBER 2016 DMSMS CONFERENCE. • NET RESULT: GCI HAS BEEN AWARDED A $2.75M CONTRACT WITH THE AIR FORCE TO BUILD AND QUALIFY 20 – 25 OTHERWISE OBSOLETE IC DEVICES 16 of 23
CANDIDATE DEVICE TYPE SELECTED (NAVY) 8-lead Ceramic Side Braze Package • Process Die Removal NM24C04 SCD 80202739004 • Hermetic Packaging • Donor Electrical Variability Analysis • Reliability Temperature Stress Cycling • MIL-PRF-38535 Appendix B (V Level) Donor Device Target Device • 100% Screening 883/5004 • QCI Per 883/5005, 1K Hour Life Test Ceramic Package Drawing 17 of 23
DER DEVICE SELECTION, SCREENING & QCI FLOW (NAVY) NSWC 24C04DMB Project Franchised Candidate Distributor Only Parts Selection Bond Pull Data: Identical System and Piece Strength for Compound Part Screening or Single Bonds Pass / NO Fail? YES 100% Visuals DER Assembly 100% “B” Level � Screening Per MIL- STD-883/5004 QCI Per STD- Hermetically 883/5005 Groups A, Sealed, meeting B, C, D SMD Requirements 100% PIND, Read & Life Test 1,000 Pre & Post Burn-in Delta Marking is for Record Data 18 of 23 Measurements Hrs. illustration only
Additional GCI/Force Capabilities Die Thinning t0 75 um & Stacking � 19 of 23
Additional GCI Capabilities Vacuum Bake & Sealing - Low-Pressure (10 -5 Torr) Vacuum Bake and Sealing for MEMs Devices – Controlled Cavity/Sealing Atmosphere 20 of 23
Summary of GCI Capabilities/Services GCI’s Extraction Capability is Proven and Reliable - Over 100K GCI DER TM Processed ICs Currently in the Field Standard High-Temperature Packaging Increases Life Times by More Than 250x for Applications > 150°C) Ni/Pd/Au Pad Re-Plating Increases Life Times by More than 1000x (for Applications > 150°C) Ni/Pd/Au Pad Reconditioning DEER TM Allows for Conventional Assembly with Increased Quality While Maintaining Hi-Temp Reliability! 21 of 23
Summary of GCI/Force Capabilities/Services Quick-Turn Prototype Development In-house IC & Hybrid Assembly Facility Solutions for Obsolescence Counterfeit Screening Turnkey High-Volume Production IC Solutions for Extreme Environments (High Shock @ >150 ° C) as well as Aerospace, Defense, and Industrial Applications Failure Analysis Die Thinning and Vacuum Sealing 22 of 23
Contact Information Michael Salmon Director of Engineering Tel+44(0)1264 731200 www.forcetechnologies.co.uk (EMEA) Erick Spory President & CTO www.GCI-Global.com (ROW) DER™ DEER™ are the Registered Trade Marks of Global Circuit Innovations. Presentation in part, shown by kind permission of GCI ISO 9001:2008 Certified Company AS9100D tba Dec’17 Certified Company EMEA Distributor/Partner for GCI
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