Advances in Die Extraction and Re-Packaging for Obsolete - - PowerPoint PPT Presentation

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Advances in Die Extraction and Re-Packaging for Obsolete - - PowerPoint PPT Presentation

Mar 15, 2024 316 likes •570 views

Research/Design Manu. Facilities Design/Sales/Support partner for EMEA: Advances in Die Extraction and Re-Packaging for Obsolete Semiconductors Who is GCI/Force GCI/Force Provides High- Reliability Electronic Components for Oil/Gas

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SLIDE 1

Advances in Die Extraction and Re-Packaging for Obsolete Semiconductors

Design/Sales/Support partner for EMEA: Research/Design Manu. Facilities

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SLIDE 2
  • GCI/Force Provides High-

Reliability Electronic Components for Oil/Gas Drilling in Harsh Environments

  • GCI/Force Engineers

Integrated Circuit Obsolescence Solutions for Military and Commercial Applications

  • GCI/Force Manufactures and

Services Products On Site

Who is GCI/Force

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SLIDE 3
  • Inadequate Overlap between Component Product Lifecycles and Required

Lifecycle of End Product/System

  • Common in Military Electronic System Platforms

(Thousands of Commercial ICs are Obsoleted Every Year)

  • Also seen in Commercial Systems (e.g, Medical)
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Why a Demand for our Obsolescence Solutions?

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SLIDE 4

Solution for Obsolescence - DER™

  • If one Package Footprint or Type is Obsolete, but the Die can still be

Located in Another Package Footprint, the Die can be Extracted and Re-Assembled As Needed (DERTM)

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  • Or the DERTM

Process Can be Used to Inventory Functional Die.

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SLIDE 5

Solution For Obsolescence - DERTM

  • Die Extraction and Re-Packaging Considerations:
  • What is the End Application?: (Bare Die, Hybrid, Monolithic.MCM)
  • Original Package, Target Package Selection, Bond Map, etc.
  • Plastic SOIC to Ceramic TSOP (Hermetic)

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SLIDE 6

Die Extraction & Re-Packaging (DERTM)

  • Remove Die from Original Low-Reliability, Low-Temp Plastic Casing

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Hermetic Packaging Hybrids & Multi- Chip Modules

  • Re-Assembly into High-Reliability Ceramic Package of any Footprint using

Proprietary Processes

OR

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SLIDE 7

DERTM Technology

  • Extraction Technology Provides Very Clean Front-Side and Back-Side

Surfaces

  • Relies on Chemical and Mechanical Processes Which Are No More

Aggressive Than Those Used During Wafer Fabrication

  • Extremely Clean

Bond Pads

  • No Inadvertent

Etching

  • Die Surface Free of

Contaminants

  • Die Back-Side Surface Free
  • f Contaminants and Returned

to Original Mirror Finish

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SLIDE 8

Conventional Bonding During Re-Packaging

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SLIDE 9

Re-manufactured Part Process Flow

PRODUCT FLOW PERFORMANCE/RELIABILITY Commercial CMOS ASYNCHRONOUS FIFO Military CMOS ASYNCHRONOUS FIFO

  • IDT7201LA50XEB
  • 28 Pin CERDIP
  • IDT7201LA5OP
  • 28 Pin PDIP
  • Purchased from

Franchised Distributor

  • GCI7201LA50XEB
  • 28 Pin CERDIP
  • Qualified

OBSOLETE PART DONOR REMANUFACTURED PART

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SLIDE 10

DERTM Process Improvements – Pad Re-Plating , Now DEERTM

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  • Pad Re-Conditioning Using Gold Ball Removal Followed by ENEPIG

(Electroless Nickel, Electroless Palladium, Immersion Gold) Plating - DEERTM

  • Potential Original Poor Ball Bond Quality/Reliability is Removed
  • Subsequent Bonding is Non-Compound with More Consistent and

Reliable Bond Pull Strength

  • New Bond Pad Surface Eliminates Possibility of Kirkendall Voiding with

Gold Bond Wire at Operating Temperatures Above 150°C

General Appearance

  • f Kirkendall or

Horsting Voiding at Bond Pad Location - Specifically at Gold Ball to Aluminum Bond Pad Interface the following dielectrics can be formed: Au5Al2, Au4Al, Au2Al and AuAl2

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SLIDE 11

DERTM Process Improvements – Pad Re-Plating (DEERTM)

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  • Process Flow for Pad Re-Conditioning Following Extraction
  • Targeted Thicknesses: 4 um Ni, 0.25 um Pd, 0.04 um Au
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SLIDE 12

Gold Ball Removal, Pad Re-Plating with Electroless Ni/Pd/Au Process DEERTM

Aluminum Pad Reconditioning for an Extracted Die (Target Total Plate Up is 4 - 5 um)

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SLIDE 13

Packaging Option Key: 1 – Standard Plastic (25h) 2 – Extraction, Standard Ceramic Assembly (DERTM) (95h) 3 – Extraction, Hi-Temp Ceramic Assembly (DERTM ) (600h) 4 – Extraction, Ni/Pd/Au Process, Hi-Temp Ceramic Assembly (DEERTM) (+6000h) 5 – Extraction, Ni/Pd/Au Process, Standard Ceramic Assembly (DEERTM) (+2500h)

1 10 100 1000 10000 1 2 3 4 5 Hours Packaging Options

Hours to Failure @ 250°C

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GCI’s Ni/Pd/Au Pad Re-Plating Performance at 250°C

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SLIDE 14
  • Avg. Bond Std. Mean- Plastic

Pull Strength Dev. 3 SD Mean Device as Received: 7.154g 1.03g 4.06g Control Device After Pad Re-Conditioning: T=0 13.302g 1.52g 8.74g 6.8g T=168 (250°C) 12.650g 1.26g 8.89g 3.2g T=1000 (250°C) 11.540g 0.90g 8.50g 1.0g T=2000 (250°C) 10.913g 0.76g 8.65g 0.0g Data Reflects 16 Data Points for Each Component

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Ni/Pd/Au Pad Performance at 250°C

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SLIDE 15

Ni/Pd/Au Pad Re-Plating Performance at 250°C

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Bond Pull Strength vs. Time at 250°C for ENEPIG Pad Plating, DEERTM

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SLIDE 16

U.S. Department of Defense DER Research (Air Force)

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F-16 P/N (GEN#) Original Package New Package Counterfeit Analysis Variability Analysis Reliabilit y Study DER HERM ASSY SMD Military 3-T Electrical 100% Screen/ Group A QCI Group B QCI Group C 1K Hour Life QCI Group D Ext. 2K Hour Life AT28C64B Memory Device 28-pin SOIC Plastic Ceramic- 28 Pin SideBraze Authorized Distributor

  • Franchised

PASS PASS 100% 100% PASS PASS PASS PASS PASS PASS XC4013XL Field Programmable Gate Array 160-pin TQFP Plastic Ceramic- 144 CQFP Authorized Distributor

  • Franchised

PASS PASS 100% 100% PASS PASS PASS PASS 7/10/17 PASS

  • DER PROCESS PASSED “V” LEVEL TESTING PER MIL-PRF-38535 AND MIL-STD-883 / 5004 & 5005 QCI AND PERFORMS BEYOND 2000 HOUR LIFE TEST.
  • QCI LIFE TEST EXTENDED FROM 2,000 HOURS TO 4,000 HOURS TO MEET DLA’S NEW TECHNOLOGY INSERTION LIFE TEST REQUIREMENT.
  • TO DATE THE RESULTS SHOW GCI’S DER PROCESS IS HIGHLY RELIABLE AFTER SUCCESSFUL SCREENING AND QCI IN ACCORDANCE WITH MIL-PRF-38535, MIL-STD-

883/5004/5005.

  • 100% SCREENED PARTS ARE AVAILABLE FOR LRU AND SYSTEM LEVEL TESTING TO THE USG.
  • GCI HAS SUCCESSFULLY QUALIFIED A DER PART IN ACCORDANCE WITH MIL-PRF-38535, MIL-STD-883/5004/5005 AND THE NAVY IS PRESENTING A SUCCESS STORY AT

THE NOVEMBER 2016 DMSMS CONFERENCE.

  • NET RESULT: GCI HAS BEEN AWARDED A $2.75M CONTRACT WITH THE AIR FORCE TO BUILD AND QUALIFY 20 –

25 OTHERWISE OBSOLETE IC DEVICES

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SLIDE 17

CANDIDATE DEVICE TYPE SELECTED (NAVY)

NM24C04 8-lead Ceramic Side Braze Package SCD 80202739004

  • Process Die Removal
  • Hermetic Packaging
  • Donor Electrical

Variability Analysis

  • Reliability

Temperature Stress Cycling

  • MIL-PRF-38535

Appendix B (V Level)

  • 100% Screening

883/5004

  • QCI Per 883/5005, 1K

Hour Life Test Donor Device Target Device Ceramic Package Drawing

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SLIDE 18

NSWC 24C04DMB Project Franchised Distributor Only

Pass / Fail?

System and Piece Part Screening 100% “B” Level Screening Per MIL- STD-883/5004 QCI Per STD- 883/5005 Groups A, B, C, D Life Test 1,000 Hrs. Candidate Parts Selection

YES 100% Visuals Pre & Post Burn-in Delta Measurements Hermetically Sealed, meeting SMD Requirements Marking is for illustration only Bond Pull Data: Identical Strength for Compound

  • r Single

Bonds

DER DEVICE SELECTION, SCREENING & QCI FLOW (NAVY)

NO 100% PIND, Read & Record Data

DER Assembly

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SLIDE 19

Die Thinning t0 75 um & Stacking

Additional GCI/Force Capabilities

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SLIDE 20

Additional GCI Capabilities

Vacuum Bake & Sealing

  • Low-Pressure (10-5 Torr)

Vacuum Bake and Sealing for MEMs Devices – Controlled Cavity/Sealing Atmosphere

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SLIDE 21
  • GCI’s Extraction Capability is Proven and Reliable
  • Over 100K GCI DERTM Processed ICs Currently in the Field
  • Standard High-Temperature Packaging Increases Life Times

by More Than 250x for Applications > 150°C)

  • Ni/Pd/Au Pad Re-Plating Increases Life Times by More than

1000x (for Applications > 150°C)

  • Ni/Pd/Au Pad Reconditioning DEERTM Allows for Conventional

Assembly with Increased Quality While Maintaining Hi-Temp Reliability!

Summary of GCI Capabilities/Services

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SLIDE 22
  • Counterfeit Screening
  • In-house IC & Hybrid Assembly Facility
  • Turnkey High-Volume Production IC Solutions for Extreme

Environments (High Shock @ >150°C) as well as Aerospace, Defense, and Industrial Applications

  • Quick-Turn Prototype Development
  • Failure Analysis

Summary of GCI/Force Capabilities/Services

  • Solutions for Obsolescence

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  • Die Thinning and Vacuum Sealing
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SLIDE 23

Contact Information

Michael Salmon Director of Engineering Tel+44(0)1264 731200 www.forcetechnologies.co.uk (EMEA) Erick Spory President & CTO www.GCI-Global.com (ROW)

ISO 9001:2008 Certified Company

EMEA Distributor/Partner for GCI

DER™ DEER™ are the Registered Trade Marks of Global Circuit Innovations. Presentation in part, shown by kind permission of GCI

AS9100D tba Dec’17 Certified Company