Company Presentation Where quickturn and small volume PCB orders - - PowerPoint PPT Presentation

Company Presentation

Jun 10, 2014 Where quickturn and small volume PCB orders are all done in-house.

★ Our Milestones ★ Organization Chart ★ Revenue by Year ★ Business Strategies ★ Fabrication Capabilities ★ Technology Roadmap ★ Main Production Facilities ★ Quality Assurance ★ QA Systems & Final Inspections

Outline Outline

Our Milestones Our Milestones

Milestones

Milestones

1996 Established Speedy Circuits as a “quickturn” prototype PCB 1996 Established Speedy Circuits as a “quickturn” prototype PCB fabrication shop with 50 employees. fabrication shop with 50 employees. 1997 Successfully created metal core (aluminum) boards. 1997 Successfully created metal core (aluminum) boards. 1998 Adopted microwave materials (PTFE), such as Rogers, Polyimide, 1998 Adopted microwave materials (PTFE), such as Rogers, Polyimide, Nelco, and Taconic, in production. Nelco, and Taconic, in production. 1999 1999 Granted UL certificate of registration. 2000 2000 Given approval by UL for heavy copper of up to 6 oz for internal layers. 2001 Successfully applied sequential blind/buried vias in production. 2001 Successfully applied sequential blind/buried vias in production. 2002 Successfully created vias in pads. 2002 Successfully created vias in pads. 2003 Awarded ISO9001 (2000 version) NSF-ISR Certification. 2003 Awarded ISO9001 (2000 version) NSF-ISR Certification. 2004 Successfully applied two-build-up implement to create 2+N+2 HDI 2004 Successfully applied two-build-up implement to create 2+N+2 HDI boards. boards.

2005 Achieved high aspect ratio hole of ^15:1 in place of ^12:1. 2005 Achieved high aspect ratio hole of ^15:1 in place of ^12:1. 2006 Moved into a new and bigger facility and increased our workforce to 250. 2006 Moved into a new and bigger facility and increased our workforce to 250. 2007 Successfully adopted manufacturing techniques to create flexible and rigid-flex PCBs. 2007 Successfully adopted manufacturing techniques to create flexible and rigid-flex PCBs. 2008 Acquired additional equipment, including two drilling machines, two NC routing 2008 Acquired additional equipment, including two drilling machines, two NC routing machines and two flying probe type testers, resulting in increased production capacity. machines and two flying probe type testers, resulting in increased production capacity. 2009 Granted ISO9001 (2008 version) NSF-ISR Certification. 2009 Granted ISO9001 (2008 version) NSF-ISR Certification. 2010 Successfully created stacked vias/HDI-SBU via-fill copper plating and blind microvias 2010 Successfully created stacked vias/HDI-SBU via-fill copper plating and blind microvias 4+N+4. 4+N+4. 2011 Acquired a new gold plating line (ImmAu, hard gold, soft bondable gold) and LDI for 2011 Acquired a new gold plating line (ImmAu, hard gold, soft bondable gold) and LDI for fine line/space of 2 mils. fine line/space of 2 mils.

2012 Acquired new Orbotech InCAM systems to enhance our CAM capability for HDI design 2012 Acquired new Orbotech InCAM systems to enhance our CAM capability for HDI design boards. boards. 2013 In April, we started offering fabrication services for multilayer flexible PCBs at our shop. 2013 In April, we started offering fabrication services for multilayer flexible PCBs at our shop. In May, direct laser drill superseded the opening copper window laser drill In May, direct laser drill superseded the opening copper window laser drill method, thus achieving Any-Layer Interstitial Via Hole (ALIVH) in HDI fabrication. method, thus achieving Any-Layer Interstitial Via Hole (ALIVH) in HDI fabrication. 2014 Applied laser micro-via filled copper plate and thru-hole copper plate at the same time, 2014 Applied laser micro-via filled copper plate and thru-hole copper plate at the same time, thus significantly reducing lead times for HDI PCB manufacturing, and effectively thus significantly reducing lead times for HDI PCB manufacturing, and effectively meeting market demand for quickturn HDI-SBUs. meeting market demand for quickturn HDI-SBUs.

Organization Chart Organization Chart

Effective June 11, 2014

General Manager Paul Lien

Administration & Production II Ivy Song Finance Dilys Huang Production I Human Resources Purchasing General Affairs Maintenance Security & Environmental Protection Accounting Finance Dry Film CU Plating Drill Solder Mask Mass Lamination NC Routing & V-Score Production Control & Production I HugKuo Wang

Chairman of the Board

QA Dept. Aaron Chao QA OQC QC FQC Production Control QA & Production III Jacky Chen Production Control Shipping Dept. E-Test Administration MIS Material warehouse Production II Production III Project CAM Dept. C.C Lee

Front-End Engineering Dept. Eric Lee

Sales Jeremy Chuang Oversea Sales Local Sales Gold AOI ENG & CAM Dept. Yc Chang

Revenue by Year Revenue by Year

Revenue Revenue

Revenue by Type of PCB Revenue by Type of PCB

2/L 10/L 8/L 6/L 4/L 12/L↑

Revenue by Sales Regions Revenue by Sales Regions

Asia 40% Australia 5% Europe 5% Others 5% USA 50%

Business Strategies Business Strategies

Main Focus Main Focus

 Quickturn prototype & small volume production Quickturn prototype & small volume production

• Engineering samples & prototypes.

Engineering samples & prototypes.

• Single-sided up to 42-layer count.
• Single-sided up to 42-layer count.
• Operating 24 hours a day, 7 days a week.
• Operating 24 hours a day, 7 days a week.

 Diversified products and services Diversified products and services

• Providing a variety of materials (i.e., PTFE, Teflon, etc.) for microwave
• Providing a variety of materials (i.e., PTFE, Teflon, etc.) for microwave

applications, metal core, rigid-flex, etc. Achieving more than you can applications, metal core, rigid-flex, etc. Achieving more than you can imagine. imagine.  Highest quality & reliable products Highest quality & reliable products

• Impeccable quality system support
• Impeccable quality system support
• Delivering high reliability PCBs
• Delivering high reliability PCBs

 On-time delivery

• Speedy Circuits: All that the name implies is quickness
• Speedy Circuits: All that the name implies is quickness.

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Fabrication Capabilities Fabrication Capabilities

Process Capability Process Capability

Specifications Capability 2010 2011 2012 2013 2014 Material FR 4 PTFE Polyimide PI FR 4 PTFE Polyimide PI FR 4 PTFE Polyimide PI FR 4 PTFE Polyimide PI FR 4 PTFE Polyimide PI

• Min. dielectric thickness

2 mil 2 mil 2 mil 2 mil 2 mil

• Max. layer count

40 42 42 46 50

• Max. working panel size

20“x30” 21“x31” 21“x31” 21“x31” 21“x31”

• Max. board thickness

.250“ .250“ .280“ .280“ .280“

• Min. board thickness

.016“(6L) .016“(6L) .016“(6L) .016“(6L) .016“(6L)

• Min. line/space

I/L 3/2.5 Mil 2.5/2.5 Mil 2/2 Mil 2/1.5 Mil 2/1.5 Mil O/L 3/2.5 Mil 2.5/2.5 Mil 2.5/2 Mil 2/2 Mil 2/2 Mil Warp 0.001“/in. 0.001“/in. 0.001“/in. 0.0008“/in. 0.0008“/in.

Specifications Capability 2010 2011 2012 2013 2014 BGA pitch 0.35mm 0.30mm 0.25mm 0.2mm 0.2mm Layer-to-layer registration 4 mil 3 mil 3 mil 3 mil 3 mil Finish hole size (min.) Mechanical drill .004“ .004“ .004“ .003“ .003“ Laser drill .004“ .003“ .003“ .0025“ .002 “ True-hole position +/-.002“ +/-.002“ +/-.002“ +/-.0015“ +/-.0015“ Finish hole size Tolerance PTH +/-.002“ +/-.002“ +/-.002“ +/-.0015“ +/-.0015“ Non-PTH +/-.001” +/-.001” +/-.001” +/-.001” +/-.001” Aspect ratio (board thickness/FHS) 20 20 20 24 30 Heavy copper Inner layer 6 OZ 6 OZ 6 OZ 6 OZ 10 OZ Outer layer 10 OZ 10 OZ 12 OZ 16 OZ 16 OZ

Specifications Capability 2011 2012 2013 2014 Buried/blind via Yes 4+N+4 Yes 9+N+9 Yes 9+N+9 Yes 10+N+10 Plasma desmear Yes Yes Yes Yes Outline tolerance +/-.004“ +/-.004“ +/-.004“ +/-.004“ Surface finish HASL ENIG Immersion silver OSP(ENTEK) Carbon Immersion tin Electrolytic gold HASL ENIG Immersion silver OSP(ENTEK) Carbon Immersion tin Electrolytic gold HASL ENIG Immersion silver OSP(ENTEK) Carbon Immersion tin Electrolytic gold HASL ENIG Immersion silver OSP(ENTEK) Carbon Immersion tin Electrolytic gold Impedance control +/-5% +/-5% +/-5% +/-5% RoHS compliant Yes Yes Yes Yes

HDI-SBU Microvias Capability

formed using laser drill with via filled copper plating. Plated filled blind microvia advantage.

• Reduces capture pad size of fine pitch BGA.

By reducing the via hole size, it significantly helps the designer to obtain more routing spaces.

• Reduces board real estate for slimming and portability purposes.

By reducing the board size and weight of the product, it improves the electrical performance of the system.

• Increases reliability

Providing stacked vias allows stronger interconnections and obtains better thermal management. This also significantly increases board reliability at more severe operation circumstances.

Conventional Plating A plated filled blind microvia

Filled Resin Plated Copper

Technology Roadmap Technology Roadmap

Technology Goals

Issue Goal Application Current 2014 2015

Status Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4

Heavy copper O/L copper 13~16 oz Cu Power module 12 oz I/L copper 7~10 oz Cu 6 oz Layer count/board thickness 50/10mm Back panel 46/6.5mm Aspect ratio 30:1 Back panel 24:1 Line/space/pad O/L 2/2/6 mil Flip chip 2/2/8 mil Drill hole size 3.9mil Flip chip 4.9 mil Layer-to-Layer registration 2 mil Flip chip 3 mil

Main Production Main Production Facilities Facilities

Production Facilities Production Facilities

Process Equipment Q’ty CAM engineering Par CAM (IGI), InCAM Film laser plotter (EIE SWISS) 30 3 Dry film UV exposure machine LDI (laser direct image) Thin core pre-treatment line Thin core etch/strip line CCD camera (punch A/W) Dry film laminator Automatic dry film laminator Thin core dry film developing line 4 2 1 1 1 3 1 1

Process Equipment Q’ty AOI system CAMTEK Orion 706 (6/6 mils) CAMTEK Orion 868 (4/4 mils) Orbotech Discovery-OLB (1.6/1.6 mil) Orbotech Fusion 22 (1/1 mil) 1 1 1 2 Gold plating Electrolytic hard gold plating line Electrolytic soft gold plating line Immersion gold plating line (ENIG) 1 1 1

Process Equipment Q’ty Lamination Automated black oxidation line Vacuum lamination hot press (Vigor) Vacuum lamination cold press (Vigor) Vacuum high-speed lamination machine (Vigor) Dual x-ray target drilling system (AbleTek) 1 6 1 1 1 Drilling NC drilling machine (52 spindles) Pre-treatment (belt scrubbing & micro-etch) Laser drill (Mitsubishi-ML605GTW -H) Ⅱ X-ray (registration controller) 10 1 1 1

Process Equipment Q’ty Copper plating Chemical desmear (permanganate) & PTH line Plasma desmear High-pressure hydraulic de-burr line Surface copper subtracted line Panel plating line Acid cupric chloride etching line HDI via filled copper plating (three baths) Pattern plating line Alkaline ammonia etching line 1 1 1 1 1 1 1 1 1

Process Equipment Q’ty Solder mask Surface pre-treatment line Semi-auto printing machine UV exposure machine (7 KW) Optical alignment exposure machine (8 KW) Solder mask developing line LED direct imaging (screen) 1 4 2 1 1 1 Silkscreen Printing workstation (manual) UV exposure machine (3 KW) for stencil Inkjet legend printer (Sprint-100 Orbotech) 3 1 2

Process Equipment Q’ty Fabrication CNC router machine (18 spindles) Beveling machine V-groove machine 6 1 1 Electrical test Dedicated tester (SINK) Flying probe type testers Emma (ELX6146-limitation by 5 mils) Emma (E4M6151-limitation by 2 mils) Mania (U8-Board size 24” x 27” Max.) 1 7 1 1 TDR measurement Polar CITS500S Polar CITS900S4 Agilent E5063A ENA Series network analyzer 1 1 1 FQC Hole counter IR reflow Final cleaning machine 1 1 1 Shipping Vacuum packaging machine 2

Quality Assurance Quality Assurance

QA Department & Function

Engineer: 5 Inspector: 4 Engineer: 5 Inspector: 24 Engineer: 4 Inspector: 22

• 1. In-process audit
• 2. Incoming inspections
• 3. Rejected material review
• 4. Supplier quality check
• 1. QS maintenance
• 2. FA inspection
• 3. Reliability test
• 4. Equipment calibration
• 5. Customer service
• 1. 100% visual inspection
• 2. Outgoing quality inspections

& tests

• 3. Microsection inspection
• 4. Impedance measurement
• 5. Dimension measurement

ISO9001: 2008 certified by NSF-ISR since 2000

Quality Management

UL registered

certified by UL since 2003

Quality Process

 IPQC  Chemical laboratory  Physical Laboratory  Micro-section  Lamination thickness measurement  L/S measurement control  CMI control copper thickness  Impedance control measurement

In-process Control

 Thermal stress test 288 10 sec. ℃  Ionic contamination test  IR reflow test  Electrical test  Peeling tests on solder mask & legend ink  Hi-pot test  Impedance TDR measurement

Reliability Tests

QA Systems & QA Systems & Final Inspections Final Inspections

Outgoing Inspections

Fabricating in accordance with quality standards under the following criteria: IPC-6011, IPC-6012, IPC-6013 and IPC-A-600G. Also conduct following test procedures:

• Visual inspection
• Electrical test
• Physical dimensions - Board thickness
• Hole size & hole status
• Tape test on gold plating and S/M
• PTH copper thickness
• Board bending & warpages check
• Layer-to-layer registration
• Solderability test
• Impedance TDR measurement
• Other special requirements as per customers’ requests

YOU are our most valuable client. We look forward to supplying your next prototype board requirements

Speedy Circuits