Thermal Challenges for Future Telecom Spacecraft and their relation to the ARTES-5 2006 Workplan ESTEC 12 th April 2006 W. Supper (TEC-MCT) 1
Thermal Control for Future Telecom Missions Thermal Control for Future Telecom Missions Thermal Challenges: • Higher dissipation onboard Thermal Solutions: • Denser packing of electronics • Mini HP & LHP • Need for more radiator area • Higher Performance HP & LHP • Increased temperatures • Higher Temperature HP & LHP • Competitiveness • Deployable Radiators • Non-Dependance • New Radiator Solutions • “Integrated” Thermal Design • Development of European Products • Mechanically Pumped Heat Transfer Technologies ESTEC 12 th April 2006 W. Supper (TEC-MCT) 2
HP & LHP Harmonisation and Road Maps HP & LHP Harmonisation and Road Maps • In 2003 a European Harmonisation exercise took place, concentrating on Heat Pipes and Capillary Pumped Two Phase Loops • Mechanically pumped loops were explicitly excluded at that time • A number of activities were identified and roadmaps for these two technologies were established • These roadmaps covered all applications, e.g. Telecom, Science, Earth Observation, etc. • In the following, the activities with direct relevance for Telecom will be discussed in more detail ESTEC 12 th April 2006 W. Supper (TEC-MCT) 3
Heat Pipe Roadmap Heat Pipe Roadmap Status May 2003 Status May 2003 Budget (kEuro) 2003 2004 2005 2006 Programme Appr. Proposed LINE of ACTIVITY A High Temperature Constant Conductance Heat Pipes 300 Artes 8 High Performance Constant Conductance Heat Pipes 300 Artes 8 Low Temperature/Cryogenic Heat Pipes 400 GSTP (EHP (B)) Mini/Micro Heat Pipes 300 TRP (Open Comp.) Mass/Performance Improvement of Standard HP's 350 TBD In-Orbit Demonstration Test Bed for 2-Phase Technology 500 TRP/GSTP 2-Phase Flight Demonstration I 500 (?) / flight TRP/GSTP/TFO 2-Phase Flight Demonstration II 500 (?) / flight TRP/GSTP/TFO Note: The planning has not been updated ESTEC 12 th April 2006 W. Supper (TEC-MCT) 4
Capillary Pumped Loop Roadmap Capillary Pumped Loop Roadmap Status May 2003 Status May 2003 Budget (kEuro) 2003 2004 2005 2006 Programme Approv Proposed LINE of ACTIVITY A High Performance Loop Heat Pipes 500 Artes 8 Characterisation of Multi Fluid Loops in a large Deployable Radiator 500 Artes 8 Mini-TPL (CPL+LHP) Lifetesting and Long term stability 200 TRP/GSTP Flat TPL-Eveporator 300 GSTP (EHP) (B) TPL with Alternate Working Fluids (e.g.Propylene) 250 TBD Low Temperature/Cryogenic CPL & LHP 400 TRP/CTP High Temperature CPL & LHP 300 TRP Novel, Composite Wicks 350 TRP Lifetesting of New Concepts 200 GSTP _ _ _ _ Note: The planning has not been updated ESTEC 12 th April 2006 W. Supper (TEC-MCT) 5
Current Status with HP Activities related to Telecom Current Status with HP Activities related to Telecom • HPCCHP (ARTES-8): Ongoing development of high performance heat pipe prototypes to meet the @Bus requirements (500 – 700 Wm heat transport capability) • HTCCHP (ARTES-8): Ongoing development of high temperature heat pipe prototypes to meet the requirements (i.e. 100-200 Wm up to 150 o C); novel concept has been identified with very promising results • Mini HP (planned TRP): activity has been postponed in the TRP workplan; however this activity should be started soon, as there is strong interest in this technology for e.g. Focal Array thermal control • In-Orbit Demonstration of HP: – Successful HEAT: Existing re-entrant groove heat pipe has been successfully demonstrated onboard ISS (MSG) showing good results and confirming the theoretical zero-g predictions – Planned TEPLO on Foton M3: In-orbit demonstration of newly developed high performance HP design (larger diameter); goal is to investigate the zero-g performance of this new device, in order to more efficiently design future TCS ESTEC 12 th April 2006 W. Supper (TEC-MCT) 6
Current Status with Two- -Phase Loop Activities Phase Loop Activities Current Status with Two related to Telecom (I) related to Telecom (I) • HPLHP (ARTES-8): New concept of an advanced, high performance LHP has been developed, supported by extensive analysis and breadboard testing; CDR is planned for end April. • Characterisation of Multi Fluid Loops in a large Deployable Radiator (ARTES-8): Activity has not yet started; however in the frame of the recently started @Sat TDP DPR phase A activity, this activity should be started soon. • Mini TPL (CPL & TPL) Design Improvements and Longterm Stability: Activity is programmed in GSTP-4; goal is to further reduce the size to comply with the new, smaller interfaces and the resulting denser packing inside electronic units. ESTEC 12 th April 2006 W. Supper (TEC-MCT) 7
Current Status with Two- -Phase Loop Activities Phase Loop Activities Current Status with Two related to Telecom (II) related to Telecom (II) • Novel, Composite Wicks (programmed in TRP 2006): In the frame of the HPLHP activity, the interest for improved, composite wicks was confirmed; goal of this activity is to develop such a composite wick to further improve the LHP technology with respect to heat transport, start-up behaviour and especially operational robustness. • MiniTherm (Foton M2): Successful flight demonstration of a miniature LHP onboard Russian capsule FOTON M2; all performances were successfully verified and the device performed flawlessly in zero-g. • Planned Flight Demo HPLHP: As part of the TEPLO experiment it is planned to verify and demonstrate the zero-g behaviour of the HPLHP, in order to increase its maturity and acceptance level. ESTEC 12 th April 2006 W. Supper (TEC-MCT) 8
Additional Thermal Activities for Telecom Additional Thermal Activities for Telecom • Mechanically Pumped Fluid Loop (ARTES-8): For (very) large Telecom S/C (above 20 kW payload power), a mechanically pumped heat transport loop could offer advantages concerning transported heat, distance and especially operation/testing aspects in 1-g; a complete pump package (mechanical pump, reservoir, drive electronics) and by- pass assembly are being developed, manufactured and will be tested at QM level. • MEMS Louvres (ARTES-5): Development of novel type louver, which could be used to “close” a radiator when exposed to solar input; such a concept would allow to make use of E/W surfaces on a telecom S/C for radiators for e.g. battery thermal control on the SM or for implementation of cooled LNA on the CM. ESTEC 12 th April 2006 W. Supper (TEC-MCT) 9
ARTES- -5 5 Workplan Workplan 2006 2006 ARTES The following thermal or thermal-related activities are included in the current ARTES-5 workplan: • High Temperature Loop Heat Pipe • Active Antennas Thermal Dissipation Management • Thermal Control for Spacecraft Propellant Lines • Loop Heat Pipe with Integrated Peltier Element • Low-CTE Heat Pipe • Development of a European Large Range Thermistor ESTEC 12 th April 2006 W. Supper (TEC-MCT) 10
High Temperature Loop Heat Pipe High Temperature Loop Heat Pipe • Objective: Design, manufacture and test breadboards of LHP for temperature range 100 o C to 150/200 o C and integration into appropriate radiator panel • Background: Next generation of GaN SSPA’s will operate at higher temperatures (above 100 o C) => possibility to design radiators at higher temperatures with resulting higher heat rejection capabilities � Need for efficient heat transfer tools for such temperatures to bring the heat from units to such radiators (hp’s for similar temperature range are being developed in ongoing ARTES-8 activity) • Planned Work: – Extensive trade-off supported by sample testing – Design, manufacture and test of LHP breadboard (stand-alone) – Integration of LHP breadboard into radiator panel and performance of test programme • Programmatics: 600 kEuro; Open Competition C; 24 months; Issue Date: 2 nd quarter 2006; Priority:1 ESTEC 12 th April 2006 W. Supper (TEC-MCT) 11
Active Antennas Thermal Dissipation Management Active Antennas Thermal Dissipation Management • Objective: Identification of solutions for thermal management of active arrays antenna and to breadboard and test associated critical technologies • Background: More and more power is requested from Active Array Antennas leading to higher power dissipation and the associated thermal control becomes more and more challenging =>implementation of thermal solutions (e.g. heat pipes, loop heat pipes) at an very early stage of antenna design can drastically improve the situation � Need to identify and demonstrate an integrated thermal design with improved performances • Planned Work: – Extensive trade-off of technologies and thermal control architectures – Design, manufacture and test of an active array antenna breadboard with integrated thermal concept • Programmatics: 300 kEuro; Open Competition C; 12 months; Issue Date: 3 rd quarter 2006; Priority: 1 ESTEC 12 th April 2006 W. Supper (TEC-MCT) 12
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