Thermal Challenges for Future Telecom Spacecraft and their - - PowerPoint PPT Presentation

ESTEC 12th April 2006

• W. Supper (TEC-MCT)

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Thermal Challenges for Future Telecom Spacecraft and their relation to the ARTES-5 2006 Workplan

ESTEC 12th April 2006

• W. Supper (TEC-MCT)

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Thermal Control for Future Telecom Missions Thermal Control for Future Telecom Missions

Thermal Challenges:

• Higher dissipation onboard
• Denser packing of electronics
• Need for more radiator area
• Increased temperatures
• Competitiveness
• Non-Dependance

Thermal Solutions:

• Mini HP & LHP
• Higher Performance HP & LHP
• Higher Temperature HP & LHP
• Deployable Radiators
• New Radiator Solutions
• “Integrated” Thermal Design
• Development of European Products
• Mechanically Pumped Heat Transfer

Technologies

ESTEC 12th April 2006

• W. Supper (TEC-MCT)

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HP & LHP Harmonisation and Road Maps HP & LHP Harmonisation and Road Maps

• In 2003 a European Harmonisation exercise took place, concentrating
• n Heat Pipes and Capillary Pumped Two Phase Loops
• Mechanically pumped loops were explicitly excluded at that time
• A number of activities were identified and roadmaps for these two

technologies were established

• These roadmaps covered all applications, e.g. Telecom, Science, Earth

Observation, etc.

• In the following, the activities with direct relevance for Telecom will be

discussed in more detail

ESTEC 12th April 2006

• W. Supper (TEC-MCT)

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Heat Pipe Roadmap Heat Pipe Roadmap

Status May 2003 Status May 2003

Note: The planning has not been updated Appr. Proposed 300 Artes 8 300 Artes 8 400 GSTP (EHP (B)) 300 TRP (Open Comp.) 350 TBD 500 TRP/GSTP 500 (?) / flight TRP/GSTP/TFO 500 (?) / flight TRP/GSTP/TFO 2006

LINE of ACTIVITY A

High Temperature Constant Conductance Heat Pipes High Performance Constant Conductance Heat Pipes Budget (kEuro) Programme 2003 2005 2004 Low Temperature/Cryogenic Heat Pipes Mass/Performance Improvement of Standard HP's Mini/Micro Heat Pipes 2-Phase Flight Demonstration II 2-Phase Flight Demonstration I In-Orbit Demonstration Test Bed for 2-Phase Technology

ESTEC 12th April 2006

• W. Supper (TEC-MCT)

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Capillary Pumped Loop Roadmap Capillary Pumped Loop Roadmap

Status May 2003 Status May 2003

Note: The planning has not been updated Approv Proposed 500 Artes 8 500 Artes 8 200 TRP/GSTP 300 GSTP (EHP) (B) 250 TBD 400 TRP/CTP 300 TRP 350 TRP 200 GSTP _ _ _ _ 2004 2005 Lifetesting of New Concepts 2006 Novel, Composite Wicks Mini-TPL (CPL+LHP) Lifetesting and Long term stability TPL with Alternate Working Fluids (e.g.Propylene) High Temperature CPL & LHP Flat TPL-Eveporator Low Temperature/Cryogenic CPL & LHP Budget (kEuro) Programme 2003

LINE of ACTIVITY A

High Performance Loop Heat Pipes Characterisation of Multi Fluid Loops in a large Deployable Radiator

ESTEC 12th April 2006

• W. Supper (TEC-MCT)

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Current Status with HP Activities related to Telecom Current Status with HP Activities related to Telecom

• HPCCHP (ARTES-8): Ongoing development of high performance heat

pipe prototypes to meet the @Bus requirements (500 – 700 Wm heat transport capability)

• HTCCHP (ARTES-8): Ongoing development of high temperature heat

pipe prototypes to meet the requirements (i.e. 100-200 Wm up to 150

• C); novel concept has been identified with very promising results
• Mini HP (planned TRP): activity has been postponed in the TRP

workplan; however this activity should be started soon, as there is strong interest in this technology for e.g. Focal Array thermal control

• In-Orbit Demonstration of HP:

– Successful HEAT: Existing re-entrant groove heat pipe has been successfully demonstrated onboard ISS (MSG) showing good results and confirming the theoretical zero-g predictions – Planned TEPLO on Foton M3: In-orbit demonstration of newly developed high performance HP design (larger diameter); goal is to investigate the zero-g performance of this new device, in order to more efficiently design future TCS

ESTEC 12th April 2006

• W. Supper (TEC-MCT)

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Current Status with Two Current Status with Two-

• Phase Loop Activities

Phase Loop Activities related to Telecom (I) related to Telecom (I)

• HPLHP (ARTES-8): New concept of an advanced, high performance

LHP has been developed, supported by extensive analysis and breadboard testing; CDR is planned for end April.

• Characterisation of Multi Fluid Loops in a large Deployable Radiator

(ARTES-8): Activity has not yet started; however in the frame of the recently started @Sat TDP DPR phase A activity, this activity should be started soon.

• Mini TPL (CPL & TPL) Design Improvements and Longterm Stability:

Activity is programmed in GSTP-4; goal is to further reduce the size to comply with the new, smaller interfaces and the resulting denser packing inside electronic units.

ESTEC 12th April 2006

• W. Supper (TEC-MCT)

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Current Status with Two Current Status with Two-

• Phase Loop Activities

Phase Loop Activities related to Telecom (II) related to Telecom (II)

• Novel, Composite Wicks (programmed in TRP 2006): In the frame of

the HPLHP activity, the interest for improved, composite wicks was confirmed; goal of this activity is to develop such a composite wick to further improve the LHP technology with respect to heat transport, start-up behaviour and especially operational robustness.

• MiniTherm (Foton M2): Successful flight demonstration of a miniature

LHP onboard Russian capsule FOTON M2; all performances were successfully verified and the device performed flawlessly in zero-g.

• Planned Flight Demo HPLHP: As part of the TEPLO experiment it is

planned to verify and demonstrate the zero-g behaviour of the HPLHP, in order to increase its maturity and acceptance level.

ESTEC 12th April 2006

• W. Supper (TEC-MCT)

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Additional Thermal Activities for Telecom Additional Thermal Activities for Telecom

• Mechanically Pumped Fluid Loop (ARTES-8): For (very) large Telecom

S/C (above 20 kW payload power), a mechanically pumped heat transport loop could offer advantages concerning transported heat, distance and especially operation/testing aspects in 1-g; a complete pump package (mechanical pump, reservoir, drive electronics) and by- pass assembly are being developed, manufactured and will be tested at QM level.

• MEMS Louvres (ARTES-5): Development of novel type louver, which

could be used to “close” a radiator when exposed to solar input; such a concept would allow to make use of E/W surfaces on a telecom S/C for radiators for e.g. battery thermal control on the SM or for implementation of cooled LNA on the CM.

ESTEC 12th April 2006

• W. Supper (TEC-MCT)

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ARTES ARTES-

• 5

5 Workplan Workplan 2006 2006

The following thermal or thermal-related activities are included in the current ARTES-5 workplan:

• High Temperature Loop Heat Pipe
• Active Antennas Thermal Dissipation Management
• Thermal Control for Spacecraft Propellant Lines
• Loop Heat Pipe with Integrated Peltier Element
• Low-CTE Heat Pipe
• Development of a European Large Range Thermistor

ESTEC 12th April 2006

• W. Supper (TEC-MCT)

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High Temperature Loop Heat Pipe High Temperature Loop Heat Pipe

• Objective: Design, manufacture and test breadboards of LHP for

temperature range 100oC to 150/200oC and integration into appropriate radiator panel

• Background: Next generation of GaN SSPA’s will operate at higher

temperatures (above 100oC) => possibility to design radiators at higher temperatures with resulting higher heat rejection capabilities Need for efficient heat transfer tools for such temperatures to bring the heat from units to such radiators (hp’s for similar temperature range are being developed in ongoing ARTES-8 activity)

• Planned Work:

– Extensive trade-off supported by sample testing – Design, manufacture and test of LHP breadboard (stand-alone) – Integration of LHP breadboard into radiator panel and performance of test programme

• Programmatics: 600 kEuro; Open Competition C; 24 months; Issue

Date: 2nd quarter 2006; Priority:1

ESTEC 12th April 2006

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Active Antennas Thermal Dissipation Management Active Antennas Thermal Dissipation Management

• Objective: Identification of solutions for thermal management of active

arrays antenna and to breadboard and test associated critical technologies

• Background: More and more power is requested from Active Array

Antennas leading to higher power dissipation and the associated thermal control becomes more and more challenging =>implementation of thermal solutions (e.g. heat pipes, loop heat pipes) at an very early stage of antenna design can drastically improve the situation Need to identify and demonstrate an integrated thermal design with improved performances

• Planned Work:

– Extensive trade-off of technologies and thermal control architectures – Design, manufacture and test of an active array antenna breadboard with integrated thermal concept

• Programmatics: 300 kEuro; Open Competition C; 12 months; Issue Date:

3rd quarter 2006; Priority: 1

ESTEC 12th April 2006

• W. Supper (TEC-MCT)

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Thermal Control for Spacecraft Propellant Lines Thermal Control for Spacecraft Propellant Lines

• Objective: Design, manufacture and test a breadboard of a new thermal

control technology concept for propellant lines, ensuring the functions of heating, heat spreading and insulation

• Background: Currently propellant line thermal hardware implementation

is a very time-consuming and costly activity during spacecraft integration => related thermal modelling activities are also quite complex and costly A novel approach is needed to – on one side drastically reduce the integration time and complexity and – on the other side reach a design easier to predict and model

• Planned Work:

– Review and re-assess current propellant line requirements – Review/survey all components for providing above functions – Define the concept for such a new integrated approach – Design, manufacture and test of a breadboard model – Perform dedicated correlation to demonstrate reduced complexity and improved performance

• Programmatics: 500 kEuro; Open Competition C; 30 months; Priority: 2

ESTEC 12th April 2006

• W. Supper (TEC-MCT)

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Loop Heat Pipe with Integrated Loop Heat Pipe with Integrated Peltier Peltier Element Element

• Objective: Design, manufacture and test a breadboard of a LHP with

integrated Peltier element to improve the operational features

• Background: Currently, when designing a LHP thermal control system,

efforts are needed to reduce parasitic heat losses and even then part of the radiator area is needed to provide necessary subcooling => integration

• f Peltier could increase the radiator efficiency (no need for subcooling),

simplify integration aspects, improve operability (e.g. start-up and temperature control) Need for a novel LHP-Peltier concept

• Planned Work:

– Extensive review/assessment of Peltiers for space application – Design, manufacture and test of LHP breadboard with integrated Peltier – Performance of comprehensive test programme – Comparison with conventional LHP performance, covering also system level aspects

• Programmatics: 400 kEuro; Open Competition C(4); 24 months; Priority: 2
• Note: Recent information that Peltier elements have apparently been put on the ITAR-list will

require to emphasize the tasks to identify a European Peltier supplier within this activity.

ESTEC 12th April 2006

• W. Supper (TEC-MCT)

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Low Low-

• CTE Heat Pipe

CTE Heat Pipe

• Objective: Design, manufacture and test a breadboard of a low-CTE

Heat Pipe to solve the issues caused by the CTE mismatch between CFRP-panels and current HP’s

• Background: Use of more and more CFRP-based panels lead to major

problem when integrating existing heat transfer tools (e.g. Al heat pipes) due to the CTE mismatch => attempts to solve the problem by specific lay-ups and bonding techniques have so far not been successful Need to develop new type of heat pipe with a CTE similar to that of the panels.

• Planned Work:

– Extensive trade-off covering materials, fluids and manufacturing techniques – Design, manufacture and test of low-CTE Heat Pipe breadboards (stand- alone) – Integration of HP breadboard into CFRP-radiator panel and performance of test programme (mechanical and thermal)

• Programmatics: 700 kEuro; Open Competition C; 24 months; Priority: 2

ESTEC 12th April 2006

• W. Supper (TEC-MCT)

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Development of a European Large Range Development of a European Large Range Thermistor Thermistor

• Objective: Design, manufacture and test at EM level a large temperature

range thermistor [-200 oC to +220 oC], covering also the potting technique.

• Background: A current European programme is qualifying a thermistor for

the temperature range -60 oC to +160 oC => for a number of S/C elements e.g. sensors, thrusters, antenna parts, MLI, solar panels this temperature range is not sufficient and current solutions are only available from outside Europe Need to develop a European large temperature range thermistor including the associated potting/fixation technique

• Planned Work:

– Assess existing European products and available potting techniques – Perform all necessary upgrades/adaptations to reach a qualifiable product – Manufacture and test the large temperature range thermistor at EM level

• Programmatics: 200 kEuro; Open Competition C(1); 24 months; Priority: 2

ESTEC 12th April 2006

• W. Supper (TEC-MCT)

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Conclusions Conclusions

• The 2006 ARTES-5 workplan in the area of thermal control is fully in

line with the Heat Pipe and Two-Phase Loop Harmonisation and Roadmap approach defined in 2003, either directly addressing activities from the roadmaps or proposing further improvements and upgrades.

• One additional activity “Active Antennas Thermal Dissipation

Management”, judged as highly important for telecom applications, has also been included in line with the harmonisation on Arrays Antennas and will be closely coordinated with antenna experts.

• Two other activities “Thermistor Development and Propellant Line

Thermal Control” directly address the aspects of non-dependance and increase of competitiveness. Support from all relevant delegations is strongly requested in order to be able to implement the proposed activities

For any further information: Wolfgang Supper Head of Thermal & Environmental Control Section ESTEC TEC-MCT Wolfgang.Supper @esa.int