SURFACE- -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES - - PowerPoint PPT Presentation

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SURFACE- -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES - - PowerPoint PPT Presentation

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SURFACE- -MOUNTING OF POWER DEVICES MOUNTING OF POWER DEVICES SURFACE TO ALUMINUM HEAT SINKS TO ALUMINUM HEAT SINKS SMTA PanPacific Jim Fraivillig Fraivillig Technologies Thermal Management Boston, MA Hawaii March 11, 2004 SURFACE-

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SMTA PanPacific Thermal Management Hawaii March 11, 2004

Jim Fraivillig Fraivillig Technologies Boston, MA

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SLIDE 2

PowerSite technology PowerSite technology

.

  • Convert aluminum heat sinks to surface-mount

applications => solder-on power devices

  • Heat-seal copper to aluminum with all-polyimide

‘TPI’ bond film insulation

  • Excellent thermal management
  • Improved performance with lower cost
  • Patented

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SLIDE 3

POWERSITE TM

POLYIMIDE ADHESIVE (thermoplastic, 0.15 mil)

HEAT SINK

(Aluminum)

COPPER

Heat-seal lamination

TPI FILM

Performance advantages of PowerSites:

  • Thin, highly thermally-conductive insulation
  • All-polyimide durability
  • Any heat sink
  • No device attachment hardware
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SLIDE 4

TPI bond film

  • All-polyimide
  • Heat-seals at 250-300oC

to aluminum

  • 200C operation OK
  • 300C exposure OK

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SLIDE 5

Next-Generation Thermal Management

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THERMAL INTERFACE Introduction Mica/grease 1940s Sil-Pads 1960s Ceramic (DBC) 1960s Insulated metal substrate (IMS) 1980s PowerSites 2000

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Typical PowerSiteTM design conversion

Conventional Method with Thermal Pads, Screws, Nuts, Clamps

PowerSite Assembly

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SLIDE 8

FT’s FT’s TPI TPI-

  • based technologies

based technologies

ALL-POLYIMIDE ‘TPI’ BOND FILM

  • Sold as stand-alone insulation in

punched parts

  • Kapton MT + thin coating of

thermoplastic polyimide adhesive (0.15 mil each side)

  • Used as basis of other FT products

‘POWERSITE’ SOLDERABLE PADS

  • Mounting discrete power devices to

heat sinks

  • Present market standard: Sil-Pads with

attachment hardware

  • Patented

‘POWERVIA’ THERMAL COLUMNS

  • Mounting discrete power devices on

PCB, providing thermal path to heat sink

  • Present market standard: Plated-thru

holes + Sil-Pad

  • Patented

‘POWERFLEX’ PRINTED CIRCUITS

  • Power circuit pattern bonded to

aluminum heat sink

  • Present market standard: IMS (‘Thermal

Clad’)

  • Patents pending
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SLIDE 9

PowerFlexTM applications

  • TPI printed circuits, bonded to...
  • Aluminum baseplates

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SLIDE 10

PowerFlex PowerFlexTM

TM flexible interconnects

flexible interconnects

DESIGN OPTIONS:

  • Layer interconnection

(to control board)

  • Reduce ‘footprint’

(‘brick’ size)

  • Increase

power density

  • Bond to any

heat sink

TPI bond film

(on PCB bottom-side)

Conventional PCB

(FR4 epoxy glass)

Stamped heat sinks

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SLIDE 11

PowerVia technology PowerVia technology Optimal through Optimal through-

  • hole thermal transfer

hole thermal transfer

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SLIDE 12

PowerVias for D2Paks PowerVias inserted into PCB

PowerVia technology PowerVia technology Optimal through Optimal through-

  • hole thermal transfer

hole thermal transfer

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SLIDE 13

Comparison of PowerVia Comparison of PowerVia with with conventional thermal via conventional thermal via

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SLIDE 14

PowerSite thermal comparisons PowerSite thermal comparisons

Versus insulator pads Versus IMS

“Laminated copper” = PowerSite technology

SOURCE: Parker Chomerics Technical study, 2000

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SLIDE 15

PowerSite thermal comparisons PowerSite thermal comparisons

Versus insulator pads Versus IMS

“Laminated copper” = PowerSite technology

SOURCE: Parker Chomerics Technical study, 2000

PowerSiteTM advantage: TO-220 2o C/W TO-247 1o C/W

(compared to alumina-filled pad material)

PowerSiteTM pads are equivalent to IMS

(alumina-filled IMS material)

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SLIDE 16

PowerFlex PowerFlexTM

TM thermal transfer performance

thermal transfer performance

COMPARISON:

  • TPI single-layer
  • IMS single-layer
  • Tested with Anatech pulse

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SLIDE 17

PowerVia PowerVia™ thermal transfer testing thermal transfer testing

D2Pak PowerVias Thermal vias

Thermal resistance testing of D2Pak (R j-s), using Anatech pulse tester:

  • Conventional thermal via

(plated-thru-hole + insulation pad + attachment hardware)

  • Cylindrical column

PowerVia

  • Rectangular column

PowerVia

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SLIDE 18

NOTE:

  • Thermal resistance is junction-to-sink.
  • Anatech measurement taken at steady-state.
  • PCB secured to heat sink on PCB edges only

(50-100 psi?).

  • Thermal via + pad thermal resistance is about

7oC thru the power device+PCB and 4oC/W thru the insulation pad.

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SLIDE 19

Pressure dependency not a factor with PowerVias Pressure dependency not a factor with PowerVias

Conventional thermal vias require insulation pads… …insulations pads require high-pressure to optimize thermal transfer to the heat sink.

PowerVias use non-isolating

thermal grease or phase-change material… ….these thermal compounds have little pressure dependency (and very high thermal transfer).

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Thermal Impedance vs Pressure

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 50 100 150 200 Pressure (psi) Thermal Impedance (oC-in2/W)

Insulated pad Phase-change Thermal grease

Isolated Non-isolated

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SLIDE 20

PowerSite PowerSiteTM

TM thermal durability

thermal durability

ALL-POLYIMIDE:

  • 200oC continuous
  • 300oC exposure
  • No-lead solder,

no problem

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NOTE: PowerFlex and PowerVias use same TPI bond film, and have same thermal durability.

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SLIDE 21

PowerSite technical challenges PowerSite technical challenges

.

  • Technology inertia
  • Heat-seal processing
  • Compatible PCB materials,

configurations

  • Heat sink surface
  • Heat sink size and shape
  • Volume drives cost

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SLIDE 22

PowerSite applications PowerSite applications

.

  • Telcom power supplies
  • Portable devices
  • Automotive controls
  • Multi-chip modules
  • Thermally-demanding

applications, where cost and reliability are critical

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PowerSite worldwide supply PowerSite worldwide supply

.

Fraivillig Technologies – developed PowerSites, PowerFlex and PowerVias

www.Fraivillig.com

EIS Fabrico – U.S. technology licensee

www.Fabrico.com

Union Bridge – Asian licensee

www.Union-Bridge.com

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