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Supplying the Suppliers Challenges Facing the Litho and Surface - PowerPoint PPT Presentation

Supplying the Suppliers Challenges Facing the Litho and Surface Preparation Supply Chain Kevin J. McLaughlin, PhD SACHEM, Inc. CMC Seminar 2017, Hsinchu, Taiwan Outline SACHEM market position Supply chain challenges Supply chain


  1. Supplying the Suppliers Challenges Facing the Litho and Surface Preparation Supply Chain Kevin J. McLaughlin, PhD SACHEM, Inc. CMC Seminar 2017, Hsinchu, Taiwan

  2. Outline ► SACHEM market position ► Supply chain challenges ► Supply chain challenge case study ► Recommendations to the overall supply chain External use 2

  3. “SACHEM is a global chemical science company specializing in extremely pure, precise, and innovative chemistry products and services critical to our customers’ manufacturing processes” External use 3

  4. SACHEM has established leading positions in key grow th markets through technical expertise, revolutionary service, and an unw avering commitment to safety and the environment. Electronic Materials Energy Materials Structured Materials Specialties External use 4

  5. SACHEM: Supplier and Sub-Supplier Solvents Amines Salts Packaging SACHEM Formulations Developer Manufacturers Manufacturers IC Manufacturers LITHO ETCH CMP CLEANS STRIP External use 5

  6. Supply Chain Challenges I ► Supplier, sub-supplier management ♦ Petrochemical-based raw materials ♦ Unmotivated suppliers ► Chemical classification/labelling ♦ GHS not global, not harmonized ► Fractured regulatory landscape ♦ Registration, testing requirements vary by region ♦ Costly, variable, unpredictable registration timelines ► Management of Change moving upstream ♦ Freezes supply chain much earlier in development, limiting innovation ♦ Creates tension between node development, node lifetime ► Quality roadmap outpacing metrology ♦ Controlling what you can’t see ► Supply chain integrity – 1 st /2 nd /3 rd order effects ♦ Supplier, sub-supplier, packaging for both, logistics for all ♦ 2017 hurricanes provided new insights into supply chain dependencies External use 6

  7. Supply Chain Challenges II ► Demands for local supply ♦ Challenges economies of scale ► Regional, local challenges ♦ China’s pollution crackdown ► Commoditization ♦ Denial of value ► Customization ♦ 1 $50M product vs. 50 $1M products ► Dynamics of chemical status ♦ Governmental regulations ♦ Customer banned lists ♦ “No new sources” ► Product stewardship: Cradle to Grave has become Cradle to Cradle ♦ Minimize waste, waste disposal ♦ Waste composition (e.g. nitrogen content) ♦ Recycle External use 7

  8. Case Study: Quality and Quality Systems ► The Objective: Supply ultra-high purity quaternary hydroxide to customer for leading-edge application ♦ Metrology challenges  Metals  Particles ♦ Packaging challenges  As-packaged vs. as-delivered performance ♦ IP Security challenges  Fingerprinting External use 8

  9. Electronic Materials Purity Requirements 25% TMAH Quality Roadmap 10,000 10,000 Technology Node Measured particle size (nm) 32 – 45 nm 1,000 1,000 Metals (ppt) 22 – 28 nm 100 100 14 – 16 nm Current Metrology Limits 10 – 7 nm Current Metrology Limits 10 10 5 – 3 nm 1 1 2014 2015 2016 2017 2018 2019 2020 External use 9

  10. Supply Chain and Metrology Clash •Metal-free raw materials •Metal-free process flow Manufacturing •Purification and filtration •Metals <25 ppt Bulk Delivery •Filtration @ 30-50 nm •Metals <25 ppt Facility Side •Filtration @ 30 nm •Metals <2.5 ppt Dilution/Chemical •Filtration @ 10-20 nm Distribution •Metals <2.5 ppt Tool Side •Filtration @ 2-5 nm 10 External use

  11. Metrology: Metals Ag 15 ppt K 50 ppt • Number of required metals Al 15 ppt Li 50 ppt As 50 ppt Mg 25 ppt continues to increase Mn 15 ppt Au 50 ppt • Increases likelihood of OOC B 300 ppt Mo 50 ppt event Ba 50 ppt Na 50 ppt • Metals levels as low as 10ppt Be 50 ppt Ni 15 ppt require ICP-MS detection Ca 100 ppt Pb 50 ppt limits at 1ppt Cd 50 ppt Rb 50 ppt • Extremely difficult to achieve Co 15 ppt Sn 50 ppt in 25% TMAH matrix Cr 15 ppt Sr 50 ppt Cs 50 ppt Ta 50 ppt • Current metrology limits Cu 25 ppt Ti 50 ppt closer to 10ppt Fe 10 ppt Tl 50 ppt • Metrology method Ga 50 ppt V 50 ppt development required for Hg 50 ppt W 50 ppt each metal measured Ir 15 ppt Zn 25 ppt 11 External use

  12. Metrology: Particles • State-of-the-art commercial LPC measurement can measure down to 30nm particles Existing Requested • Significant interferences require extreme >0.5µm 7 N/A care in product sampling and analytical sample preparation >0.2µm 70 N/A • Microbubbles primary interference in >0.1µm 500 250 manufacturing, packaging, transportation • Requires harmonization of sampling, >0.04µm N/A 500 measurement procedures between >0.03µm N/A Report supplier, customer to insure reproducible results >0.02µm N/A Report • Measurement requested to 20nm, not yet commercially available • Additional method development required 12 External use

  13. Product Packaging Effects • Packaging well-known to affect product quality • Leaching of metals, organics 5000 • Shedding of particles 4500 Particle Count (#/ml) • Effects increase exponentially with 4000 3500 severity of purity specifications 3000 • Sufficiently clean packages order of 2500 As-produced magnitude more expensive than 2000 As-delivered 1500 packages historically used 1000 • Reusable packages used in closed- 500 loop systems can meet purity 0 0.5 0.2 0.1 0.04 requirements Particle Size (µm) • Customers generally require dedicated packaging return loops, greatly complicating logistics, inventory management 13 External use

  14. Product Fingerprinting • Increasing requests for product fingerprinting to evaluate “unknown unknowns” • Creates potential Intellectual Property concerns • Raw material, manufacturing, and purification IP can be compromised through evaluation of fingerprinting data 14 External use

  15. Recommendations to the Supply Chain ► It’s ALL about understanding and reducing variation ♦ Specs are out ► Management of Change benefits the entire supply chain ♦ It helps you, not just your customer ► Transparency is key, needs to be a 2-way street ♦ Supplier to customer, customer to supplier ♦ If it’s not IP, show it ► It’s a Process Change Notification, not a Process Improvement Notification ♦ Prove it’s not a change, not that it is one ► Develop a root cause analysis mentality ♦ Every OOC event has one ♦ Look for the “why,” not just the “what” 15 External use

  16. Acknow ledgements: Dr. Yongqiang Lu, Hidde van Assendelft SACHEM kmclaughlin@sacheminc.com 512-421-4929 External use 17

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