Supplying the Suppliers Challenges Facing the Litho and Surface - - PowerPoint PPT Presentation

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Supplying the Suppliers Challenges Facing the Litho and Surface - - PowerPoint PPT Presentation

Supplying the Suppliers Challenges Facing the Litho and Surface Preparation Supply Chain Kevin J. McLaughlin, PhD SACHEM, Inc. CMC Seminar 2017, Hsinchu, Taiwan Outline SACHEM market position Supply chain challenges Supply chain


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Supplying the Suppliers

Challenges Facing the Litho and Surface Preparation Supply Chain Kevin J. McLaughlin, PhD SACHEM, Inc.

CMC Seminar 2017, Hsinchu, Taiwan

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►SACHEM market position ►Supply chain challenges ►Supply chain challenge case study ►Recommendations to the overall supply chain

Outline

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“SACHEM is a global chemical science company specializing in extremely pure, precise, and innovative chemistry products and services critical to our customers’ manufacturing processes”

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SACHEM has established leading positions in key grow th markets through technical expertise, revolutionary service, and an unw avering commitment to safety and the environment.

Electronic Materials Energy Materials Structured Materials Specialties

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SACHEM: Supplier and Sub-Supplier

IC Manufacturers LITHO ETCH CMP CLEANS STRIP Formulations Manufacturers Developer Manufacturers SACHEM Solvents Amines Salts Packaging

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► Supplier, sub-supplier management

♦ Petrochemical-based raw materials ♦ Unmotivated suppliers

► Chemical classification/labelling

♦ GHS not global, not harmonized

► Fractured regulatory landscape

♦ Registration, testing requirements vary by region ♦ Costly, variable, unpredictable registration timelines

► Management of Change moving upstream

♦ Freezes supply chain much earlier in development, limiting innovation ♦ Creates tension between node development, node lifetime

► Quality roadmap outpacing metrology

♦ Controlling what you can’t see

► Supply chain integrity – 1st/2nd/3rd order effects

♦ Supplier, sub-supplier, packaging for both, logistics for all ♦ 2017 hurricanes provided new insights into supply chain dependencies

Supply Chain Challenges I

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► Demands for local supply

♦ Challenges economies of scale

► Regional, local challenges

♦ China’s pollution crackdown

► Commoditization

♦ Denial of value

► Customization

♦ 1 $50M product vs. 50 $1M products

► Dynamics of chemical status

♦ Governmental regulations ♦ Customer banned lists ♦ “No new sources”

► Product stewardship: Cradle to Grave has become Cradle to Cradle

♦ Minimize waste, waste disposal ♦ Waste composition (e.g. nitrogen content) ♦ Recycle

Supply Chain Challenges II

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►The Objective: Supply ultra-high purity quaternary hydroxide to customer for leading-edge application

♦ Metrology challenges

  • Metals
  • Particles

♦ Packaging challenges

  • As-packaged vs. as-delivered performance

♦ IP Security challenges

  • Fingerprinting

Case Study: Quality and Quality Systems

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1 10 100 1,000 10,000 1 10 100 1,000 10,000 2014 2015 2016 2017 2018 2019 2020

Measured particle size (nm) Metals (ppt)

5 – 3 nm 10 – 7 nm 14 – 16 nm 22 – 28 nm 32 – 45 nm

Current Metrology Limits

Technology Node 25% TMAH Quality Roadmap

Electronic Materials Purity Requirements

Current Metrology Limits

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Supply Chain and Metrology Clash

Manufacturing

  • Metal-free raw materials
  • Metal-free process flow
  • Purification and filtration

Bulk Delivery

  • Metals <25 ppt
  • Filtration @ 30-50 nm

Facility Side

  • Metals <25 ppt
  • Filtration @ 30 nm

Dilution/Chemical Distribution

  • Metals <2.5 ppt
  • Filtration @ 10-20 nm

Tool Side

  • Metals <2.5 ppt
  • Filtration @ 2-5 nm

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Ag 15 ppt K 50 ppt Al 15 ppt Li 50 ppt As 50 ppt Mg 25 ppt Au 50 ppt Mn 15 ppt B 300 ppt Mo 50 ppt Ba 50 ppt Na 50 ppt Be 50 ppt Ni 15 ppt Ca 100 ppt Pb 50 ppt Cd 50 ppt Rb 50 ppt Co 15 ppt Sn 50 ppt Cr 15 ppt Sr 50 ppt Cs 50 ppt Ta 50 ppt Cu 25 ppt Ti 50 ppt Fe 10 ppt Tl 50 ppt Ga 50 ppt V 50 ppt Hg 50 ppt W 50 ppt Ir 15 ppt Zn 25 ppt

Metrology: Metals

  • Number of required metals

continues to increase

  • Increases likelihood of OOC

event

  • Metals levels as low as 10ppt

require ICP-MS detection limits at 1ppt

  • Extremely difficult to achieve

in 25% TMAH matrix

  • Current metrology limits

closer to 10ppt

  • Metrology method

development required for each metal measured

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Existing Requested >0.5µm 7 N/A >0.2µm 70 N/A >0.1µm 500 250 >0.04µm N/A 500 >0.03µm N/A Report >0.02µm N/A Report

Metrology: Particles

  • State-of-the-art commercial LPC

measurement can measure down to 30nm particles

  • Significant interferences require extreme

care in product sampling and analytical sample preparation

  • Microbubbles primary interference in

manufacturing, packaging, transportation

  • Requires harmonization of sampling,

measurement procedures between supplier, customer to insure reproducible results

  • Measurement requested to 20nm, not yet

commercially available

  • Additional method development required

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Product Packaging Effects

500 1000 1500 2000 2500 3000 3500 4000 4500 5000 0.5 0.2 0.1 0.04 Particle Count (#/ml) Particle Size (µm) As-produced As-delivered

  • Packaging well-known to affect product

quality

  • Leaching of metals, organics
  • Shedding of particles
  • Effects increase exponentially with

severity of purity specifications

  • Sufficiently clean packages order of

magnitude more expensive than packages historically used

  • Reusable packages used in closed-

loop systems can meet purity requirements

  • Customers generally require dedicated

packaging return loops, greatly complicating logistics, inventory management

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Product Fingerprinting

  • Increasing requests for product

fingerprinting to evaluate “unknown unknowns”

  • Creates potential Intellectual

Property concerns

  • Raw material, manufacturing, and

purification IP can be compromised through evaluation of fingerprinting data

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► It’s ALL about understanding and reducing variation

♦ Specs are out

► Management of Change benefits the entire supply chain

♦ It helps you, not just your customer

► Transparency is key, needs to be a 2-way street

♦ Supplier to customer, customer to supplier ♦ If it’s not IP, show it

► It’s a Process Change Notification, not a Process Improvement Notification

♦ Prove it’s not a change, not that it is one

► Develop a root cause analysis mentality

♦ Every OOC event has one ♦ Look for the “why,” not just the “what”

Recommendations to the Supply Chain

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Acknow ledgements:

  • Dr. Yongqiang Lu, Hidde van Assendelft

SACHEM

kmclaughlin@sacheminc.com 512-421-4929

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