1 4th Graduate Summer Institute “Complex Plasmas” Amir Mohammad Ahadi1, T.Trottenberg2, O.Polonskyi1, T.Strunskus1, H.Kersten2 and F.Faupel1
1 Chair for Multicomponent Materials, CAU-Kiel 2 IEAP, CAU-Kiel
5 August 2014 amah@tf.uni-kiel.de
RF hollow discharge and its influence on metal nanoclusters Amir - - PowerPoint PPT Presentation
4 th Graduate Summer Institute Complex Plasmas RF hollow discharge and its influence on metal nanoclusters Amir Mohammad Ahadi 1 , T.Trottenberg 2 , O.Polonskyi 1 , T.Strunskus 1 , H.Kersten 2 and F.Faupel 1 1 Chair for Multicomponent
1 4th Graduate Summer Institute “Complex Plasmas” Amir Mohammad Ahadi1, T.Trottenberg2, O.Polonskyi1, T.Strunskus1, H.Kersten2 and F.Faupel1
1 Chair for Multicomponent Materials, CAU-Kiel 2 IEAP, CAU-Kiel
5 August 2014 amah@tf.uni-kiel.de
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F.Faupel et.al, Adv.Eng.Mat, Vol.12, No.12, 1177 (2010)
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5 Schematic drawn of experimental setup.
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Langmuir probe was installed 12 mm far from top ring electrode !
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P=2 Pa, Ar flow= 115 SCCM Power=10 W
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Evolutions of electron temperature and density by loading power
Solid lines are for single probe measurements and dashed lines are for compensated probe measurements.
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P=2 Pa Ar flow= 115 SCCM
2 4 6 8 10 12 14 16 18 140 160 180 200 220 240 260 280 300 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4
Discharge Current (A) Discharge Voltage(V) RF Power (W)
2 4 6 8 10 12 14 16 18 114 115 116 117 118 119 120 88.5 88.6 88.7 88.8 88.9 89.0 89.1 89.2 89.3 89.4
Discharge Phase (°) Discharge Impedance (Ohm) RF Power (W)
By increasing the RF power, the plasma gradually becomes more resistive.
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pressure.
11 All discharge parameters decreased by increasing the pressure, as the consumed power be constant.
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plasma.
K.J.Taylor and G.R. Tynan, J.Vac.Sci.Tech A, 23 (4), 2005
P = 2.00 Pa RF power = 7.00 W
EArgon= 15.8 eV Eoxygen= 12.6 eV
ionization energy leads to higher electron temperature .
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Sample & QCM position
Defe felecto tor With th two slits ts
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Langmuir probe
P=2 Pa Magnetron Power=50 W
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0 2.8 3.2 3.6 4.0 4.4 4.8 2.8 3.0 3.2 3.4 3.6 3.8 4.0 4.2 4.4 4.6 4.8 5.0
electron Temp (eV) RF Power (w)
With Out cluster With all clusters With neutral clusters
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9
Electron Density (m^-3)*E15 RF Power
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Solid lines are for pure plasma (without clusters) and dashed lines are for plasma in presence of cluster beam.
V-I Probe
2 4 6 8 10 12 14 16 18 140 160 180 200 220 240 260 280 300 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2 4 6 8 10 12 14 16 18 140 160 180 200 220 240 260 280 300
Discharge Current (A) Discharge Voltage (V) RF Power (W)
2 4 6 8 10 12 14 16 18 115 116 117 118 119 120 121 122 88.2 88.3 88.4 88.5 88.6 88.7 88.8 88.9 89.0 89.1 89.2 89.3 89.4 88.2 88.3 88.4 88.5 88.6 88.7 88.8 88.9 89.0 89.1 89.2 89.3 89.4 2 4 6 8 10 12 14 16 18 116 118 120 122
Discharge Phase (°) Discharge Impedance (Ohm) RF Power (W)
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5 10 100 200 300 400 500 600 700 800 900
Deposition Rate (a.u.) Distance from center of deposition (mm) RF Power:0 W RF Power:10 W RF Power:2 W
Spatial distribution of deposition rate at different RF powers
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Magnetro tron Power r = 50 W PM.C.= 2 Pa PGAS= = 200 Pa
At higher RF power (higher than 5 w), the nanocluster deposition with and without purification (of neutral clusters) was similar.
19 Cluster er film _ without t RF discharg arge e Cluster er film_ 2 W R RF discharge arge
DC Power r =100 W PM.C.
C.=2 Pa
PGAS=2 =200 Pa
20 Cluster er film _ 10 W R RF discharge arge
Higher energy enhence cluster charging & more acceleration of nanoparticles the cluster size can grow by coalescence of clusters in the volume.
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discharge at low pressure and low power for material processing.
added to the discharge) on discharge parameters was not noticeable.
deposited nanoclusters are significantly changed by appling the RF discharge.
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