processed by electro discharge machining I.Z. Ismagilov 1,2 , R.P. - - PowerPoint PPT Presentation

processed by electro discharge machining
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processed by electro discharge machining I.Z. Ismagilov 1,2 , R.P. - - PowerPoint PPT Presentation

2nd International Conference on Structured Catalysts and Reactors October 16-19, 2005 Delft, The Netherlands Optimization of anodic oxidation and Cu-Cr oxide catalyst preparation on structured aluminum plates processed by electro discharge


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SLIDE 1

Optimization of anodic oxidation and Cu-Cr oxide catalyst preparation on structured aluminum plates processed by electro discharge machining

I.Z. Ismagilov1,2, R.P. Ekatpure2, L.T. Tsykoza1, E.V. Matus1, E.V. Rebrov2, M.H.J.M. de Croon2, M.A. Kerzhentsev1, J.C. Schouten2

1Boreskov Institute of Catalysis SB RAN, Novosibirsk, Russia 2Eindhoven University of Technology, Eindhoven, The Netherlands

2nd International Conference on Structured Catalysts and Reactors October 16-19, 2005 Delft, The Netherlands

Presented by Prof. Z.R. Ismagilov

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SLIDE 2

(E.V. Rebrov et al.,

  • Catal. Today 69 (2001) 183)

inlet

  • utlet

1 cm

flow distributor 4 screws quench section: -25oC heating module: 40 .. 480oC Ni housing reactor ceramic plate Microreactors: tools for both basic research and safe process development, opportunity to safely study the kinetics of catalytic total oxidation:

  • small unit size
  • channel diameter < 500 m (large surface-to-

volume ratio) => gas-phase reactions, including explosive ones, can be avoided

  • highly exothermic reaction => efficient heat

removal

Introduction

O Cu Cr

  • Spinel catalyst

CuCr2O4/ -Al2O3 high oxidation activity

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SLIDE 3

Outline Fabrication and characterization of microstructured plates

Oxidation of flat aluminum plates Adaptation of oxidation procedure with the AlMgSi1 alloy

Anodic oxidation of metal plates

Preparation of Cu-Cr oxide catalytic coatings on flat aluminum plates Adaptation of catalysts synthesis procedure for microstructured plate

Development of preparation methods of catalytic coatings

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SLIDE 4
  • 5. Diffusion bonding
  • 6. Assembly
  • 4. Polishing
  • 2. Anodic oxidation

Porous -Al2O3 layer

  • 1. Channel formation

by spark erosion Microstructured Al plate mm

  • 3. Catalyst deposition

Microreactor geometry based on plug-flow model: channel internal diameter 400 m, catalyst/support layer thickness 25 m, 76 half-plates (400 m thick)/2 = 38 full-plates (800 m thick), 45 channels per plate => assembled 26.6 mm wide, 40 mm long, 30.4 mm high, 1710 channels

Microreactor fabrication

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SLIDE 5

Material EDM procedure Fabrication of microstructured plates

Al 99.5 AlMgSi1 alloy (Al51 st) 1 incision 2 incisions 3 incisions

Al microreactor material:

high heat conductivity (230 W/m·K)

  • can be used up to 450 oC (m.p. 660 oC)
  • microchannels easily made (e.g., by spark erosion)
  • anodic oxidation allows formation of external porous

g-Al2O3 layer for catalyst active component deposition

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SLIDE 6

Single sided plates h =0.42

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SLIDE 7

1st series: 21+63 microstructured plates (1 incision)

Fabrication of microstructured plates

Dimensions: 45 channels with R=208 micron, L = 40 mm

430 194

112

190

Ra >3

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SLIDE 8

Plate weight after EDM

1 3 5 7 9 11 13 15 17 19 21 23 25 0.0 0.2 0.4 0.6 0.8 1.0 1.2 Weight after EDM, g Plate number

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SLIDE 9

2nd series

2 incisions + micro-powder jet treatment 2 incisions Ra =2.0 Ra =2.0

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SLIDE 10

Summary Fabrication of long (40 mm) microchannels in Al 99.5 (code:1050A) is not possible Method “1 incision” gives surface roughness Ra >3.2 with the Al51st alloy It is possible to reach Ra=2.0 with fabrication method “2 incisions” in Al51st

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SLIDE 11

3.5 wt.% oxalic acid (H2C2O4) solution Anode:

2 Al + 3 H2O Al2O3 + 6 H+ + 6e C2O4

2-

2 CO2 + 2e

Cathode:

2 H+ + 2e H2 Al

  • Al2O3

catalyst support

Anode: Al flat (or microstructured) plate Pt cathode

10 cm 10 cm

Pt cathode

2 Al + 3 H2O Al2O3 + 3 H2 SEM: cross-section

Anodic oxidation

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SLIDE 12

200 400 600 800 1000 1200 1400

  • 2
  • 1

1 2 3 4 5

p 5, 6 p 7, 8 p 9, 10 p 11, 12 p 13, 14 p 15, 16 p 17, 18 p 19, 20 p 21, 22 p 23, 25

Temperature,

  • C

Time, min

Temperature vs. time

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SLIDE 13

Voltage vs. time

200 400 600 800 1000 1200 1400 10 60 80 100 120

current density: 4.2 mA/cm

2 (one side protected)

T= 0.5

  • C

Voltage, V Time, min

electrolyte: 3.5 wt.% oxalic acid 444 hrs #17,18 306 hrs #11,12 168 hrs #5,6 92 hrs #24,25 46 hrs #21,22 fresh #19,20

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SLIDE 14

Scale 100 =454 m

Layer thickness : 41±1 m R = 408 m

Scale 100 =454 m Scale 10 =250 m

Oxidation time 29 hrs

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SLIDE 15

Scale 10 =250 m

Layer thickness : 29±1 m, R = 415 m

Scale 100 =625 m Scale 100 =454 m Scale 10 =125 m

Oxidation time 23 hrs

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SLIDE 16

Coating thickness vs. oxidation time

Microstructured plates Flat plates

10 20 30 40 50 10 20 30 40 50 60 70 Coating thickness, m Oxidation time, hrs 0.0 0.5 1.0 1.5 2.0 2.5 5 10 15 20 25 30 Coating thickness, m Oxidation time, hrs

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SLIDE 17

Weight gain after routine oxidation

6 8 10 12 14 16 18 20 22 24 5 10 15 20 25 Weight gain, mg Plate number Fresh electrolite

n/d

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SLIDE 18

SEM: anodic oxidation of microstructured Al plates

3 microchannels 1 microchannel ← -Al2O3 Al

15 m of -Al2O3 have been formed (low thickness due to the other, non-porous Al2O3 produced by spark erosion procedure) => anodic oxidation conditions are being optimized to form required 25 m of -Al2O3

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SLIDE 19

Anodized flat aluminum plates: Ssp, porosity, SEM

Ssp ( -Al2O3/Al plate) = 95 m2/cm3 (30 m2/g), pore volume ~ 14 %, pore (cylindrical shape) distrib- ution maxima at 15 nm and 46 nm Result: Close to expected from literature, input data for catalyst active component deposition 100 nm 3 m Normal to surface Glancing angle

Relative abundance, a.u. Pore diameter, nm 1 10 100 1000 15 46

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SLIDE 20

Low current density (I= 4 mA/cm2) is required for anodic oxidation of Al51 st Low temperature (close to the melting point of the electrolyte) is required to decrease the rate of undesirable reaction with oxalic acid Temperature control within ±0.5 K is crucial during

  • xidation to get reproducible results

Higher voltage is required in subsequent runs due to copper deposition on the cathodes and copper dissolution in the electrolyte.

Summary

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SLIDE 21
  • 1. Finding initial synthesis conditions by testing different methodologies
  • f catalyst active component deposition using conventional pelleted
  • Al2O3 supports
  • 2. Synthesis using the flat plates, catalysts characterization (physical

methods, catalytic activity), optimization of synthesis conditions

  • 3. Synthesis using the microstructured plates

Development of spinel catalyst synthesis method using Al2O3/Al plates

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SLIDE 22

Catalyst active component deposition on pelleted -Al2O3 supports

  • Limiting condition: on -Al2O3/Al plates, catalyst calcination T not to

exceed 500 oC, because m.p. of Al is ~ 600 oC (especially for microstructured Al plates)

  • Method tested on pelleted (1.0-1.6 mm) -Al2O3: low-T formation of

CuCr2O4 spinel (impregnation with solution of copper dichromate, drying and calcination at T = 450oC for 4 h)

  • XRD, BET results: at T = 450oC dominate low-T solid solutions based on

spinel structure (Cu,Cr,Al)[Cr,Al]2O4 with lattice parameter a = 7.905-7.960 Å, particle size D < 50 Å and Ssp ~ 130 m2/g

  • Reference catalyst composition 26%CuCr2O4/ -Al2O3
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SLIDE 23

Examples (with resulting wt.% of a.c.): C T M W: 0.4 C T M W: 2.5 C T M W: 5.3

M M

Multiplicity of impregnati-

  • ns *

T

(1.0)

T

(0.25) Time of im- pregnation, h Level of implementation Parameter

W C

(500) High (Yes*)

W C

(250) Low (No*) Washing off excess soluti-

  • n *

C of impreg- nation soluti-

  • n, g/l

Catalyst active component deposition on

  • Al2O3/Al supports

C T M W: 3.5 C T M W:5.3

Results:

  • Washing removes most of active

component ( a.c.)

  • Concentrated solution – excess

a.c. on surface (confirmed by XRD)

  • Low concentrations deposit a.c.

mostly in pores of -Al2O3

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SLIDE 24

XPS and UV-Vis: Cr cations

.

Cr2p3/2 of Cr3+: 576.5-577.5 eV (577.1 eV for CuCr2O4) UV-Vis: Oh Cr3+ ~ 17000 cm-1 and ~ 22000 cm-1 (d-d transitions) Normal spinels: XY2O4 (X(Cu2+, Td coordination), Y(Cr3+, Oh coordination), face-centered cubic unit cell (formed by close-packed O2-) Shift to lower BE with increase of active component (a.c.) loading

=> possibly, interaction

with -Al2O3 support is stronger, than within a.c. particles themselves

5 7 5 8 5 9 6

Cr2p3/2

5 7 6 . 7

Binding energy, eV

Cr2p1/2

577.0

577.3 Intensity, a.u.

Resulting wt.% of a.c.: C T M W: 5.3 C T M W: 3.5 C T M W: 0.4

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SLIDE 25

XPS and UV-Vis: Cu cations

.

Cu2p3/2 of Cu2+: ~ 933 eV for CuCr2O4, ~ 935 eV for CuCO3 UV-Vis: Td Cu2+ ~ 13000 cm-1 (d-d transitions) 9 3 9 4 9 5 9 6 933.1 934.6

Cu2p3/2

Binding energy, eV

Cu2p1/2

Intensity, a.u.

  • For sample with low a.c. loading, the

CuCO3 signal overlaps with CuCr2O4 signal, looking as 1 peak at 933.1 eV. With higher a.c. loadings, CuCO3 signal becomes more pronounced

  • Maximum of Cu2+ content is observed

for medium a.c. loading catalyst (XPS is surface-sensitive). Cu2+ is considered the most active part of spinel catalyst => probably, better a.c. dispersion and Cu2+ localization for this catalyst

  • Shift to higher BE with increase of a.c.

loading – opposite to Cr3+ 932.6

Resulting wt.% of a.c.: C T M W: 3.5 C T M W: 5.3 C T M W: 0.4

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SLIDE 26

XMA: Cu, Cr, Al distributions (sample C T M W: 3.5%CuCr2O4)

CrK CuK

Thickness, m

CrK CuK AlK

Intensity, a.u. 200 800 1000

CrK CuK AlK

Length, m 100 200 300 400 Intensity, a.u. Across the plate: Along the plate:

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SLIDE 27

After (sample C T M W: 5.3%CuCr2O4): surface is covered with CuCr2O7

1 m 1 m SEM: -Al2O3 surface before and after impregnation with CuCr2O7

Before: cylindrical pores are clearly visible

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SLIDE 28

Catalytic activity: deep oxidation of C4H10

  • n flat plate supported catalyst

.

initilal C(C4H10) = 2000 ppm in air, GHSV = 120000 h-1 with respect to volume of catalytic coating

200 250 300 350 400 450 500 10 20 30 40 50 60 70 80 90 100

used CTMW 3.5 wt.% a.c. fresh CTMW 3.7 wt.% a.c. CTMW 5.3 wt.% a.c. CTMW 0.4 wt.% a.c.

Temperature,

  • C

C4H10 conversion, %

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SLIDE 29

Catalyst active component deposition on microstructured plates

CTMW 3.7 wt. % CuCr2O4 anodized AlMgSiCu-alloy plate without catalytic coating SEM image SEM image

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SLIDE 30

Catalytic activity: deep oxidation of C4H10

  • n microstructured plate supported catalyst

.

C(C4H10) = 2000 ppm in air, GHSV = 120000 h-1 with respect to volume of catalytic coating

150 200 250 300 350 400 450 500 10 20 30 40 50 60 70 80 90 100

  • n flat plate

CTMW 3.5 wt.% a.c. used CTMW 3.7 wt. % CTMW 5.3 wt.% a.c.

26% CuCr2O4 on

  • Al2O3 pellets

Temperature,

  • C

C4H10 conversion, %

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SLIDE 31

Catalytic activity: deep oxidation of C4H10

  • n microstructured plate supported catalyst

.

initilal C(C4H10) = 2000 ppm, GHSV = 120000 h-1 vs. -Al2O3 with respect to volume of catalytic coating

200 300 10 20 30 40 50 22% 22%

Temperature,

  • C

C4H10 conversion, %

10 20 30 40 350

  • C

Time on Stream, hrs

CTMW 5.3 wt.% a.c.

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SLIDE 32

Catalytic microreactor for total oxidation reactions

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SLIDE 33

Conclusions

  • 1. The alumina-supported Cu, Cr oxide catalysts for reactions of total
  • xidation in a microreactor were synthesized using flat and

microstructured anodized Al plates and characterized

  • 2. The formation of CuCr2O4 active component on -Al2O3/Al plates

produced by anodic oxidation was confirmed by XPS, UV-Vis, XRD, XMA and SEM 3. The best catalyst synthesis method is via double impregnation for 15 min with a diluted aqueous solution of copper dichromate 4. The C4H10 oxidation activities of coatings even at much less cotent

  • f active component are superior to that of the reference pelleted

catalyst

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SLIDE 34

Acknowledgements Netherlands Organization for Scientific Research (NWO) and Russian Foundation for Basic Research (RFBR) for the financial support of this Project