Panasonic's advanced packaging technologies for thin substrates May - - PowerPoint PPT Presentation

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2014 The 64th Electronic Components and Technology Conference (ECTC 2014)

Panasonic's advanced packaging technologies for thin substrates

Mitsuru Hiroshima Micro Electronics Division Panasonic Factory Solutions Co., Ltd.

May 27th, 2014

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2014 The 64th Electronic Components and Technology Conference (ECTC 2014)

Panasonic's 4 Business Groups and Our Company

Appliances Eco Solutions AVC Networks Automotive & Industrial Systems

Figures as of April 2013

Automotive Industrial Manufacturing 15 billion yen Osaka, JAPAN January 1, 2003 100% from Panasonic Corp. 2,870 （World wide） Head Office Establishment Funding Paid-in capital Employees Business Area Electric Component Mounting Microelectronics Systems etc..

Panasonic Factory Solutions Co., Ltd.

Panasonic Welding Systems Co., Ltd.

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2014 The 64th Electronic Components and Technology Conference (ECTC 2014) Bare Die

Frontend & Pre-assembly Module Assembly PCB Assembly

SAW filter Image Sensor RF Module GPS Module FPC Mother Board

Package Assembly

IC fabrication LCD Panel Pre-assembly

Final Product

Product Portfolio -Electronic Circuit Manufacturing Solution-

Plasma Dry Etcher

APX300

LCD Driver IC Bonder

FPX Series

Plasma Dicer

APX300

Flip Chip Bonder

FCB3

Plasma cleaner

PSX307 MDP Series

Die Bonder SMD System

NPM Series

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2014 The 64th Electronic Components and Technology Conference (ECTC 2014)

Mounting “thin-Si die/component” on “thin-substrate” is essential !

Source) zxhgroup.com

Requirements for thin-substrate Manufacturing

Source) LG Source) SAFE KEEPER CARD Source) Fitbit Flex

Bendable Smart Phone Secured Plastic Card Wearable for Healthcare

Strength

• f thin-die

Reliability

• f Interconnect

Support thin-substrate

Key requirements

Flexibility + “more Functions in Small Volume”

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2014 The 64th Electronic Components and Technology Conference (ECTC 2014)

Panasonic’s PKG Solutions for thin substrate

Strength

• f thin-die

Reliability

• f Interconnect

Support thin-substrate Plasma Dicing Plasma Cleaning

Electrode Die Die Wire Substrate

e-Carrier

(Electrostatic Force)

Electrostatic carrier SMD Process Cover Flexible Substrate

Source)Win Industry

DC

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2014 The 64th Electronic Components and Technology Conference (ECTC 2014)

What is “Plasma Dicing” ?

SOLID based Dry Etching based

Blade Dicing Plasma Dicing

S iF

4

SF6 + O2 Six OyF

z

SFx

+

F*,O* SiF4 etc.. Si Resist Sidewall protection

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2014 The 64th Electronic Components and Technology Conference (ECTC 2014)

Dicing chip

Blade Dicing Plasma Dicing

damaged layer

(500nm thick)

Plasma Dicing - Die Strength -

60μm

3 points bending test result

0% 1% 10% 100% 100 1000 10000

Chip Strength (MPa) Cumulative Frequency (-)

Blade Dicing Plasma Dicing

Top View TEM Image

Strong thin-die by Plasma Dicing !

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2014 The 64th Electronic Components and Technology Conference (ECTC 2014)

“R” edge

Plasma Dicing - Makes dies stronger -

Hexagonal Circular

Highest Strength Dies

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2014 The 64th Electronic Components and Technology Conference (ECTC 2014)

After plasma

Plasma Cleaning - PoP interconnection -

Sn

Before plasma

Carbon Carbon

Atomic Concentration(%) Atomic Concentration(%)

■ TMV(Through Mold Via) process

■ XPS depth profile on solder ball surface Plasma Cleaning

Solder Ball Laser

Smears

（Residues） Mold-resin Top PKG TMV

Reliable Solder Joint after cleaning !

Bottom PKG

Sn

XPS : X-ray Photoelectron Spectroscopy

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2014 The 64th Electronic Components and Technology Conference (ECTC 2014)

Chip Bonding Plasma Cleaning Plasma Dicing Handling Panasonic’s PKG techniques

Contribute to your thin-sub. manufacturing !

Source)Win Industry

APX300 MD-P200US PSX307 e-carrier

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2014 The 64th Electronic Components and Technology Conference (ECTC 2014)