Module PCBs and Teststands Keti Kaadze, Kansas State University, L4 Manager 402.4.4.1.3 – Module PCBs 402.4.4.2.1 – Module teststands November 29, 2017
Module PCBs § The same Module PCBs will be used in CE-E and CE-H parts § Design is led by CERN group with some contribution for FNAL & KSU engineers § Full testing of each PCB needs to be carried out before assembling it into module § Test-stands for handling large quantities of PCBs as well as a single-module tester are needed for full production The module PCB, the hexaboard Module PCBs and Teststands Ke# Kaadze, 2017 November 29 2
Module PCBs § Hexaboard contains several HGCROC § Using board-to-board connectors for connecting to motherboard § Same connector will be used to connect to board tester Module PCBs and Teststands Ke# Kaadze, 2017 November 29 3
Conceptual Design for Module PCB Tester Module PCBs and Teststands Ke# Kaadze, 2017 November 29 4
Test Procedure § The test procedure will be refined as we advance on HGCROC and module PCB design § Validation of HGCROC o Basic check that we can read and write registers o Exercise internal charge injection functionality § PCB Noise measurements o Pedestal measurement for each channel o Check for correlated noise levels § Verify that trigger output is appropriate for data during charge- injection tests § C-V scans o Confirms wire-bonding and sensor profile o Identify problems in PCB or anywhere in module Module PCBs and Teststands Ke# Kaadze, 2017 November 29 5
Conceptual Design • Full custom board or COTS FPGA board with custom mezzanine card • Ethernet connectivity to computer • Low voltage Control and monitoring • High voltage control and monitoring (800v) • Slow control (I2C) • Generate timing, control and calibration signals • Receive e-Links from HGCROC ASIC (1.28 Gb/s) • Low Density Module • 12 trigger e-Links • 3 DAQ e-Links • High Density Module • 18 trigger e-Links • 6 DAQ e-Links • Scale single test board to test stand • COTS temperature chamber with dry air purge • 25 Modules per test cycle Module PCBs and Teststands Ke# Kaadze, 2017 November 29 6
Module Test Board Block Diagram Module PCBs and Teststands Ke# Kaadze, 2017 November 29 7
Requirements § Plan § The detector will operate at -30C § The U.S. will be responsible building about 12000 silicon modules o Testing procedure will be common between different institutions contributing to this task: KSU, TTU, CMU, UCSB, and FNAL § Requirements for testing § Validation and functionality tests needs to be carried out before and during thrermal cycling, before PCBs are assembled into modules § Aim completing testing of full production within one year -- requires a test-stand to handle at least 50 PCBs per day § Perform testing in a clean room § Important starting point – develop and validate test-stand for testing prototype 1 PCBs, O(100) in quantity Module PCBs and Teststands Ke# Kaadze, 2017 November 29 8
Requirements for Test-Stand § We have 50 m 2 class 10000 (ISO 7) clean room § Similar cleanroom facilities will be present at module and cassette factories, wherever we will work with unsealed modules § Thermal Cycler – currently considered: BTZ-475 (A) model from ESPEC § Sufficiently large volume: 4 cu. ft. § Temperature range: -70°C to 180°C § Humidity control § Computer interface § Similar cycler will be used at module and cassette factories § Develop tester board for testing module PBCs § Develop software for test-stand Module PCBs and Teststands Ke# Kaadze, 2017 November 29 9
Module Test Board Block Diagram Test system scaled for 25 modules Module PCBs and Teststands Ke# Kaadze, 2017 November 29 10
Interfaces § The development of test board is directly related to § Development of HGCROC § Design of module PCB § Thermal cycling and test procedures will be common between KSU test-stand and module assembly sites § Testing board will be developed as common effort of KSU/FNAL/ UCSB group § Test-stand software will be a common effort of KSU/Baylor U. group Module PCBs and Teststands Ke# Kaadze, 2017 November 29 11
R&D and Engineering Module PCBs and Teststands Ke# Kaadze, 2017 November 29 12
Institutional and Personnel Involvement § Personnel § Physicists: o Faculty: K. Kaadze, Y. Maravin o Postdoc: A. Mohammadi o G student: D. Kim o UG students § Engineers: Russell Taylor, Stephen Corkill o Developed test board for Phase I pixel TMB o Developed LED Pulser board for Phase I HCAL FE upgrade § Technician: David Huddleston Module PCBs and Teststands Ke# Kaadze, 2017 November 29 13
Conclusion and Outlook § Preparation of module PCBs and test-stands is has started § Development of HGCROC and module PCB design is an important input § Preparing test-stands to be able to test and verify full production of module PCBs o Develop test-board to perform necessary tests o Obtain and setup thermal cycler o Develop necessary software § Timescale § First prototype testing – 2018-2019 § Full production testing – 2020-2022 Module PCBs and Teststands Ke# Kaadze, 2017 November 29 14
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