SOLID- -METAL THERMAL COLUMNS METAL THERMAL COLUMNS SOLID IN - - PowerPoint PPT Presentation

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SOLID- -METAL THERMAL COLUMNS METAL THERMAL COLUMNS SOLID IN - - PowerPoint PPT Presentation

SOLID- -METAL THERMAL COLUMNS METAL THERMAL COLUMNS SOLID IN CONVENTIONAL PCBs IN CONVENTIONAL PCBs SMTA Jim Fraivillig Thermal Issues session Fraivillig Technologies Boston, MA Rosemount, IL 9/24/03 PowerVia technology PowerVia


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SLIDE 1

SOLID SOLID-

  • METAL THERMAL COLUMNS

METAL THERMAL COLUMNS IN CONVENTIONAL PCBs IN CONVENTIONAL PCBs

SMTA Thermal Issues session Rosemount, IL 9/24/03

Jim Fraivillig Fraivillig Technologies Boston, MA

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SLIDE 2

SOLID SOLID-

  • METAL THERMAL COLUMNS

METAL THERMAL COLUMNS IN CONVENTIONAL PCBs IN CONVENTIONAL PCBs

PowerVia technology PowerVia technology Optimal through Optimal through-

  • hole thermal transfer

hole thermal transfer

All-polyimide construction

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SLIDE 3

SOLID SOLID-

  • METAL THERMAL COLUMNS

METAL THERMAL COLUMNS IN CONVENTIONAL PCBs IN CONVENTIONAL PCBs

PowerVia technology PowerVia technology Optimal through Optimal through-

  • hole thermal transfer

hole thermal transfer

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SLIDE 4

SOLID SOLID-

  • METAL THERMAL COLUMNS

METAL THERMAL COLUMNS IN CONVENTIONAL PCBs IN CONVENTIONAL PCBs

PowerVias for D2Paks PowerVias inserted into PCB

PowerVia technology PowerVia technology Optimal through Optimal through-

  • hole thermal transfer

hole thermal transfer

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SLIDE 5

SOLID SOLID-

  • METAL THERMAL COLUMNS

METAL THERMAL COLUMNS IN CONVENTIONAL PCBs IN CONVENTIONAL PCBs

Comparison with Comparison with conventional thermal via conventional thermal via

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SLIDE 6

PowerVia technology advantages PowerVia technology advantages

  • High thermal transfer

2X conventional plated-thru hole

  • No pressure dependency
  • All polyimide durability

Excellent electrical and physical properties

SOLID SOLID-

  • METAL THERMAL COLUMNS

METAL THERMAL COLUMNS IN CONVENTIONAL PCBs IN CONVENTIONAL PCBs

Design flexibility:

  • Double-sided PCBs
  • ‘Snap-on’ PCB to

standard heat sink

  • Optimize supply of both

PCB and heat sink

  • Testing flexibility

(thermal mass of PowerVia)

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SLIDE 7

SOLID SOLID-

  • METAL THERMAL COLUMNS

METAL THERMAL COLUMNS IN CONVENTIONAL PCBs IN CONVENTIONAL PCBs

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SLIDE 8

PowerVia installation PowerVia installation

1. Insert into pre-routed PCB (‘bottom side’) 2. Solder on power devices (‘top side’) 3. Mount assembled PCB on heat sink

SOLID SOLID-

  • METAL THERMAL COLUMNS

METAL THERMAL COLUMNS IN CONVENTIONAL PCBs IN CONVENTIONAL PCBs

PowerVias can be:

  • Press-fit
  • PS-adhesive attached
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SLIDE 9

Thermal transfer testing Thermal transfer testing

SOLID SOLID-

  • METAL THERMAL COLUMNS

METAL THERMAL COLUMNS IN CONVENTIONAL PCBs IN CONVENTIONAL PCBs

D2Pak PowerVias Thermal vias

Thermal resistance testing of D2Pak (R j-s), using Anatech pulse tester:

  • Conventional thermal via

(plated-thru-hole + insulation pad + attachment hardware)

  • Cylindrical column

PowerVia

  • Rectangular column

PowerVia

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SLIDE 10

SOLID SOLID-

  • METAL THERMAL COLUMNS

METAL THERMAL COLUMNS IN CONVENTIONAL PCBs IN CONVENTIONAL PCBs NOTE:

  • Thermal resistance is junction-to-sink.
  • Anatech measurement taken at steady-state.
  • PCB secured to heat sink on PCB edges only

(50-100 psi?).

  • Thermal via + pad thermal resistance is about

7oC thru the power device+PCB and 4oC/W thru the insulation pad.

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SLIDE 11

Pressure dependency Pressure dependency

SOLID SOLID-

  • METAL THERMAL COLUMNS

METAL THERMAL COLUMNS IN CONVENTIONAL PCBs IN CONVENTIONAL PCBs

Thermal Impedance vs Pressure

0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 50 100 150 200 Pressure (psi) Thermal Impedance (oC-in2/W)

Insulated pad Phase-change Thermal grease

Isolated Non-isolated

Conventional thermal vias require insulation pads… …insulations pads require high-pressure to optimize thermal transfer to the heat sink. PowerVias use non-isolating thermal grease or phase-change material… ….these thermal compounds have little pressure dependency (and very high thermal transfer).

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SLIDE 12

SOLID SOLID-

  • METAL THERMAL COLUMNS

METAL THERMAL COLUMNS IN CONVENTIONAL PCBs IN CONVENTIONAL PCBs

PowerVia feature: PowerVia feature:

Excellent thermal management with conventional PCB packaging

Better thermal transfer and lower cost than Kapton+PSA circuits Much lower cost than IMS circuits Denser packaging – double-sided PCBs

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SLIDE 13

SOLID SOLID-

  • METAL THERMAL COLUMNS

METAL THERMAL COLUMNS IN CONVENTIONAL PCBs IN CONVENTIONAL PCBs

PowerVia design feature: PowerVia design feature: Double Double-

  • sided PCB, with flat

sided PCB, with flat-

  • faced

faced heat sink heat sink

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SLIDE 14

PowerVia design feature: PowerVia design feature:

Fully Fully-

  • assembled

assembled PCB, ‘snapped’ PCB, ‘snapped’

  • n to heat sink
  • n to heat sink

( (with no pressure dependency with no pressure dependency) )

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SLIDE 15

SOLID SOLID-

  • METAL THERMAL COLUMNS

METAL THERMAL COLUMNS IN CONVENTIONAL PCBs IN CONVENTIONAL PCBs

PowerVia design features: PowerVia design features: Cool power devices on the PCB

=> Move to SMT from through-hole (with off-the-board cooling)

Unified construction facilitates assembly and testing More compact designs (higher ‘power density’) Reduce system cost and SKUs

Conventional mounting (heat sink subassembly)

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SLIDE 16

PowerVia design feature: PowerVia design feature:

Fully Fully-

  • assembled PCB can be tested

assembled PCB can be tested without a heat sink without a heat sink

PowerVias have ‘thermal mass’ R-value of 15-30oC/W (est.)

SOLID SOLID-

  • METAL THERMAL COLUMNS

METAL THERMAL COLUMNS IN CONVENTIONAL PCBs IN CONVENTIONAL PCBs

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SLIDE 17

SOLID SOLID-

  • METAL THERMAL COLUMNS

METAL THERMAL COLUMNS IN CONVENTIONAL PCBs IN CONVENTIONAL PCBs

PowerVia design considerations: PowerVia design considerations:

PCB thickness consistency PCB precision routing for PowerVia ‘hole’ Volume vs cost

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SLIDE 18

PowerVia applications PowerVia applications

SOLID SOLID-

  • METAL THERMAL COLUMNS

METAL THERMAL COLUMNS IN CONVENTIONAL PCBs IN CONVENTIONAL PCBs

END USE:

  • Power supplies
  • Automotive control

modules

  • Motion control
  • Motor control

Mother PCB => Daughter PCB Heat sink => Thermal via

(plated-thru hole)

Heat sink => Discrete SMT components COLD HOT FORMAT: