MEMS Processes at CMP Bulk Micromachining MUMPs from MEMSCAP - - PowerPoint PPT Presentation

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MEMS Processes at CMP Bulk Micromachining MUMPs from MEMSCAP - - PowerPoint PPT Presentation

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its M ult lti- P rojets C ir ircuit MEMS Prototyping MPW Services Center for IC / MEMS Prototyping http://cmp.imag.fr Grenoble - France CMP annual users meeting, 4 Feb. 2016, PARIS MEMS Processes at CMP Bulk Micromachining MUMPs from

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Cir

ircuit itsMult lti-Projets

MPW Services Center for IC / MEMS Prototyping http://cmp.imag.fr Grenoble - France

CMP annual users meeting, 4 Feb. 2016, PARIS

MEMS Prototyping

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Bulk Micromachining MUMPs from MEMSCAP Teledyne DALSA MIDIS Micralyne MicraGEM-Si 2

MEMS Processes at CMP

CMP annual users meeting, 4 Feb. 2016, PARIS

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  • Compatible with electronics
  • Front side bulk micromachining
  • ams 0.35µ CMOS, SiGe, High Voltage

MPW run turnaround : 8/10 Weeks Post process turnaround : 5 weeks

Suspended passive device

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Bulk lk mic icromachinin ing on CMOS

CMP annual users meeting, 4 Feb. 2016, PARIS

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  • Compatible with electronics
  • Front side bulk micromachining
  • ams 0.8µ BiCMOS
  • Anisotropic Etching without

additional mask

Cross section Suspended passive device Suspended beams

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Bulk lk mic icromachinin ing on BiC iCMOS

CMP annual users meeting, 4 Feb. 2016, PARIS

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MEMs accelerometer and signal conditioning MPW A35C14_5

  • Front-end electronics close to MEMS sensor for better signal to noise ratio

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Bulk lk mic icromachinin ing desig igns

CMP annual users meeting, 4 Feb. 2016, PARIS Test sensor structures Fondazione Bruno Kessler MPW A35C11_5 Thermal inertial sensor LIRMM – MPW A35C11_6

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A CMOS Compatible Ultrasonic Transducer Fabricated With Deep Reactive Ion Etching Libor Rufer, Christian C. Domingues, Salvador Mir, Valérie Petrini, Jean-Claude Jeannot, and Patrick Delobelle JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 15, NO. 6, DECEMBER 2006

  • Applications : piezoresistive devices, pressure sensors, transducers
  • Discussions ongoing to provide such MEMS process along with ams 0.35 µ CMOS

Backside bulk micromachining Integration of MEMS sensor and front-end electronics Membrane and suspend structure on top of cavity

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Backside bulk lk mic icromachining

CMP annual users meeting, 4 Feb. 2016, PARIS

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Design Kit

  • Standard DK for the 0.35µ CMOS process C35B4C3 from ams
  • Design Rule Manual and technology files provided for MEMS

structures

  • MEMS DK for :

Fabrication schedule

  • ams C35B4C3 : next run starts on June 13th

Price list

  • 650 €/mm² (4 mm² mini) + 3700 € for 10 chips

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Access to bulk lk mic icromachin inin ing

CMP annual users meeting, 4 Feb. 2016, PARIS

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  • Company created in 1997, technology

available through CMP since 1998

  • 4 different processes :

 PolyMUMPs  SOIMUMPs  MetalMUMPs  PiezoMUMPs

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MEMSCAP

CMP annual users meeting, 4 Feb. 2016, PARIS

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SLIDE 9

Features

  • 2 mechanical and 1 electrical layer of polysilicon
  • 2 sacrificial layers
  • 1 electrical conduction layer
  • 1 electrical isolation layer
  • Optional post process : etching/release, CO2

drying, sawing

POLY 2

Applications

  • Acoustics

(microphones)

  • Accelerometers
  • Micro-fluidics
  • Display Technologies

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Poly lyMUMPs

CMP annual users meeting, 4 Feb. 2016, PARIS

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SLIDE 10

Features

  • Silicon On Insulator substrate
  • Reactive-Ion Etching (RIE)
  • 10 to 25 µm structural layer
  • 2 Metal layers

Si Substrate METAL OXYDE

SOIM IMUMPs

Applications

  • Gyros
  • Optical devices
  • Display technology

Cross section of RIE etching

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SOIMUMPs

CMP annual users meeting, 4 Feb. 2016, PARIS

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SLIDE 11

Substrate

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MetalMUMPs

CMP annual users meeting, 4 Feb. 2016, PARIS

Features

  • Thick metal layers : electroplating Nickel

(18-22 µm)

  • Surface and Bulk Micromachining
  • Metallization on the walls

Applications

  • Relays
  • Microfluidics
  • Magnetic Switches
  • RF Devices
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SLIDE 12

Features

  • Based on SOIMUMPs process
  • 0.5 µm Aluminium Nitride

piezoelectric layer

  • Active piezoelectric device
  • 2 Metal layers

Applications

  • Energy harvesting
  • Ultrasonic

transducers

  • Microphones
  • Actuators

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Pie iezoMUMPs

CMP annual users meeting, 4 Feb. 2016, PARIS

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Design kits and CAD tools

  • Physical design, DRC :
  • Specific MEMS CAD tools :

Fabrication Schedule

  • PolyMUMPs : 4 runs in 2016
  • SOIMUMPs : 3 runs in 2016
  • MetalMUMPs : 1 runs in 2016
  • PiezoMUMPs : 3 runs in 2016

Price list1

  • PolyMUMPs : 3700 $2/4600 $3 (added cost for optional post-process)
  • SOIMUMPs : 3700 $2/4600 $3
  • MetalMUMPs : 3700 $2/4600 $3
  • PiezoMUMPs : 3700 $2/4600 $3

1: for 15 identical chips 1cmx1cm fixed size except for SOIMUMPs 0,9x0,9cm 2: price for Educational Institutions and Research Laboratories 3: price for Industrial Companies

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Access to MUMPs

CMP annual users meeting, 4 Feb. 2016, PARIS

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MEMS Integrated Design for Inertial Sensors (MIDIS™)

Features

  • Getter-free high-vacuum sealing allows resonator Q factors > 20,000
  • Efficient wafer-level packaging minimizes overall die size
  • 1.5 μm feature size in a 30 μm thick membrane
  • Comb height control allows out-of-plane sensing
  • TSV allows compact design ready for co-packaging

Applications

  • Accelerometers
  • Gyroscopes
  • Resonators
  • Inertial sensor combos (Sensor fusion)

Inertial sensor Courtesy of CMC

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Tele ledyne DALSA MID IDIS pla latform

CMP annual users meeting, 4 Feb. 2016, PARIS

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SLIDE 15

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Tele ledyne DALSA MID IDIS pla latform

CMP annual users meeting, 4 Feb. 2016, PARIS

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Cross section of Typical MIDIS process

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Tele ledyne DALSA MID IDIS pla latform

CMP annual users meeting, 4 Feb. 2016, PARIS

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Process Design Kit from Teledyne DALSA

  • Process parameters specifications
  • Design rules
  • DRC deck
  • Technology files for solid model generation
  • MIDIS solid model generation
  • Offers a truly representative 3D view of your design
  • Ready for design review
  • Multi-physics simulations

Fabrication schedule

  • 2 runs scheduled for 2016 (1st run March 10th/devices shipment 31st July)

Price list

  • 9830 $ per 4x4mm minimum for 40 chips

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Access to MID IDIS

CMP annual users meeting, 4 Feb. 2016, PARIS

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MicraGEM-Si Platform

MicraGEM‐SiTM technology based on a Silicon‐on‐insulator (SOI) MEMS process features two thick SOI structure layers and gold metallization on the top surface, enabling the design of vertical comb drive actuators along with optically flat silicon surface. Target applications include variable optical attenuators (VOA) and wavelength selective switch (WSS) modules as well as resonators and bio

  • sensors. Horizontal comb drives can also be created for use in inertial sensors.

Academic Price : $4,800 (4mm x 4mm) Fixed size Price for Industry : $6,000 (4mm x 4mm) Fixed size

Mic icralyne Mic icraGEM-Si i process

CMP annual users meeting, 4 Feb. 2016, PARIS

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MEMS offer overview

CMP annual users meeting, 4 Feb. 2016, PARIS

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SLIDE 20

Leveraging MEMS prototyping platforms for research and commercialization Tuesday, February 23, 2016 9:00am and 2:00pm EST Webinar offered at different times for your convenience Webinar organized by CMC Microsystems

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Webinar MEMS 23rd

rd of February

Presentations:

  • Development and fabrication of micro-electrostatic actuators using a

piston-tube configuration leading to large force generation

  • Ultra-clean wafer-level vacuum encapsulation of MEMS devices

Registration : http://www.cmc.ca/NewsAndEvents/Webinars/MEMSWebinar.aspx

CMP annual users meeting, 4 Feb. 2016, PARIS

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SLIDE 21

Thank you !

CMP annual users meeting, 4 Feb. 2016, PARIS