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Lecture 19:Processes and Equipments for MEMS at NanoFab IITB ME 645: MEMS: ME 645: MEMS: Design Fabrication Design Fabrication Design, Fabrication Design, Fabrication and Characterization and Characterization P.S. Gandhi P.S. Gandhi


  1. Lecture 19:Processes and Equipments for MEMS at NanoFab IITB ME 645: MEMS: ME 645: MEMS: Design Fabrication Design Fabrication Design, Fabrication Design, Fabrication and Characterization and Characterization P.S. Gandhi P.S. Gandhi Mechanical Engineering Mechanical Engineering Mechanical Engineering Mechanical Engineering IIT Bombay IIT Bombay Acknowledgements: Anand Savalia and CEN (Center of Excellence in Nanoelectronics) PRASANNA S GANDHI gandhi@me.iitb.ac.in PRASANNA S GANDHI gandhi@me.iitb.ac.in RCA (Radio Corporation of RCA (Radio Corporation of America) Cleaning Process America) Cleaning Process Developed by W Kern in 1965 Major steps: M j M j Major steps: t t � Organic clean Organic clean – – Removal of organic Removal of organic contaminants RCA 1 contaminants RCA 1 � Ionic clean Ionic clean – – Removal of heavy metal atomic Removal of heavy metal atomic and ionic contaminants RCA 2 and ionic contaminants RCA 2 � Oxide strip Oxide strip – removal of thin oxide after each of removal of thin oxide after each of the above the above � VIMP: Dangerous chemicals safety precautions VIMP: Dangerous chemicals safety precautions PRASANNA S GANDHI gandhi@me.iitb.ac.in PRASANNA S GANDHI gandhi@me.iitb.ac.in 1

  2. RCA Cleaning Process RCA Cleaning Process Salient procedural details � Prep: Removal of grease and oil Prep: Removal of grease and oil Prep: Removal of grease and oil Prep: Removal of grease and oil � H 2 SO SO 4 at 70 deg for 15min followed by 3 times DI at 70 deg for 15min followed by 3 times DI water rinse water rinse � HF dip 30 sec followed by 3 times DI water HF dip 30 sec followed by 3 times DI water � Organic clean Organic clean - - RCA 1 RCA 1 � NH NH 4 OH : H OH : H 2 O 2 : DI water 1:2:7 at ~ 50deg for ~ 7 min : DI water 1:2:7 at ~ 50deg for ~ 7 min 4 2 2 � Cool for ~ 10 min followed by 3 times DI water rinse Cool for ~ 10 min followed by 3 times DI water rinse � HF dip 30 sec followed by 3 times DI water HF dip 30 sec followed by 3 times DI water PRASANNA S GANDHI gandhi@me.iitb.ac.in PRASANNA S GANDHI gandhi@me.iitb.ac.in RCA Cleaning Process RCA Cleaning Process Salient procedural details � Ionic clean Ionic clean Ionic clean Ionic clean – Removal of heavy metal atomic Removal of heavy metal atomic Removal of heavy metal atomic Removal of heavy metal atomic and ionic contaminants RCA 2 and ionic contaminants RCA 2 � HCL : H HCL : H 2 O 2 : DI water 1:2:7 at ~ 50deg for ~ 5 min : DI water 1:2:7 at ~ 50deg for ~ 5 min � Cool for ~ 7 min followed by 3 times DI water rinse Cool for ~ 7 min followed by 3 times DI water rinse � HF dip 30 sec followed by 3 times DI water HF dip 30 sec followed by 3 times DI water PRASANNA S GANDHI gandhi@me.iitb.ac.in PRASANNA S GANDHI gandhi@me.iitb.ac.in 2

  3. RCA Cleaning Process RCA Cleaning Process Video of the process: Observe the way its carried out PRASANNA S GANDHI gandhi@me.iitb.ac.in PRASANNA S GANDHI gandhi@me.iitb.ac.in Spinning Process Spinning Process Pictures of the equipment PRASANNA S GANDHI gandhi@me.iitb.ac.in PRASANNA S GANDHI gandhi@me.iitb.ac.in 3

  4. Spinning Process Spinning Process Video of the process: Observe the way its carried out PRASANNA S GANDHI gandhi@me.iitb.ac.in PRASANNA S GANDHI gandhi@me.iitb.ac.in Lithography Lithography Pictures of the equipment: Double sided aligner PRASANNA S GANDHI gandhi@me.iitb.ac.in PRASANNA S GANDHI gandhi@me.iitb.ac.in 4

  5. Direct Laser Direct Laser Writer Writer Pictures of the equipment: Lithography PRASANNA S GANDHI gandhi@me.iitb.ac.in PRASANNA S GANDHI gandhi@me.iitb.ac.in El Electron Electron El t t Beam Beam Lithography Lithography Pictures of the equipment: Lithography Lithography PRASANNA S GANDHI gandhi@me.iitb.ac.in PRASANNA S GANDHI gandhi@me.iitb.ac.in 5

  6. Metal Sputter System Metal Sputter System Pictures of the equipment: Sputtering PRASANNA S GANDHI gandhi@me.iitb.ac.in PRASANNA S GANDHI gandhi@me.iitb.ac.in Dielectric Sputter System Dielectric Sputter System Pictures of the equipment: Sputtering PRASANNA S GANDHI gandhi@me.iitb.ac.in PRASANNA S GANDHI gandhi@me.iitb.ac.in 6

  7. Electron Beam Evaporator Electron Beam Evaporator Pictures of the equipment: Evaporator PRASANNA S GANDHI gandhi@me.iitb.ac.in PRASANNA S GANDHI gandhi@me.iitb.ac.in Pictures of the equipment: Evaporator Thermal Thermal Thermal Thermal Evaporator Evaporator PRASANNA S GANDHI gandhi@me.iitb.ac.in PRASANNA S GANDHI gandhi@me.iitb.ac.in 7

  8. Thermal Thermal Thermal Thermal Evaporator Evaporator Target and the heater PRASANNA S GANDHI gandhi@me.iitb.ac.in PRASANNA S GANDHI gandhi@me.iitb.ac.in Oxidation Furnace Oxidation Furnace Pictures of the equipment: Evaporator PRASANNA S GANDHI gandhi@me.iitb.ac.in PRASANNA S GANDHI gandhi@me.iitb.ac.in 8

  9. Thank You Thank You PRASANNA S GANDHI gandhi@me.iitb.ac.in PRASANNA S GANDHI gandhi@me.iitb.ac.in 9

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