Iron in crystalline silicon solar cells: fundamental properties, - - PowerPoint PPT Presentation

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Iron in crystalline silicon solar cells: fundamental properties, - - PowerPoint PPT Presentation

Iron in crystalline silicon solar cells: fundamental properties, detection techniques, and gettering Daniel Macdonald, AnYao Liu, and Sieu Pheng Phang Research School of Engineering The Australian National University, Canberra Outline


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Iron in crystalline silicon solar cells: fundamental properties, detection techniques, and gettering

Daniel Macdonald, AnYao Liu, and Sieu Pheng Phang Research School of Engineering The Australian National University, Canberra

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  • Origins of Fe in multicrystalline Si ingots
  • Chemical states and recombination activity of Fe in silicon
  • Measuring [Fei] by QSSPC and PL imaging
  • Gettering of Fe during ingot growth and cell fabrication:

– Internal gettering – at GBs, dislocations and within grains – External gettering by P, Al and B diffusions

Outline

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  • One of the most common

metal contaminants

  • Total Fe concentration,

measured by NAA before and after P gettering

  • Comes from the crucible,

not the feedstock

  • Typically between

1012 -1015 cm-3

Origins of Fe in multicrystalline Si ingots

Macdonald et al. 29th IEEE PVSC New Orleans (2002)

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  • Concentration increases

towards top - segregation

  • Also increases at bottom –

solid-state diffusion from crucible

  • Only a small fraction is

interstitial - around 1%

  • Remainder is precipitated

(or substitutional)

  • The dissolved fraction has a

much larger impact on lifetime

Origins of Fe in multicrystalline Si ingots

0.1 1 1011 1012 1013 1014 1015 1016 1017 keff = 0.65 B keff < 0.05 keff < 0.05 interstitial Fe Impurity concentration (cm-3) Fraction from top of ingot total Fe

Macdonald et al. J. Appl. Phys. 97 033523 (2005)

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Recombination activity of interstitial Fe in silicon

conduction band valence band FeB0/+ (EV+0.1 eV) FeB0/- (EC-0.26 eV) Fei

0/+ (EV+0.38 eV)

  • Interstitial Fe (Fei) introduces a deep donor level
  • Positively charged in p-type Si - mobile at RT -

forms pairs with ionised acceptors.

  • Two FeB levels – acceptor and donor
  • Pairs break under illumination – only Fei present

in working cells

Courtesy of J. Schmidt, ISFH

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Recombination activity of Fe in p-type silicon

  • Different energy levels and capture cross sections - different lifetime

curves

  • SRH modelling on left, QSSPC data on right (trapping restricts range)

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12

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10

14

10

15

10

16

10

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1 10 100 crossover point

1 Ω.cm p-type Si

FeB lifetime Carrier lifetime (µs) Excess carrier density ∆n (cm

  • 3)

Fei lifetime

Macdonald et al. J. Appl. Phys. 95 1021 (2004)

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Detecting Fei using FeB pairing

  • Manipulating the SRH equations

shows that:

  • Zoth and Bergholz developed a

famous method based on SPV

  • Extended to other methods (uW-

PCD and QSSPC)

  • Very sensitive (similar to DLTS)
  • Only works in p-Si
  • Must avoid the crossover point

10

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15

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10

17

10 100 1000

crossover point QSSPC SPV Fe

i lifetime

FeB lifetime Auger lifetime µW-PCD

Carrier lifetime (µs) Excess carrier concentration (cm

  • 3)

p-Si, N

A=10 16cm

  • 3, [Fe

i]=10 12cm

  • 3

        − × =

FeB Fe i

i

C Fe τ τ 1 1 ] [

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Detecting Fei using FeB pairing

  • Pre-factor C is a function of

doping and excess carrier density.

  • In true low injection, C becomes

constant – ideal measurement region.

  • Not accessible to QSSPC or

uW-PCD (trapping effects).

10

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10

13

10

15

10

17

  • 1x10
  • 13

1x10

  • 13

2x10

  • 13

3x10

  • 13

4x10

  • 13

5x10

  • 13

6x10

  • 13

N

A= 3x10 16cm

  • 3

1x10

16

3x10

15

1x10

15

3x10

14

1x10

14

1/C (µs cm

  • 3 )

Excess carrier density ∆n (cm

  • 3)

        − × =

FeB Fe i

i

C Fe τ τ 1 1 ] [

Macdonald et al. J. Appl. Phys. 95 1021 (2004)

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Iron imaging with photoluminescence (PL)

  • Band-to-band PL imaging - rapid and highly-resolved method for

low-injection lifetime imaging – no trapping effects.

  • Allows low-injection Fe imaging - similar to original SPV technique
  • Two PL images required, before and after breaking FeB pairs.

1011 1012 1013 1014 1015 1016 1017 1 10 100 1000

100% Fei : 0% FeB 75% : 25% 50% : 50% 25% : 75% 0% : 100% Auger lifetime crossover point QSSPC SPV PL imaging µW-PCD

Carrier lifetime (µs) Excess carrier concentration ∆n (cm

  • 3)

p-Si, NA=1016cm-3, [Fei]+[FeB]=1012cm-3

Macdonald et al. J. Appl. Phys. 103, 073710 (2008)

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Recombination activity of Fe in n-type silicon

  • Neutral charge state in n-type – less attractive for minority carriers

compared to p-type.

  • Higher lifetime in n-type in low- to mid-injection.
  • Possible incentive for using n-type substrates…

1012 1013 1014 1015 1016 1017 0.1 1 10 100 1000 10000 n-type FZ Si ND=2.4x1015cm-3 [Fei]=3.8x1012cm-3 p-type FZ Si NA=2.8x1015cm-3 [Fei]=3.4x1012cm-3 Recombination lifetime (µs) Excess carrier concentration (cm-3)

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0.01 0.1 1 10 100 1000 10000 n-type p-type

Effective lifetime τFe+intrinsic (µs) Interstitial Fe concentration [Fei ] (cm

  • 3)

NA/D = 10

16 cm

  • 3, 0.1 suns illumination

Macdonald and Geerligs, Appl. Phys. Lett. 85 4061 (2004)

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Fe images on mc-Si

  • Wafer 20% from bottom
  • f ingot
  • High [Fei] (1013 cm-3)
  • Internal gettering of Fe

during ingot cooling at GBs, dislocation clusters

Liu et al. Progress in PV, 19 649 (2011)

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Fe images on mc-Si

  • Wafer from near very

bottom of ingot

  • Moderate [Fei] (1012 cm-3)
  • Small grains
  • Fewer dislocation

clusters

  • Lower [Fei] within grains

– presence of precipitation sites

Liu et al. Progress in PV, 19 649 (2011)

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Fe images on mc-Si

  • Wafer from middle of

ingot

  • Low [Fei] (1011 cm-3)
  • Reduced gettering at

GBs (due to precipitation starting at lower T)

Liu et al. Progress in PV, 19 649 (2011)

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Internal gettering of Fe at GBs during ingot cooling

  • Line-scans of PL images with resolution of 25 microns
  • 1D diffusion/capture model – 2 free parameters – diffusion length of Fei LD(Fei) and

precipitation velocity P of the GB

  • Have to take care of PL artifacts!

– Image smearing in the CCD camera - use point-spread function de-convolution – Carrier spreading in the sample – use low-lifetime – i.e. high [Fei] samples)

Liu and Macdonald, IEEE JPV 2, 479, (2012)

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Internal gettering of Fe at GBs during ingot cooling

  • Same GB on different wafers reveals diffusion length of Fei LD(Fei) depends on initial [Fei]
  • Lower [Fei] means that precipitation begins later during cooling
  • Modelling ingot cooling time reveals data can only be explained if precipitation at GBs

commences after super-saturation ratio of about 50 is reached!

Liu and Macdonald, IEEE JPV 2, 479, (2012)

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Internal gettering of Fe at GBs during annealing

  • Annealing at low temps can drive further precipitation at GBs, and within

grains.

  • Higher temperatures tend to homogenise the dissolved Fe
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  • At 600 ºC, [Fei] is far above

solubility limit:

  • Strong super-saturation
  • Drives precipitation at GBs,

and within grains

  • At 800 ºC, [Fei] is approx equal to

the solubility limit:

  • No precipitation
  • At 900 ºC and above, [Fei] is

below solubility limit:

  • No precipitation
  • Homogenization by diffusion
  • Dissolution of precipitates

also possible

Internal gettering of Fe at GBs during annealing

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Internal gettering of Fe at GBs during annealing

  • 500 C annealing for various times
  • 1D diffusion/capture model:
  • Widening denuded zone
  • Reduced intra-grain [Fei]
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  • At fixed temp annealing, diffusion

length of Fe can be calculated from literature values.

  • Very good agreement with fitted

values (500 ºC)

  • A method to measure diffusivity?

Internal gettering of Fe at GBs during annealing

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  • After homogenization on left, after 14 hour anneal at 500 °C on right.
  • Precipitation rate varies from grain to grain.

Internal gettering of Fe within the grains

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  • Precipitation rate varies despite initial Fe concentrations being similar

Internal gettering of Fe within the grains

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Final [Fei] with respect to intra grain dislocation density, after annealing at 500oC for 14.5 hours Microscope image of a defect etched mc-Si wafer

Internal gettering of Fe within the grains

  • Less Fe precipitation in grains of low dislocation density
  • Average distance between dislocations is less than Fe diffusion length
  • Dislocations act as nucleation sites for Fe precipitation within grains
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External gettering of Fei by P, Al and B diffusions

  • Fe-implanted, annealed, mono FZ p-Si, detected by QSSPC.

implant Fe anneal P, B or Al diffusion

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P , 8 5 C P , 8 C P , 7 5 C P , 8 5 + 6 5 C

  • 0.01

0.1 1 10 100 Percentage of Fe remaining (%)

Phosphorus gettering of Fei

  • P gettering removes between 90-99% of Fe – better at lower temp
  • Adding a post-getter anneal improves gettering further – segregation ratio

improves

Phang and Macdonald, JAP 109, 073521 2011

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Phosphorus gettering of Fei

  • Driving in P diffusion reduces gettering effectiveness
  • Very heavily doped region (>1020 cm-3) required for best gettering

Phang and Macdonald, IEEE JPV accepted

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Aluminium gettering of Fei

  • Al gettering removes more than 99.9%!
  • However, typical BSF firing is too short for Al gettering to rear side…

P, 850 C P, 800 C P, 750 C P, 850 + 650 C Al, 850 C, 55 min Al, 750 C, 55 min Al, 750 C, 15 sec

  • 0.01

0.1 1 10 100 Percentage of Fe remaining (%)

Phang and Macdonald, JAP 109, 073521 2011

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Boron gettering of Fei

  • B gettering very effective if Boron Rich Layer (BRL) is present.
  • However, BRL is oxidised in-situ to allow low Joe - re-injects Fe into base.
  • Even a low temp anneal does not help much…

P, 850 C P, 800 C P, 750 C P, 850 + 650 C Al, 850 C, 55 min Al, 750 C, 55 min Al, 750 C, 15 sec B, 950 C +BRL B, 950 C no BRL B, 950+650 no BRL

0.01 0.1 1 10 100 Percentage of Fe remaining (%)

Phang et al., IEEE JPV 3, 261, 2013

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Boron gettering of Fei

  • One solution is to remove the BRL at low temp by etch-back
  • Preserves gettering
  • Allows lower Joe

Phang et al., IEEE JPV 3, 261, 2013

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Boron gettering of Fei

  • Another idea is to overlay a light phosphorus diffusion – ‘buried emitter’.
  • Gives very good gettering

Phang and Macdonald, IEEE JPV accepted

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Conclusions

  • Fe is common in mc-Si wafers, both dissolved and precipitated
  • Dissolved iron more active in p-type than n-type due to charge state
  • QSSPC allows very sensitive [Fei] measurements
  • PL allows spatially resolved Fe imaging
  • Gettering of dissolved Fe is critical for mc-Si cells
  • Internal gettering at GBs, dislocations and in intra-grain regions
  • Strong super-saturation required
  • External gettering via P, B or Al diffusions can be very effective
  • Al and B more effective than P
  • However, B diffusions require the presence of a BRL

Acknowledgements: this work has been supported by the Australian Research Council (ARC).