INTEGRATED COOLING CHANNELS IN POSITION-SENSITIVE SILICON DETECTORS - - PowerPoint PPT Presentation

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INTEGRATED COOLING CHANNELS IN POSITION-SENSITIVE SILICON DETECTORS - - PowerPoint PPT Presentation

Aug 19, 2022 223 likes •428 views

20TH INTERNATIONAL WORKSHOP ON DEPFET DETECTORS AND APPLICATIONS INTEGRATED COOLING CHANNELS IN POSITION-SENSITIVE SILICON DETECTORS L. ANDRICEK, M. BORONAT, J. FUSTER, I. GARCA, P. GOMIS, C. MARIAS, J. NINKOVIC, M. PERELL, M. A.

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SLIDE 1

INTEGRATED COOLING CHANNELS IN POSITION-SENSITIVE SILICON DETECTORS

  • L. ANDRICEK, M. BORONAT, J. FUSTER,
  • I. GARCÍA, P. GOMIS, C. MARIÑAS, J. NINKOVIC,
  • M. PERELLÓ, M. A. VILLAREJO, M. VOS

20TH INTERNATIONAL WORKSHOP ON DEPFET DETECTORS AND APPLICATIONS

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SLIDE 2
  • P. Gomis (Pablo.Gomis@ific.uv.es) @ 20th International Workshop on DEPFET Detectors and Applications - 13/05/2016

CONTENTS

2

  • 1. MCC case for physics detectors
  • 2. MCC DEPFET-like module
  • 3. Finite element simulation
  • 4. Setup & results:

4.1. Thermal performance 4.2. Mechanical impact

  • 5. Cooling a whole powered module
  • 6. A more realistic approach: considering the bumps
  • 7. Next steps & summary
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SLIDE 3
  • P. Gomis (Pablo.Gomis@ific.uv.es) @ 20th International Workshop on DEPFET Detectors and Applications - 13/05/2016

MCC CASE FOR PHYSICS DETECTORS

3

PXD Cooling and support structure

  • Belle II cooling structure

would be too massive to higher acceptance detectors like ILC.

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SLIDE 4
  • P. Gomis (Pablo.Gomis@ific.uv.es) @ 20th International Workshop on DEPFET Detectors and Applications - 13/05/2016

MCC DEPFET-LIKE MODULE: PRODUCTION

4

Handle before bonding Dummy X-ray

  • An integrated cooling channel is

designed for a DEPFET module, focusing in the EOS.

  • The MCC production adds one extra

step to the chain: etching the µ- channel in the handle wafer.

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SLIDE 5
  • P. Gomis (Pablo.Gomis@ific.uv.es) @ 20th International Workshop on DEPFET Detectors and Applications - 13/05/2016

MCC DEPFET-LIKE MODULE: CONNECTORS

5

H2O

In order to feed the cooling circuit a number of connectors to interface with commercial fitting elements have been designed:

Past (0.81% X/X0) Present (0.2% X/X0) Future (0.05% X/X0)

  • Self aligning

connector

  • 3D-printed (15 µm precision)
  • Glue sealed

Up to 183 bar

0.05% X/X0/5 cm

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SLIDE 6
  • P. Gomis (Pablo.Gomis@ific.uv.es) @ 20th International Workshop on DEPFET Detectors and Applications - 13/05/2016

FINITE ELEMENT SIMULATION (I)

6

Volumetric flow [l/h]

0.2 0.4 0.6 0.8 1 1.2 1.4

/W]

2

T/Power density [K cm ∆

1 2 3 4 5 6 O 2 FE Simulation H FE Simulation PWG6040

6W

H2O

TEMPERATURE = 25 ºC

  • Low-cost mono-phase cooling

liquid: H2O.

  • Low volumetric flows (~1 l/h)

and low pressure (< 1 bar) are enough to dissipate 6 W in the EOS.

  • Possibility to use CO2 at high

pressure, but not necessary at the power densities studied.

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SLIDE 7
  • P. Gomis (Pablo.Gomis@ific.uv.es) @ 20th International Workshop on DEPFET Detectors and Applications - 13/05/2016

EXPERIMENTAL SETUP: SCHEME

7

ROOM TEMPERATURE ~25 ºC

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SLIDE 8
  • P. Gomis (Pablo.Gomis@ific.uv.es) @ 20th International Workshop on DEPFET Detectors and Applications - 13/05/2016

EXPERIMENTAL SETUP: REALITY

8

PERISTALTIC PUMP SHOCK ABSORBER PURITY FILTER FLOWMETER TERMOMETERS CLAMPED-FREE MCC SI MODULE AIR COOLING INTERFEROMETER @ 50 KHZ INFRARED LASER WATER STORAGE

Air

H2O

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SLIDE 9
  • P. Gomis (Pablo.Gomis@ific.uv.es) @ 20th International Workshop on DEPFET Detectors and Applications - 13/05/2016

RESULTS: THERMAL PERFORMANCE (I)

9

  • MCC dummy cooled non-stop for a week with no leaks and no clogging.
  • Good agreement with the FE simulation (within 10% error).

Errors:

✦ P: ±1% W ✦ T: ±1 ºC ✦ Flow:

±0.03 l/h

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SLIDE 10
  • P. Gomis (Pablo.Gomis@ific.uv.es) @ 20th International Workshop on DEPFET Detectors and Applications - 13/05/2016

RESULTS: THERMAL PERFORMANCE (II)

10

  • Max. power supported for

ΔT of 10 ºC as a function

  • f the volumetric flow:
  • Power capped at max.

pump power ~3 l/h

  • Low pressure

measured: 0.2 - 1.5 bar

0-22W

H2O

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SLIDE 11
  • P. Gomis (Pablo.Gomis@ific.uv.es) @ 20th International Workshop on DEPFET Detectors and Applications - 13/05/2016

RESULTS: MECHANICAL IMPACT (I)

11

No fluid circulation and no air flowing Peak to peak of the signal ~0.7 μm RMS ~0.3 μm Air flowing (3 m/s) Peak to peak of the signal ~130 μm RMS ~57 μm Fluid circulation (1.47 l/h) Peak to peak of the signal ~0.1 μm RMS ~0.4 μm

MCC has no significant impact on mechanical stability in the clamped-free configuration but air deformations are over 100 μm for v = 3 m/s.

Time [s] 2 4 6 8 10 12 14 16 18 20 Signal [mm] 9.34 9.36 9.38 9.4 9.42 9.44 9.46 9.48 9.5 9.52 Air flow (v=3m/s) Time [s] 5 5.5 6 6.5 7 7.5 8 8.5 9 9.5 10 Signal [mm] 9.3836 9.3837 9.3838 9.3839 9.384 9.3841 9.3842 9.3843 9.3844 9.3845 9.3846 NO fluid circulation Time [s] 5 5.5 6 6.5 7 7.5 8 8.5 9 9.5 10 Signal [mm] 9.3344 9.3346 9.3348 9.335 9.3352 9.3354 9.3356 9.3358 Fluid circulation 50% (1.47 l/h)
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SLIDE 12
  • P. Gomis (Pablo.Gomis@ific.uv.es) @ 20th International Workshop on DEPFET Detectors and Applications - 13/05/2016

WHOLE POWERED MODULE: HYBRID APPROACH

12

6W Air 0.5 m/s

H2O

1W 0.5W

Volumetric flow [l/h]

0.2 0.4 0.6 0.8 1 1.2 1.4

C]

  • T [

∆

10 20 30 40 50 60

Sensor: MCC Sensor: MCC+air

  • Big difference between MCC and

MCC+air at the sensor area hottest point.

  • Nearest regions to air input are

efficiently cooled even with low air flow.

  • MCC has less impact in away points as

expected and great cooling locally.

Cooling strategy: micro-channels running under the front end and gentle air flow on the sensor part. SENSOR HOTTEST POINT

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SLIDE 13
  • P. Gomis (Pablo.Gomis@ific.uv.es) @ 20th International Workshop on DEPFET Detectors and Applications - 13/05/2016

WHOLE POWERED MODULE: MCC ALTERNATIVES

13

Standard MCC layout ΔT = 73 K

Front end HOTTEST

Standard MCC layout + channel below switchers ΔT = 15 K Standard MCC layout + channel below switchers + channel in the balcony ΔT = 5 K

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SLIDE 14
  • P. Gomis (Pablo.Gomis@ific.uv.es) @ 20th International Workshop on DEPFET Detectors and Applications - 13/05/2016

MORE REALISTIC APPROACH: BUMPS

14

Volumetric flow [l/h]

0.2 0.4 0.6 0.8 1 1.2 1.4

/W]

2

T/Power density [K cm ∆

1 2 3 4 5 6 7 8 9

O 2 FE Simulation H O realistic design 2 FE Simulation H

Realistic design 300 μm Si ASICS + 100 μm Bump-boundings thermal resistivity of 6 W/m·K

6W

H2O

Front end HOTTEST POINT

In the realistic design the power dissipation is degraded

Carlos Mariñas PhD Thesis

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SLIDE 15
  • P. Gomis (Pablo.Gomis@ific.uv.es) @ 20th International Workshop on DEPFET Detectors and Applications - 13/05/2016

NEXT STEPS

15

  • Test the radiation resistance of the 3D-printed connectors.
  • Repeat the thermo-mechanical measurements for the new

designs of the connectors.

  • Reproduce the study for the more realistic approach, with

bumped resistors instead of printed ones.

  • Produce and test the thermo-mechanical properties of the

whole powered modules of the new MCC alternative layouts.

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SLIDE 16
  • P. Gomis (Pablo.Gomis@ific.uv.es) @ 20th International Workshop on DEPFET Detectors and Applications - 13/05/2016

SUMMARY

16

  • MCC shows very efficient local cooling, up to 25 W/cm2 for ΔT ~

10º C using low pressure mono-phase cooling liquid.

  • The thermal measurements agree with the FE simulation.
  • MCC has negligible impact on the module mechanical stability.
  • Three in-plane connector concepts have been designed and

manufactured, going towards less massive connectors.

  • MCC modules have been successfully assembled (in 3/3),
  • perated non-stop for a week, and supporting pressures up to

183 bars.

  • These features qualify MCC as a real option for silicon detectors

in physics.

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SLIDE 17
  • P. Gomis (Pablo.Gomis@ific.uv.es) @ 20th International Workshop on DEPFET Detectors and Applications - 13/05/2016

THANKS FOR YOUR ATTENTION

THIS STUDY IS SUPPORTED BY THE AIDA2020 THERMO-MECHANICAL PACKAGE MORE INFORMATION AVAILABLE AT ARXIV:1604.08776

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SLIDE 18
  • P. Gomis (Pablo.Gomis@ific.uv.es) @ 20th International Workshop on DEPFET Detectors and Applications - 13/05/2016

BACKUP

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SLIDE 19
  • P. Gomis (Pablo.Gomis@ific.uv.es) @ 20th International Workshop on DEPFET Detectors and Applications - 13/05/2016

VIBRATION’S SPECTRAL POWER DENSITY

19

Frecuency [Hz]

100 101 102 103 104

PSD [mm2/Hz]

10-14 10-12 10-10 10-8 10-6 10-4

NO fluid circulation Fluid circulation 15% (0.45 l/h) Fluid circulation 50% (1.47 l/h) Air flow (v=3m/s)

Ladder eigenfrequency (~150 Hz)

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SLIDE 20
  • P. Gomis (Pablo.Gomis@ific.uv.es) @ 20th International Workshop on DEPFET Detectors and Applications - 13/05/2016

VIBRATION AMPLITUDE VS. AIR SPEED

20

  • Peak-to-peak amplitude is the change between peak (highest amplitude value) and

trough (lowest amplitude value)

  • RMS ≃ (PeaktoPeak/2) * 0.707 (approximation)
  • For v= 2.5 m/s the amplitude of vibration is:
  • ~19 μm for clamped-free configuration
  • ~2.8 μm for clamped-clamped configuration
v[m/s] 0.5 1 1.5 2 2.5 m] µ [ y RMS 10 20 30 40 50 60 / ndf 2 χ 1.049 / 5 Prob 0.9585 p0 0.05772 ± 0.0003824 − p1 2.266 ± 8.413 p2 1.208 ± 5.222 / ndf 2 χ 1.049 / 5 Prob 0.9585 p0 0.05772 ± 0.0003824 − p1 2.266 ± 8.413 p2 1.208 ± 5.222

Peak to peak

v[m/s] 0.5 1 1.5 2 2.5 m] µ [ y RMS 1 2 3 4 5 6 7 8

/ ndf

2

χ 11.36 / 5 Prob 0.04467 p0 0.05779 ± 0.005478 p1 0.291 ± 0.8508 p2 0.1558 ± 0.9325 / ndf

2

χ 11.36 / 5 Prob 0.04467 p0 0.05779 ± 0.005478 p1 0.291 ± 0.8508 p2 0.1558 ± 0.9325

Peak to peak

Clamped-Free Clamped-Clamped