FLEXIBLE THERMAL MANAGEMENT CIRCUITS FLEXIBLE THERMAL MANAGEMENT - - PowerPoint PPT Presentation

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FLEXIBLE THERMAL MANAGEMENT CIRCUITS FLEXIBLE THERMAL MANAGEMENT - - PowerPoint PPT Presentation

Oct 10, 2022 35 likes •176 views

FLEXIBLE THERMAL MANAGEMENT CIRCUITS FLEXIBLE THERMAL MANAGEMENT CIRCUITS BONDED DIRECTLY TO ALUMINUM HEAT SINKS BONDED DIRECTLY TO ALUMINUM HEAT SINKS IMAPS Jim Fraivillig Thermal Management Fraivillig Technologies Boston, MA Palo Alto, CA

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SLIDE 1

FLEXIBLE THERMAL MANAGEMENT CIRCUITS FLEXIBLE THERMAL MANAGEMENT CIRCUITS

BONDED DIRECTLY TO ALUMINUM HEAT SINKS BONDED DIRECTLY TO ALUMINUM HEAT SINKS IMAPS Thermal Management Palo Alto, CA 10/23/03

Jim Fraivillig Fraivillig Technologies Boston, MA

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SLIDE 2

FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

4000 Vdc 200oC continuous 300oC peak

All-polyimide construction

PowerFlex PowerFlex™

Cost Cost-

  • effective thermal management with design flexibility

effective thermal management with design flexibility

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SLIDE 3

Why PowerFlex? Why PowerFlex?

.

  • Thermal transfer
  • Electrical properties
  • Thermal durability
  • Cost-effective
  • Design flexibility
  • Supply-chain options

FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

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SLIDE 4

PowerFlexTM applications

  • TPI printed circuits, bonded to...
  • Aluminum baseplates

FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

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SLIDE 5

TPI bond film

  • Single-layer circuits
  • Multilayer circuits
  • Tack-bonds at 180oC
  • Heat-seals at 250-300oC

to aluminum

FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

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SLIDE 6

PowerFlex PowerFlexTM

TM thermal transfer performance

thermal transfer performance

COMPARISON:

  • TPI single-layer
  • IMS single-layer
  • Tested with Anatech pulse

FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

TEST #1

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SLIDE 7

PowerFlex PowerFlexTM

TM thermal transfer performance

thermal transfer performance

COMPARISON:

  • TPI single-layer
  • IMS single-layer
  • Tested with Anatech pulse

FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

TEST #2

NOTE: 0.2oC/W resistance assumed for attaching IMS baseplate to heat sink.

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SLIDE 8

Relative importance of “ Relative importance of “bond film layer bond film layer” ” in multilayer circuits in multilayer circuits

FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

Conventional thermal vias (plated-thru holes) carry most of the heat load through the PCB The bond film layer (adheres aluminum) dictates thermal performance ‘Interlayer’ dielectric thermal transfer has relatively low impact

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SLIDE 9

FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

Difference < 0.3oC/W Difference < 0.1oC/W

CML = Alumina-based IMS LTI = BN-based IMS

IMS vs FR4:

Relative thermal impact of interlayer material can be small. Performance gap with Kapton film interlayer will be even less.

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SLIDE 10

PowerFlex PowerFlexTM

TM thermal durability

thermal durability

ALL-POLYIMIDE:

  • 200oC continuous
  • 300oC exposure
  • No-lead solder,

no problem

FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

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SLIDE 11

PowerFlex PowerFlexTM

TM flexible interconnects

flexible interconnects

DESIGN OPTIONS:

  • Layer interconnection

(to control board)

  • Reduce ‘footprint’

(‘brick’ size)

  • Increase

power density

  • Bond to any

heat sink

FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

TPI bond film

(on PCB bottom-side)

Conventional PCB Stamped heat sinks

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SLIDE 12

PowerFlex PowerFlexTM

TM

relative cost relative cost

FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

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SLIDE 13

PowerFlex technical challenges PowerFlex technical challenges

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  • Technology inertia
  • Heat-seal processing
  • Compatible PCB materials
  • Heat sink surface
  • Heat sink size and shape
  • Volume drives cost

FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

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SLIDE 14

PowerFlex applications PowerFlex applications

.

  • Telcom power supplies
  • Portable devices
  • Automotive controls
  • Multi-chip modules
  • Thermally-demanding

applications, where cost and reliability are critical

FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS