FLEXIBLE THERMAL MANAGEMENT CIRCUITS FLEXIBLE THERMAL MANAGEMENT - PowerPoint PPT Presentation

FLEXIBLE THERMAL MANAGEMENT CIRCUITS FLEXIBLE THERMAL MANAGEMENT CIRCUITS BONDED DIRECTLY TO ALUMINUM HEAT SINKS BONDED DIRECTLY TO ALUMINUM HEAT SINKS IMAPS Jim Fraivillig Thermal Management Fraivillig Technologies Boston, MA Palo Alto, CA 10/23/03

PowerFlex ™ PowerFlex Cost- -effective thermal management with design flexibility effective thermal management with design flexibility Cost � 4000 Vdc � 200 o C continuous � 300 o C peak All-polyimide construction FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

Why PowerFlex? Why PowerFlex? . • Thermal transfer • Electrical properties • Thermal durability • Cost-effective • Design flexibility • Supply-chain options FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

PowerFlex TM applications • TPI printed circuits, bonded to... • Aluminum baseplates FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

TPI bond film • Single-layer circuits • Multilayer circuits • Tack-bonds at 180 o C • Heat-seals at 250-300 o C to aluminum FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

TM thermal transfer performance PowerFlex TM thermal transfer performance PowerFlex COMPARISON: • TPI single-layer • IMS single-layer • Tested with Anatech pulse TEST #1 FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

TM thermal transfer performance PowerFlex TM thermal transfer performance PowerFlex COMPARISON: • TPI single-layer • IMS single-layer • Tested with Anatech pulse NOTE: 0.2 o C/W resistance assumed for attaching IMS baseplate to heat sink. TEST #2 FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

Relative importance of “ bond film layer bond film layer ” ” Relative importance of “ in multilayer circuits in multilayer circuits � Conventional thermal vias (plated-thru holes) carry most of the heat load through the PCB � The bond film layer ( adheres aluminum ) dictates thermal performance � ‘Interlayer’ dielectric thermal transfer has relatively low impact FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

IMS vs FR4 : Difference Relative thermal < 0.3 o C/W impact of interlayer material can be small. Difference Performance gap with < 0.1 o C/W Kapton film interlayer will be even less. CML = Alumina-based IMS FLEXIBLE THERMAL FLEXIBLE THERMAL LTI = BN-based IMS MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

TM thermal durability PowerFlex TM thermal durability PowerFlex ALL-POLYIMIDE: • 200 o C continuous • 300 o C exposure • No-lead solder, no problem FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

TM flexible interconnects PowerFlex TM flexible interconnects PowerFlex DESIGN OPTIONS: Stamped heat sinks • Layer interconnection (to control board) Conventional PCB TPI bond film (on PCB bottom-side) • Reduce ‘footprint’ ( ‘brick’ size ) • Increase power density • Bond to any heat sink FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

PowerFlex TM TM PowerFlex relative cost relative cost FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

PowerFlex technical challenges PowerFlex technical challenges . • Technology inertia • Heat-seal processing • Compatible PCB materials • Heat sink surface • Heat sink size and shape • Volume drives cost FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS

PowerFlex applications PowerFlex applications . • Telcom power supplies • Portable devices • Automotive controls • Multi-chip modules • Thermally-demanding applications, where cost and reliability are critical FLEXIBLE THERMAL FLEXIBLE THERMAL MANAGEMENT CIRCUITS MANAGEMENT CIRCUITS