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Examining the Impact of Power Structures on EM Model - - PowerPoint PPT Presentation

Examining the Impact of Power Structures on EM Model Accuracy 8-TA3 Jason R. Miller, Roger Dame, Gustavo J. Blando and Istvan Novak Oracle


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SLIDE 1

Examining ¡the ¡Impact ¡of ¡Power ¡ Structures ¡on ¡EM ¡Model ¡Accuracy ¡

1

8-­‑TA3 ¡

Jason ¡R. ¡Miller, ¡Roger ¡Dame, ¡ ¡ Gustavo ¡J. ¡Blando ¡and ¡Istvan ¡Novak ¡ Oracle ¡ ScoK ¡McMorrow, ¡Teraspeed ¡ Ashley ¡Rebelo, ¡Alejandro ¡Lacap ¡and ¡ Xiangyin ¡Zeng, ¡LSI ¡

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SLIDE 2

Introduction

  • 3D FWS are considered to be some of the most accurate field

solvers

  • With typical compute resources, it isn’t practical to analyze whole

packages

  • Consequently, 3D EM models are often developed with certain

assumptions to reduce solve time

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SLIDE 3

Introduction

  • Implicit or explicit assumptions can impact model accuracy
  • For example, high-frequency return current resides

underneath or in vicinity of trace. But what happens at via transitions?

  • Investigate the accuracy and limitations of these

assumptions Questions:

  • What is missed by sectioning or truncating the package?
  • What interaction happens on the scale of typical packages?
  • What field solvers can we use to simulate whole packages?
  • Ultimately, how can we develop more accurate models?
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SLIDE 4

Agenda

  • Brief theory of cavity resonances
  • Signal and cavity interactions
  • Excitation of cavities
  • Modifying cavity resonances
  • Containment vias
  • Boundary conditions
  • Another Take on Via Impedance & Field non-locality
  • Simulating signal-plane cavity interactions
  • Two package examples
  • Buildup vias versus core vias
  • Correlation to measurements
  • Summary
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SLIDE 5

Brief Theory of Cavity Resonances

590 MHz 295 MHz 139 MHz 1 MHz

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SLIDE 6

Signal Excitation of Plane Cavities

  • Transmission line mode to parallel plane waveguide mode
  • Signal path discontinuity, e.g. due to a split
  • Via transitions
  • Focus here is on excitation of cavities from signal vias transitioning

through cavities.

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SLIDE 7

Signal and Cavity Interactions

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SLIDE 8

Modifying Cavity Resonances

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SLIDE 9

Modifying Cavity Resonances

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SLIDE 10

Containment Vias

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SLIDE 11

Solver Boundary Conditions

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SLIDE 12

Solver Boundary Conditions

x-z open boundary x-y-z absorbing boundary x y z

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SLIDE 13

Solver Boundary Conditions

x-y-z open boundary 3 mm vs. 8 mm absorbing boundary 3 mm vs. 8 mm x y z

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SLIDE 14

Containment Vias

Absorbing Boundary Magnetic Boundary

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SLIDE 15

Another Take on Via Impedance

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SLIDE 16

Non-locality of Fields

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SLIDE 17

Non-locality of Fields

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SLIDE 18

Coupled Differential Via Correlation

simulated measured

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SLIDE 19

Simulating Signal-Plane Cavity Interactions

Ansoft HFSS (truncated) Ansoft SIwave (truncated) Ansoft SIwave (full package)

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SLIDE 20

Simulating Signal-Plane Cavity Interactions

Ansoft HFSS (truncated) Ansoft SIwave (full package)

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SLIDE 21

Differential vs. Single Ended Signals

  • In general differential signals show less IL and crosstalk

peaking due to cavity modal resonances

  • BUT mode conversion and NEXT will not make this go

away

  • NEXT is not subjected to channel losses
  • If Rx is subjected to say 20 dB channel loss than

every channel will have 1-10% crosstalk

  • Also note that this crosstalk is NOT localized, i.e. simply

separating Rx and Tx doesn’t necessarily address this

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SLIDE 22

Simulating Signal-Plane Cavity Interactions

Simulated (full package) measured Extend plane Simulated as-is

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SLIDE 23

Thin Buildup Layer Test Design Do those thin layers help?

Without Adjacent Grounds With Adjacent Grounds

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SLIDE 24

Thin Buildup Layer Via Excitation Simulation Comparison

Signal vias only Closest ground via 1 mm away Ground vias adjacent to signal vias Green – SIwave Blue - HFSS

21 GHz 27 GHz 25 GHz

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SLIDE 25

Thin Buildup Layer Via Excitation Simulation Comparison

Signal vias only Closest ground via 1 mm away Ground vias adjacent to signal vias Green – SIwave Blue - HFSS

21 GHz 27 GHz 25 GHz

21GHZ 27GHZ 25GHZ

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SLIDE 26

Conservation of Misery

  • Without additional dissipation, ground vias only serve to move

resonance problems out of band.

  • The higher the frequency, the harder it is to “Whack” the mole.
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SLIDE 27

Summary

  • Package model extraction using truncated or segmented

models has assumptions and limitations

  • Vertical transitions in packages and PCBs can excite cavities
  • Cavity resonances can have a significant impact on the signal

loss, crosstalk and return loss

  • Cavity resonances can generate crosstalk that is highly non-

localized (as we saw from the e-fields distribution plots)

  • Boundary conditions also determine whether these resonances

are captured

  • “Containing” the energy in a vertical transition may be an option

but may introduce its own resonances and may not be practical

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SLIDE 28

Summary

  • Capturing the signal to plane pair cavity coupling can require

that electrically large structures are simulated.

  • Hybrid solvers are a good choice for analyzing this type of

problem if they are characterized against benchmark structures and their limitations understood