ee619 zele lecture 1 slides 4jan2019 james clerk maxwell
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EE619 ZELE LECTURE 1 SLIDES 4JAN2019 James Clerk Maxwell Rajesh - PowerPoint PPT Presentation

EE619 ZELE LECTURE 1 SLIDES 4JAN2019 James Clerk Maxwell Rajesh Zele Slide 1 Heinrich Hertz source: wikipedia Rajesh Zele Slide 2 Jagadish Chandra Bose source: wikipedia Rajesh Zele Slide 3 Point contact diodes JC Bose


  1. EE619 – ZELE – LECTURE 1 – SLIDES 4JAN2019 James Clerk Maxwell Rajesh Zele Slide 1

  2. Heinrich Hertz source: wikipedia Rajesh Zele Slide 2

  3. Jagadish Chandra Bose source: wikipedia Rajesh Zele Slide 3

  4. Point contact diodes – JC Bose Rajesh Zele Slide 4

  5. Guglielmo Giovanni Maria Marconi source: wikipedia Rajesh Zele Slide 5

  6. Attenuation vs frequency Rajesh Zele Slide 6

  7. Why RF?  RF / Wireless  Transfer of information from one point to another without any physical medium  RF propagation  Power radiated is inversely proportional to (frequency) 2 and (distance) 2  Longer wavelength (low frequency) signals travel greater distance and penetrate through objects better  Antenna size is proportional to wavelength (1/frequency) Frequency Wavelength Antenna Size 900 Mhz 33.33 cm 16.67 cm 2.4 Ghz 12.5 cm 6.25 cm 60 Ghz 5 mm 2.5 mm Rajesh Zele Slide 7

  8. Basic RF circuit functions Desired Signal Signal Strength Frequency  Objective  amplify only the desired signal  in presence of the device/ambient noise  in presence of the strong undesired signals  condition the signal for digital processing  reliable over process, temperature, voltage variations Rajesh Zele Slide 8

  9. RF transceiver architecture – Direct Conversion Rajesh Zele Slide 9

  10. Technology Trends Slide 10

  11. Number of devices in the Internet of Everything Rajesh Zele Slide 11

  12. Trends in Wireless Networks Smith et. al. Solid-state circuits magazine 2012 Rajesh Zele Slide 12

  13. Technology Trends Body Area Network: Next Gen Healthcare BCC: Human Body as Transmission medium Tech Trends ISSCC 2011 Rajesh Zele Slide 13

  14. Technology Trends – wired and wireless data-rates over time Tech Trends ISSCC 2015 Rajesh Zele Slide 14

  15. Summary – Technology Trends  Radios coming closer to Human body (inside?)  Drive towards – Low power short range transceivers  60 GHz Radios – High bandwidth & Smaller antennas  Wireline 100 Gbps to support big data  Optical networking  Software defined radios ?  Full spectrum capture Radios All this with nm CMOS Technology Rajesh Zele Slide 15

  16. CMOS Technology and Supply voltage scaling C-H Jan, IEDM 2010) Driven by Digital to pack more functionality per sqmm. Supply voltage reduced for various junction breakdown. Rajesh Zele Slide 16

  17. CMOS Technology scaling Parameter Scaling Factor L, W, Tox 1/S Voltage S 0.7X Electric Field 1 Doping Conc. S Current 1/S Gate Delay 1/S Power 1/S 2  Constant Field scaling (Dennard 1974)  Each generation of CMOS scales with  Example: 90nm, 65nm, 45nm, 28nm CMOS technologies  Huge performance improvements for Digital circuits Rajesh Zele Slide 17

  18. Scaling Impact on Analog circuits  Rajesh Zele Slide 18

  19. f t scaling trend  Higher f t – higher frequency circuit operation  mm-Wave 60 GHz now possible in CMOS  High frequency converters with better resolution  Full spectrum capture possible! C-H Jan, IEDM 2010) Rajesh Zele Slide 19

  20. Integration Trends in Wireless Transceivers Tech Trends ISSCC 2015 Rajesh Zele Slide 20

  21. G. Chien, F. Weishi, Y.A. Hsu, and L. Tse. A 2.4ghz cmos transceiver and baseband processor chipset for 802.11b wireless lan application ISSCC, 2003 Rajesh Zele Slide 21

  22. B.-E. Kim et al.A 9dbm iip3 direct-conversion satellite broadband tuner-demodulator SOC. ISSCC, 2003 Rajesh Zele Slide 22

  23. A Single-Chip CMOS Bluetooth v2.1 Radio SoC W. W. Si et al ., "A Single-Chip CMOS Bluetooth v2.1 Radio SoC," in IEEE Journal of Solid-State Circuits , vol. 43, no. 12, pp. 2896-2904, Dec. 2008. doi: 10.1109/JSSC.2008.2005741 Rajesh Zele Slide 23

  24. State-of-Art RFIC – Trends and Challenges  Moving up to 60 Ghz  Lumped vs. distributed behavior  EM simulations  Multimode radios  Diversity  Multiple front ends on the chip  Multiple VCOs – Frequency planning important  SOC challenges  Sensitive RF circuits on the noisy digital substrate  Substrate noise coupling and crosstalk  Magnetic coupling between on-chip spiral inductors.  Spurs Rajesh Zele Slide 24

  25. Beyond IC design Package Modeling, Chip Pinouts, Coupling between different bond-wires, Board layout, Component models MUST be part of design flow. J. Long – ISSCC 05 Rajesh Zele Slide 25

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