[PPT] - ATLAS Inner Detector MO_B 2013 to-date status 2014 approve budget PowerPoint Presentation

SLIDE 1

ATLAS Inner Detector MO_B 2013 to-date status 2014 approve budget

H. Pernegger / Pixel PL & ID Resource Coordinator
D. Robinson / SCT PL and ID PL
A. Romaniouk / TRT PL

31/10/2013 1

SLIDE 2

2013 Budget

2 2 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 3

Mid-year spending

So-far spent about xx% of the budget
Pixel L2 and SCT TX still to come
Expenses to-date include much of 2013 manpower commitments

3 3 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

Balance 2013 ID Pixel SCT TRT Total Budget (kCHF) Budget carry-

ver from 2012

42 10

94

192

149 2013 Budget

673 610 637 545

2465 Spent (31Oct 2013)

674 493 353 556 2076

Open

39 101 152 38 330

Remaining 2 26 38 143 208

SLIDE 4

Main Cost Drivers and LS1 activities

LS1 scheduled work:
Pixel : Integration of IBL and Pixel detector new Service

Quarter Panel replacement and nSQP off-detector items (cables, power)

ID: Installation of the new thermo-siphon C3F8 cooling

system

TRT: Address leak issue and consolidate gas system
Consolidation of SCT readout: Order of new TX plug-ins and

production of new BOC card.

This consolidation of SCT readout is carried out with the

current budget during the shutdown.

The overall budget of the SCT is maintained at 637 kCHF

4 4 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 5

Pixel nSQP and Connection

All nSQPs are installed
Sequence is

– each nSQP is tested before and after installation – Connection of pipes and type 0 cables at PP0 – Testing of the full supply and readout chain  row by row verification of the functionality of the Pixel Package before it will be brought to the Pit

From pit operation we had 92

/1744 modules that had issues

Failures cleared by nSQP or

type-0 cable repairs

5 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 6

Pixel nSQP mounting

6 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 7

Pixel today

7 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 8

Pixel status on surface after refurbishment

as of 2013/10/17

1725 of 1744 modules

are working , i.e. 99%

B-layer impressive

recovery

8 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 9

IBL Status

IBL Module production is completed

– Produced mainly from beginning of this year to September since the move to Panasonic flip chip – Total number 412 DC and 263 SC modules built in 12 batches

IBL staves: 12 staves built so far

– 9 staves are in SR1 – 3 staves in Geneva – Have material to built up to 18 staves (incl. reworked modules) – Produced staves essentially from ~May to now at rate of 50 DC fully accepted and 30 SC fully accepted modules/month – Test results in general good – However recently identified a problem with wire bonds (see later slide)

9 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 10

IBL Module test results

Performance very good
Noise ~120e- for planar

and 125-140e- for 3D

Dead channels 0.23%

(3D-CNM), 0.47% (3D- FBK) and 0.32% (Planar CiS)

10 Noise distribution Breakdown voltage distribution Bad pixels/chip (batch 4-12) 10 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 11

Module loading to staves

Bare staves prepared with stave flex and tested
Staves assembled with 12 DC and 8 SC

modules per stave

11 7/10/2013 H. Pernegger Atlas week 11 29/10/213 H. Pernegger Pixel week

SLIDE 12

Observations

Observe clear signs of corrosions on Wire bonds wing area and FE-

bonds caused by water+catalyst (halogene)

– White remanants, which are likely Al(OH)3 – Detected corroded Al bond wires directly on stave – confirmed through high-resolution images

Detailed analysis of remnants and wires was carried out to understand

cause of corrosion together with detailed dedicated tests on many samples

IBL Stave task force investigates causes and remedies

12 12 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 13

Corrosion

Based on the current understanding we deal with

– Corrosion on bond wires (~1%-level distributed over ¼ to ½ of all chips) – Corrosion caused by condensation on stave with accelerating component somewhere on module (find significant amounts Cl, F, of yet unknown origin)

Recovery plan

– Build 8 more staves using existing, repaired or class-2 type components on the last staves – Clean and repair the existing affected staves (priority on less affected ones) – Consider to buy more components as backup (to be

rdered now so that we can get them in-time)

13 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 14

SCT DAQ Expansion

 100kHz at m~87 Maximum sustainable L1 rate as a function of pileup, 14TeV, 25ns

FEROD

8176 data links

RODROS

Existing 90 Slinks

RODROS

With 128 Slinks and data compression

✗100kHz at m~33  100kHz at m~87

SCT adapt the existing DAQ system to cope with the high pileup conditions in Run2

90128 RODs and BOCs
Improved data compression on ROD

Both FE and ROD bandwidth compatible with pileup close to 90 at 100kHz

14 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 15

SCT New Optical Transmitters (TX)

1 2 3 4 5 6 7 8 9 10 1 2 3 4 5 6 7 8 9 10 11

Currently installed VCSELs were operationally robust during 2012, but two significant issues developed which impact on future operation: 1. 10% drop in optical power

2. Small but significant death rate

Optical power (IPIN data) vs Date Number of deaths vs channel number

SCT will move to commercially packaged optical array assemblies, back engineered to match the mechanical and connectivity constraints of the existing BOC hardware and fibres Installation scheduled for Spring/Summer 2014

15 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 16

Consolidation of Pixel readout

Pixel readout:
During next run LHC will reach “beyond-design luminosity” which will

lead to data rates for which the Pixel readout was not built.

The beyond-design peak luminosity leads to saturation on backend

electronics

This caused pixel detector inefficiency already in Layer 2 and will

later cause inefficiency on Layer 1

The saturation and resulting inefficiency is a function of Luminosity,

L1A rate, hit rate per double column, error rate and number of FE- chip with hits

16 16 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 17

Pixel Readout

The bandwidth between module and ROD depends on the layer:

160 Mb/s (2x80Mb/s) on two optical fibers for the B-layer
80 Mb/s on one fiber for layer 1 and disks
40 Mb/s on one fiber for layer 2

17

. . . 16 FE . .

16 x 40 Mb/s FE/MCC links Col pairs EOC buffer and logic ..9..

MCC

..16..

ROD

40, 80 or 160 Mb/s MCC/ROD links MCC buffers ROD buffers 17 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 18

Link occupancy at future luminosities

Pixel readout link Link Occupancy for different luminosities : 7x1033 at 50ns

1x1034, 2x1034 and 3x1034 at 25ns

MCCROD link occupancy at 75 and 100 KHz LVL1 rate:
At and above 2x1034 first Layer 2 will saturate, then followed by Layer 1

– Run 1 limitations at start of fill and due to ROD computing power limits when m>> design

Priority for consolidation: Fix now Layer 2, followed later by Layer 1

18 µ B-Layer Layer 1 Layer 2 Disks 50 ns 37 39% 34% 52% 30% 25 35% 31% 48% 27% 51 53% 59% 66% 39% 76 71% 73% 111% 64% Link occupancy at 75 kHz L1 Trigger 25 ns; 13 TeV µ B-Layer Layer 1 Layer 2 Disks 50 ns 37 51% 45% 69% 40% 25 47% 42% 65% 37% 51 71% 67% 88% 52% 76 95% 97% 148% 75% Link occupancy at 100 kHz L1 Trigger 25 ns; 13 TeV 18 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 19

Layer 2 limitations already in 2012

Observed already limitations during Run 1 at start of fill

– Observe high number of desynchronized modules in Layer at start of fill. Decrease follows luminosity decrease

19 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 20

Consolidation of Pixel readout

Consolidation of Pixel Layer 2 readout system by

using IBL ROD/BOC for Layer 2/1.

– Bandwidth increase: – L2: from 40 Mb/s to 80 Mb/s on a single fibre – L1: from 80 Mb/s to 160 (2x 80) Mb/s on two fibres

Usage of IBL boards for Pixel readout consolidation

– Boards provide bandwidth and computing power safety margin also at high pileup – Adoption to Pixel can be done in firmware

B-Layer and disks shall remain with present

ROD/BOC

–

pto packages will need replacements
Cost estimate based on IBL production number is 315

kCHF for Layer 2 consolidation

120kCHF included in 2013 MO_B budget
Requested additional 70kCHF for 2014 and 100kCHF

for 2015 which was approved in Oct RRB

20 20 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 21

This pipe should be repaired. Access outside is blocked.

The only way to repair is from inside of the pipe.

Pictures from inside of the PEEK pipes taken with Endoscope.

A special tool was developed and All active pipes at the exit of the TRT ECs were replaced (including not leaking ones). However some leaks were in inaccessible areas. and only way to keep leaks under control is a modification of the TRT Active Gas System.

TRT Gas system

21 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 22

Modification of TRT Active Gas system

Modification or replacement of different parts of the gas

system to allow parallel operation with Argon

Distribution racks in UX area which includes a remote

control of the gas flows through individual gas supply lines (80 channels).

Fully controlled Ar-mixer rack and analysis system to

supply some parts of the TRT with Ar-mixture

Distribution module for Ar mixture (UX area) direct

supply (without circulation) of some parts of the TRT with Xe-mixture with detailed monitoring of the gas consumption

Pressure control system in the gas return lines (USA

area)

Improvements for better stability

22 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 23

Projection to end 2013

XX% of the budget spent to date;

– Spending in 2014: Pixel consolidation of readout for Layer 2 component order – SCT order placed for Lightable VCSEL arrays for TX plug-ins and BOC cards and will be able to compensate negative carry-over of -94kCHF

Integration of IBL and new Pixel services integration, the

change of the ID C3F8 cooling system and the TRT leak fixes are the core activities of the LS1 shutdown. Those activities dominate the manpower expenses

23 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 24

Budget for 2014

Budget numbers in kChF 24

EXPERIMENT: ATLAS request 2014 Subsystem: ID Pixel SCT TRT IDGEN Total Mechanics Gas-system 70 70 Cryo-system Cooling system FE electronics (spares) Standard electronics, PS (LV, HV) 70 115 40 10 235 Standard electronics, Crates 35 60 50 145 Standard electronics, RO Modules 130 110 15 35 290 Controls, (DCS, DSS) 10 20 10 5 45 Sub-Detector Spares

Areas SR-maintenance facility (buildup)

30 30

SR-maintenance facility (operation)

30 20 30 120 200

Testbeam and irradiation

30 30

Systemtests

Communications 1 5 5 8 19 Store Items 24 30 30 80 164 Hired Manpower @ CERN (CHF)

Standard tasks

150 177 195 215 737

Special interventions

100 100 100 200 500 TOTALS [kCHF] (excl. FTEs) 610 637 545 673 2465 Technical Manpower [FTE] , OTP 48 24 27 30 129

31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 25

2015 and beyond

For 2015 and beyond preserve a flat MO budget

– Add IBL core electronics maintenance into 5% model of pixel. The readout of Layer 2/1 with IBL ROD/BOC will still contribute to 2015 expenses

25 31/10/2013 H. Pernegger / CERN ID IB Oct 2013

SLIDE 26

Summary

Present spending to date is
Approved 100 kCHF IDGEN manpower increase for 2014 as the

shutdown is now the full two years

Request of additional 70+100 kCHF in 2014 and 2015 for electronics

for Pixel readout consolidation was approved

– This is consolidate the Layer 2 readout ready for Run-2

26 31/10/2013 H. Pernegger / CERN ID IB Oct 2013