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2 Confidential What is Possible ? Box Cuts Volumes as large as - - PowerPoint PPT Presentation

Apr 10, 2024 269 likes •612 views

microPREP TM pico-second laser ablation system Making the Impossible Possible Danielle Elswick Gatan, Inc. 1 Confidential 2 Confidential What is Possible ? Box Cuts Volumes as large as 3,000 microns (length) by 300 microns (width)

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microPREPTM

pico-second laser ablation system

Making the Impossible Possible

Danielle Elswick Gatan, Inc.

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What is Possible ?

  • Box Cuts
  • Volumes as large as 3,000 microns (length) by 300 microns (width) by 300

microns (deep) can be excavated in < 25 minutes

  • Line Cuts
  • Areas can be line cut as large as 25,000 microns long by 1,500 microns deep in

~15 to 25 minutes

  • TEM Lamella
  • Plan View (3mm half grids from your sample) and Cross Sections
  • Large Window(s) with Multiple Windows using FIB
  • Questions:
  • 1. Damage layer? ~ 1 micron
  • 2. How to remove? FIB or Broad Argon Beam?
  • 3. What can you use this tool for that may not be possible in reasonable time with

FIB?

  • Advanced Package Devices
  • Atom Probe Tips
  • XRM Samples
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How Fast ? microPREP trenches in silicon with TSV’s

#70 300x300x300 microns Time (actual) =220 sec. Ga FIB 30 keV&65nA Time (calc.) = 17.5 Days #69 3000x300x300 microns Time (actual)= 1420 seconds Ga FIB (calc.)~ 0.5 years

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How Fast ? microPREP trenches in silicon with TSV’s

#70 300x300x300 microns Time (actual) =220 sec. Ga FIB 30 keV&65nA Time (calc.) = 17.5 Days #69 3000x300x300 microns Time (actual)= 1420 seconds Ga FIB (calc.)~ 0.5 years

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microPREP + Broad Argon Beam (Ilion II)

No FIB REQUIRED !

Workflow for Advanced Packages – Stacked Chip (x4)

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Workflow for Sectioning Stacked Packages

  • Slice through

Package

  • Time = 15 Minutes

microPREP

  • Cross Section

Polish

  • Time = 1 Hour

Ilion II

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Process for results shown in the following slides

  • A single package was obtained and multiple microPREP

slices were made. X-Ray Images package, Right Courtesy of Chipworks

  • Line cuts across the complete width ~9 mm and through the

entire package length ~11 mm were made in 15 minutes thickness ~ 680 microns

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Low Mag SEM Image of Stacked 4 x Chip Area microPREP through package for 15 minutes then Ilion II cross section polish

Chip 1 Chip 2 Chip 3 Chip 4

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High Res SE Image of Single Chip of 4 Chip Stack

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microPREP + Broad Argon Beam (Ilion II)

No FIB REQUIRED !

Workflow for Advanced Packages – Mobile Home Phone Button

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Workflow for Sectioning Stacked Packages

  • Slice through Mobile

Home Button

  • Time = 15 Minutes

microPREP

  • Cross Section

Polish

  • Time = 1 Hour

Ilion II

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Home Button Post microPREP Slice Mounted for Ilion II Polish Laser Cut 6mm long and 1.2 mm thick device in 15 minutes

Ilion II Blade

1000 µm

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Overview of Home Button microPREP + Ilion II

SE Image BSE Image Ilion II Blade & Argon Polishing Direction

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Post Ilion Polish

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microPREP + Broad Argon Beam (Ilion II) No FIB REQUIRED !

Workflow for Ball Bonds

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Workflow for Cross Sectioning Packages

  • Slice entirely through

Package

  • Time = 7 Minutes

microPREP

  • Cross Section

Polish

  • Time = 1 hr.

Ilion II

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Ball Bonds microPREP cut through the package 11 mm long and ~ 500 microns thick Post Ilion II polish

Silicon Device Ilion II Blade

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Ball Bond One of Three Polished

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Higher Mag SE & BSE Image of Interface

SE Image BSE Image

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SE & BSE Images of transistors below the ball bond/UBM layer

SE Image BSE Image

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Summary Advanced Package Workflows

  • A workflow starting with a microPREP provides the basis for

a fast, flexible preparation of Very Large ROI’s

  • A microPREP based workflow permits access to regions of

packaged devices impossible to access with any FIB

  • The combination of microPREP + Ilion II permits significantly

larger ROI’s faster and at a lower cost of ownership compared to a FIB based workflow

  • BUT! It is micro– prep when nano – prep is required then a

workflow of microPREP + FIB increases the throughput and value of the FIB

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Advanced Packaging, Surgical Excavation with FIB

5 Minutes microPREP 60 Minutes Ga FIB

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microPREP is capable of modifying volumes far larger than other tools and is the perfect tool to quickly prepare huge areas for final milling in the FIB.

Post microPREP + Ga FIB

microPREP FIB

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Silicon After Thinning, Silicon is the Half Grid

TEM Plan View Samples

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Silicon Top Down View Image

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Low Structural Damage and Targeted Precision on the Micron Scale

Shown on sapphire, in a top down optical view.

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Preparation step microPREP steps Follow-up step

Assembling the plate on a jig Laser cutting

  • f XL-Chunk
  • f material

Transferring XL-Chunk to a handling mount Local laser thinning of XL-Chunk in the handling mount Final thinning with Ar+ broad beam or FIB

microPREP Workflow for TEM Cross Sections

Preparation step microPREP steps Follow-up step

Assembling the plate on a jig Laser cutting

  • f XL-Chunk
  • f material

Transferring XL-Chunk to a handling mount Local laser thinning of XL-Chunk in the handling mount Final thinning with Ar+ broad beam or FIB

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Preparation step microPREP steps Follow-up step

Assembling the plate on a jig Laser cutting

  • f XL-Chunk
  • f material

Transferring XL-Chunk to a handling mount Local laser thinning of XL-Chunk in the handling mount Final thinning with Ar+ broad beam or FIB

microPREP Workflow for TEM Cross Sections

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Preparation step microPREP steps Follow-up step

Assembling the plate on a jig Laser cutting

  • f XL-Chunk
  • f material

Transferring XL-Chunk to a handling mount Local laser thinning of XL-Chunk in the handling mount Final thinning with Ar+ broad beam or FIB

microPREP Workflow for TEM Cross Sections

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H-bar in Silicon H-bar in Copper

microPREP for TEM Sample Prep

100 µm

Pillar Array in Silicon

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Summary

  • Incredibly fast material removal
  • Low structural damage and targeted precision on the micron

scale

  • Recipe driven graphical user interface (GUI)
  • Targeted process flows – microPREP followed by BIB or FIB
  • Packaged Parts
  • SEM
  • TEM – both plan-view and cross-sections
  • Atom Probe and X-Ray Samples
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Laser Specifications

  • Laser type: Diode pumped solid state (DPSS) laser system
  • Wavelength: 536 nm
  • Average power: 3 W
  • Positional accuracy: ±3 μm
  • Scanner: Galvanmetric
  • Max sample size: 25 x 25 x 1 mm
  • Laser: Class 1 in operation
  • Size (L x W x H): 700 x 800 x 400 mm
  • Weight: 135 kg
  • Power: 230 V – (50/60 Hz), 8 A or 110 V – ( 50/60 Hz), 16 A
  • Other: Compressed air or other gas 25 L/min