TM Announcement, The Next Generation of POWER7 Power Systems Power - - PowerPoint PPT Presentation

IBM Power Systems

February 25, 2010

POWER7

TM Announcement, The Next Generation of

Power Systems

Power your planet.

IBM Power Systems

February 25, 2010 2

IBM Power Systems

February 25, 2010 3

• Balance System Design
• Cache, Memory, and IO
• POWER7 Processor Technology
• 6th Implementation of multi-core design
• On chip L2 & L3 caches
• POWER7 System Architecture
• Blades to High End offerings
• Enhances memory implementation
• PCIe, SAS / SATA
• Built in Virtualization
• Memory Expansion
• VM Control
• Green Technologies
• Processor Nap & Sleep Mode
• Memory Power Down support
• Aggressive Power Save / Capping Modes
• Availability
• Processor Instruction Retry
• Alternate Process Recovery
• Concurrent Add & Services

POWER7 System Highlights

IBM Power Systems

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IBM Power Systems

February 25, 2010

Power Processor Technology

IBM investment in the Power Franchise Dependable Execution for a decade

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Globalization and globally available resources

POWER8 POWER4

180 nm

POWER5

130 nm

POWER6

65 nm

POWER7

45 nm

• Dual Core
• Chip Multi Processing
• Distributed Switch
• Shared L2
• Dynamic LPARs (32)
• Dual Core
• Enhanced Scaling
• SMT
• Distributed Switch +
• Core Parallelism +
• FP Performance +
• Memory bandwidth +
• Virtualization
• Dual Core
• High Frequencies
• Virtualization +
• Memory Subsystem +
• Altivec
• Instruction Retry
• Dyn Energy Mgmt
• SMT +
• Protection Keys
• Performance/System Capacity
• 4-5X increase from Power6
• Multi Core – Up to 8
• SMT4 – 4 threads/core
• On-Chip eDRAM
• Energy
• Efficiency: 3-4X Power6
• Dynamic Energy

Management

• Reliability +
• Memory DIMM – DRAM

Sparing

• N+2 Voltage Regulator

Redundancy

• Protection Keys +

IBM Power Systems

February 25, 2010 6

Supply chain

 The chain is only as strong as the weakest link… partners need to shoulder their fair

share of the load for compliance and the responsibility for failure.

Clients expect privacy

 An assumption or expectation now exists to integrate security into the infrastructure,

processes and applications to maintain privacy.

Compliance fatigue

 Organizations are trying to maintain a balance between investing in both the security

and compliance postures.

Wireless world

 Mobile platforms are developing as new means of identification.  Security technology is many years behind the security used to protect PCs.

POWER6 – POWER7 Compare

IBM Power Systems

February 25, 2010

POWER7 Processor Chip

Cores : 8 ( 4 / 6 core options )

567mm2 Technology:

45nm lithography, Cu, SOI, eDRAM

Transistors: 1.2 B

Equivalent function of 2.7B eDRAM efficiency

Eight processor cores

12 execution units per core 4 Way SMT per core – up to 4 threads per core 32 Threads per chip L1: 32 KB I Cache / 32 KB D Cache L2: 256 KB per core L3: Shared 32MB on chip eDRAM

Dual DDR3 Memory Controllers

100 GB/s Memory bandwidth per chip

Scalability up to 32 Sockets

360 GB/s SMP bandwidth/chip 20,000 coherent operations in flight

Binary Compatibility with POWER6

POWER7 CORE L2 Cache POWER7 CORE L2 Cache POWER7 CORE L2 Cache POWER7 CORE L2 Cache POWER7 CORE L2 Cache POWER7 CORE L2 Cache POWER7 CORE L2 Cache POWER7 CORE L2 Cache L3 Cache and Chip Interconnect MC1 MC0 Local SMP Links Remote SMP & I/O Links F A S T L3 REGION

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IBM Power Systems

February 25, 2010

Memory Channel Bandwidth Evolution

DDR2 @ 553 / 667 MHz Effective Bandwidth: 2.6 GB/sec

DDR3 @ 1066 MHz Effective Bandwidth: 6.4 GB/sec

DDR2 @ 553 MHz Effective Bandwidth: 1.1 GB/s POWER5 POWER6

POWER7

Memory Performance: 2x DIMM Memory Performance: 4x DIMM

Memory Performance: 6x DIMM

D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3 D D R 3

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IBM Power Systems

February 25, 2010

Multi-threading Evolution

Thread 1 Executing Thread 0 Executing No Thread Executing

FX0 FX1 FP0 FP1 LS0 LS1 BRX CRL

Single thread Out of Order

FX0 FX1 FP0 FP1 LS0 LS1 BRX CRL

S80 HW Multi-thread

FX0 FX1 FP0 FP1 LS0 LS1 BRX CRL

POWER5 2 Way SMT

FX0 FX1 FP0 FP1 LS0 LS1 BRX CRL

POWER7 4 Way SMT

Thread 3 Executing Thread 2 Executing

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IBM Power Systems

February 25, 2010 1

POWER7 TurboCore Mode

• TurboCore Chips: 4 available cores
• Aggregation of L3 Caches of unused cores.
• TurboCore chips have a 2X the L3 Cache

per Chip available

• 4 TurboCore Chips

L3 = 32 MB

• Performance gain over POWER6.
• Provides up to 1.5X per core to core
• Chips run at higher frequency:
• Power reduction of unused cores.
• With “Reboot”, System can be reconfigured

to 8 core mode.

• ASM Menus

Unused Core TurboCores Core

L2

Core

L2

Memory Interface

Core

L2

Core

L2

Core

L2

Core

L2

Core

L2

Core

L2

G X S M P F A B R I C

P O W E R B U S

32 MB L3 Cache

Power 780 TurboCore Chip

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Active Memory Expansion

POWER7 advantage Expand memory beyond physical limits More effective server consolidation

 Run more application workload / users per partition  Run more partitions and more workload per server Effectively up to 100% more memory

True memory True memory True memory True memory True memory True memory

Expanded memory Expanded memory Expanded memory Expanded memory Expanded memory Expanded memory

IBM Power Systems

February 25, 2010

Active Memory Expansion

Innovative POWER7 technology For AIX 6.1 or later For POWER7 servers Uses compression/decompression to effectively expand the true physical memory available for client workloads Often a small amount of processor resource provides a significant increase in the effective memory maximum Processor resource part of AIX partition’s resource and licensing Actual expansion results dependent upon how “compressible” the data being used in the application A SAP ERP sample workload shows up to 100% expansion, Your results will vary Estimator tool and free trial available

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IBM Power Systems

February 25, 2010 13

(Source: CSI 2007 Survey, n= 494, US)

Active Memory Expansion Effectively gives more memory capacity to the partition using compression / decompression of the contents in true memory AIX partitions only Active Memory Sharing Moves memory from one partition to another Best fit when one partition is not busy when another partition is busy AIX, IBM i, and Linux partitions

Active Memory Expansion Active Memory Sharing Supported, potentially a very nice option Considerations Only AIX partitions using Active Memory Expansion Active Memory Expansion value is dependent upon compressibility of data and available CPU resource

5 10 15 #10 #9 #8 #7 #6 #5 #4 #3 #2 #1

Active Memory Expansion & Active Memory Sharing

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TPMD: Thermal Power Management Device

• TPMD card is part of the base hardware configuration.
• Residing on the processor planar
• TPMD function is comprised of a risk processor and data acquisition
• TPMD monitor power usage and temperatures in real time
• Responsible for thermal protection of the processor cards
• Can adjust the processor power and performance in real time.
• If the temperature exceeds an upper (functional) threshold, TPMD actively

reduces power consumption by reducing processor voltage and frequency or throttling memory as needed.

• If the temperature is lower than upper (functional) threshold, TPMD will

allows POWER7 cores to “Over clock” if workloads demands are present.

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IBM Power Systems

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Power Systems – February 2010

IBM Systems Software

• New POWER7 in middle of the line
• Power 750 Express
• Power 755 for HPC
• Power 770 modular
• Power 780 modular high-end
• POWER6 continues
• Power 520, Blades
• Power 550
• Power 560
• Power 570
• Power 575
• Power 595

Power 755 JS Blades Power 770 Power 750 Power 780 Power 560

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Processor Offerings for Rack / HPC POWER7 Processor Offerings Cores / Socket 4 6 8 Power 750

• Yes

Yes (3) Power 755

• Yes

Configuration Options Sockets 1 2 3 4

6 Core Chips 6 Cores 12 Cores 18 Cores 24 Cores 8 Core Chips 8 Cores 16 Cores 24 Cores 32 Cores

1-4 Socket System

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February 25, 2010 18

Processor Offerings for Modular Systems

POWER7 TurboCore / CoD Processor Offerings Cores / Socket 4 TurboCore 6 8 Base 8 Enhanced Power 770

• Yes

Yes

• Power 780

Yes

• Yes

Configuration Options Enclosures 1 2 3 4

4 Core Chips 8 Cores 16 Cores 24 Cores 32 Cores 6 Core Chips 12 Cores 24 Cores 36 Cores 48 Cores 8 Core Chips 16 Cores 32 Cores 48 Cores 64 Cores

IBM Power Systems

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POWER7 Model 750

8233-E8B

IBM Power Systems

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Power 750 System 8233-E8B

POWER7 Architecture 6 Cores @ 3.3 GHz 8 Cores @ 3. 0, 3.3, 3.55 GHz Max: 4 Sockets DDR3 Memory Up to 512 GB System Unit SAS SFF Bays Up to 8 Drives (HDD or SSD) 73 / 146 / 300GB @ 15k (2.4 TB) (Opt: cache & RAID-5/6) System Unit IO Expansion Slots PCIe x8: 3 Slots (2 shared) PCI-X DDR: 2 Slots 1 GX+ & Opt 1 GX++ 12X cards Integrated SAS / SATA Yes System Unit Integrated Ports 3 USB, 2 Serial, 2 HMC Integrated Virtual Ethernet Quad 10/100/1000 Optional: Dual 10 Gb System Unit Media Bays 1 Slim-line DVD & 1 Half Height IO Drawers w/ PCI slots PCIe = 4 Max: PCI-X = Max 8 Cluster 12X SDR / DDR (IB technology) Redundant Power and Cooling Yes (AC or DC Power) Single phase 240 VAC or -48 VDC Certification (SoD) NEBS / ETSI for harsh environments EnergyScale Active Thermal Power Management Dynamic Energy Save & Capping

4U Depth: 28.8”

Up to 181,000 CPW!

IBM Power Systems

February 25, 2010

Power 750 Information….

• Physical Specifications:
• Width: 440 mm (17.3 in)
• Depth: 730.8 mm (28.8 in)
• Height: 175 mm (6.89 in)
• Weight: 54.4 kg (120 lb)
• Operating voltage:
• 200 to 240 V
• Operating Frequency: 50/60 Hz
• Power Consumption: 1950 watts (maximum)
• Power Factor: 0.97
• Thermal Output: 4778 Btu/hour (maximum)
• Power-source Loading
• 1.443 KVA (maximum configuration)
• Noise Level and Sound
• Rack-mount drawer: 7.0 Bels operating

Recommend either rack acoustic doors or locating in a machine room.

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February 25, 2010 22

10 20 30 40 50 60 70

Memory Intra IO Power 550 Power 750

POWER7 / POWER6 Bandwidth Comparison

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POWER7 / POWER6 Comparison

1000 2000 3000 4000 5000 6000 7000 8000 9000

Energy Consumption Thermal

Power 750 Power 550 Power 560

Power 750: 32 Cores Power 550: 8 Cores Power 560: 16 Cores Active

IBM Power Systems

February 25, 2010 24

Power 750 CPW Performance …

Power 550 8 Core @ 5GHz 37,950 CPW Power 560 16 Core @ 3.6GHz 48,500 Power 750 32 Core @ 3.55GHz 181,000 CPW

3.0GHz (8 core) 44600 (8) = 5575 82600 (16) = 5510 122500 (24) = 5104 158300 (32) = 4946 3.3GHz (6 core) 37200 (6) = 6200 69200 (12) = 5766 94900 (18) = 5272 135300 (24) = 5637 3.3GHz (8 core) 47800 (8) = 5975 88700 (16) = 5543 129700 (24) = 5405 168800 (32) = 5275 3.55GHz 181000 (32) = 5656

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POWER7 Model 755

8236-E8C

IBM Power Systems

February 25, 2010 26

5.3 / 6.1 RHEL / SLES

Power 755 4-Socket HPC System

Power 755

POWER7 Architecture 4 Processor Sockets = 32 Cores 8 Core @ 3.3 GHz DDR3 Memory 128 GB / 256 GB, 32 DIMM Slots System Unit SAS SFF Bays Up to 8 disk or SSD 73 / 146 / 300GB @ 15K (up to 2.4TB) System Unit Expansion PCIe x8: 3 Slots (1 shared) PCI-X DDR: 2 Slots GX++ Bus Integrated Ports 3 USB, 2 Serial, 2 HMC Integrated Ethernet Quad 1Gb Copper (Opt: Dual 10Gb Copper or Fiber) System Unit Media Bay 1 DVD-RAM ( No supported tape bay ) Cluster Up to 64 nodes Ethernet or IB-DDR Redundant Power Yes (AC or DC Power) Single phase 240vac or -48 VDC Certifications (SoD) NEBS / ETSI for harsh environments EnergyScale Active Thermal Power Management Dynamic Energy Save & Capping

Up to 8.4 TFlops per Rack ( 10 nodes per Rack )

4U x 28.8” depth

IBM Power Systems

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POWER7 Model 770 Model 780

9117-MMB

9179-MHB

IBM Power Systems

February 25, 2010 28

Power 770

Power 770

Processor Technology 6 Cores @ 3.55 GHz 8 Cores @ 3.1 GHz L3 Cache On Chip Redundant Power & Cooling Yes Redundant Server Processor Yes / Two Enclosure minimum Redundant Clock Yes / Two Enclosure minimum Concurrent Add Support Yes Concurrent Service Yes System Unit Single Enclosure 4 Enclosures Processors Up to 2 Sockets 8 Sockets DDR3 Memory (Buffered) Up to 512 GB Up to 2 TB SAS/SSD SFF Bays 6 24 DVD-RAM Media Bays 1 Slim-line 4 Slim-line SAS / SATA Controller 2 / 1 8 / 4 PCIe bays 6 PCIe 24 PCIe GX++ Slots (12X DDR) 2 8 Integrated Ethernet Std: Quad 1Gb Opt: Dual 10Gb + Dual 1 Gb Std: Four Quad 1Gb Opt: Four x Dual 10Gb + Dual 1 Gb USB 3 12 12X I/O Drawers w/ PCI slots Max: 4 PCIe, 8 PCI-X Max: 16 PCIe, 32 PCI-X

Maint Coverage: 9 x 5

4U x 32 inches Depth

Up to 292,700 CPW!

IBM Power Systems

February 25, 2010 29

Power 780

Power 780

Processor Technology 4 Cores @ 4.14 GHz TurboCore 8 Cores @ 3.86 GHz L3 Cache On Chip Redundant Power & Cooling Yes Redundant Server Processor Yes / Two Enclosure minimum Redundant Clock Yes / Two Enclosure minimum Concurrent Add Support Yes Concurrent Service Yes System Unit Single Enclosure 4 Enclosures Processors 2 Sockets 8 Sockets DDR3 Memory (Buffered) Up to 512 GB Up to 2 TB SAS/SSD SFF Bays (CEC) 6 24 DVD-RAM Media Bays 1 Slim-line 4 Slim-line SAS / SATA Controller 2 / 1 8 / 4 PCIe (CEC) 6 PCIe 24 PCIe GX++ Slots (12X DDR) 2 8 Integrated Ethernet Std: Quad 1Gb Opt: Dual 10Gb + Dual 1 Gb Std: Four Quad 1Gb Opt: Four x Dual 10Gb + Dual 1 Gb USB 3 12 12X I/O Drawers w/ PCI slots Max: 4 PCIe, 8 PCI-X Max: 16 PCIe, 32 PCI-X Maint Coverage 24 X 7 PowerCare Support

IBM Power Systems

February 25, 2010 30

POWER7 Modular Information….

• Physical Specifications (4 EIA units)
• Width: 483 mm (19.0 in.)
• Depth: 863 mm (32.0 in.)
• Height: 174 mm (6.85 in)
• Weight: 70.3 kg (155 lb)
• Operating voltage:
• 200 to 240 V
• Operating Frequency: 50/60 Hz
• Power Consumption: 1600 watts (maximum)
• Per enclosure with 16 cores active
• Power Factor: 0.97
• Thermal Output: 5461 Btu/hour (maximum)
• Per enclosure with 16 cores active
• Power-source Loading
• 1.649 kva (maximum configuration)
• Noise Level and Sound
• One enclosure with 16 active cores:
• 6.8 bels / 6.3 bels with acoustic rack doors (operating/idle)
• Four enclosures with 64 active cores:
• 7.4 bels / 6.9 Bels with acoustic rack doors (operating/idle)

IBM Power Systems

February 25, 2010 31

Power 770 & 780 vs Power 570 Differences

Power 570 Power 770 & 780

Up to 8 sockets, Up to 32 Cores Up to 8 Sockets, Up to 64 cores Up to 768 GB Memory Up to 2 TB Memory ( Initial GA will be 1 TB) DDR2 DIMMS DDR3 DIMMS Six 3.5” SAS Bays / Enclosure Six SFF SAS Bays / Enclosure 4 PCIe & 2 PCI-X slots per Enclosure 6 PCIe slots per Enclosure No write cache or RAID-5/6 support Write cache & RAID-5/6 support Single integrated DASD / Media Cntlr Three integrated DASD / Media Controllers Optional Split Backplane Standard Split backplane Optional Tri-Split Backplane No Power & Management Thermal Power & Thermal management TPMD support Clock Cold Failover ECC with bit steer Concurrent Drawer Maint restrictions Concurrent Drawer Add cable restrictions Clock Hot Failover ECC with DRAM sparing No Restrictions ( 4Q / 2010 ) No Restrictions

IBM Power Systems

February 25, 2010 32

Power Modular value grows through 2010

February March Announce Power 770 and Power 780 General Availability April

• Planned additional benchmark results
• eConfig support for upgrades and MES orders

June

• General Availability for upgrades
• CSP enabled for ordering

4Q

• Large DIMM support
• 640 partition support
• Additional Hot-node Add & Repair

support

IBM Power Systems

February 25, 2010 33

POWER7 Modular Concurrent Maintenance…

Enclosure 1 16 Core Enclosure 2 16 Core Enclosure 3 16 Core Enclosure 4 16 Core

• 1. 64 core Partition environment
• 2. 48 core Partition environment
• 3. 64 core Partition environment

Remove 1 Return 3 Update 2

Additional support 2H / 2010

IBM Power Systems

February 25, 2010 34

Power 570/32 vs Power 770 Bandwidth Comparison

200 400 600 800 1000 1200

Memory Inter Intra IO POWER6 POWER7

IBM Power Systems

February 25, 2010 35

POWER7 / POWER6 Comparison

1000 2000 3000 4000 5000 6000 7000 8000 9000

Energy Consumption Thermal

Power 750 Power 550 Power 560

Power 750: 32 Cores Power 550: 8 Cores Power 560: 16 Cores Active

IBM Power Systems

February 25, 2010 36

Power 780 CPW Performance

20 40 60 80 100 120 140 160 180 8 Core 16 Core 32 Core

Power 570/32 Power 780

3.1GHz processors (8 core) 88800 (16) = 5550 155850 (32) = 4870 229800 (48) = 4787 292700 (64) = 4573 3.5GHz processors (6 core) 73100 (12) 6091 131050 (24) = 5460 248550 (48) = 5178 3.9GHz processors (8 core) 105200 (16) =6575 177400 (32) = 5543 265200 (48) = 5525 343050 (64) =5360

IBM Power Systems

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IBM Power Systems

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IBM Power Systems Comparisons

Power 750 Power 770 Power 780 Power 595

Nodes One Up to four Up to four Up to eight Cores (single system image) 6, 12, 18, 24 or 8, 16, 24, 32 4 – 64 4 – 64 8 – 64 Upgradeable to 256 Frequency 3.0, 3.3, 3.55 GHz 3.1, 3.5 GHz 3.8, 4.1 GHz 4.2, 5.0 GHz SMP buses 4 byte 8 byte 8 byte 8 byte System memory Up to 512 GB Up to 2 TB* Up to 2 TB* Up to 4 TB Memory per core 16 or 21 GB 32 or 42 GB 32 or 64 GB 64 GB Memory Bandwidth (peak) 273 GB/s 1088 GB/s 1088 GB/s 1376 GB/s Memory Bandwidth per core (peak) 8.5 GB/s 17 or 22 GB/s 17 or 34 GB/s 21.5 GB/s Memory controllers 1 per processor 2 per processor 2 per processor 2 per processor I/O Bandwidth (peak) 30 GB/s 236 GB/s 236 GB/s 640 GB/s I/O Bandwidth per core (peak) 0.9GB/s 3.6 or 4.9 GB/s 3.6 or 7.3 GB/s 10 GB/s I/O loops Up to 2 Up to 8 Up to 8 Up to 32 Total disk drives Up to 576 Up to 1200 Up to 1200 Up to 2640 rPerf per core Up to 11 Up to 11 Up to 13 Up to 10.8 Maximum LPARs Up to 320* Up to 640* Up to 640* Up to 254 RAS Standard Enhanced Memory Dynamic FSP & clocks Enhanced Memory Dynamic FSP & clocks Enhanced Memory Dynamic FSP & clocks Warranty 9 x 5 9 x 5 24 x 7 24 x 7 PowerCare No No Yes Yes

IBM Power Systems

February 25, 2010 39

550 Power 5 550 Power 5+ 8204-E8A Power 6 8233-E8B 750 POWER7 12,000 14,000 27,600 181,000 4-core 4-core 8-core 32 core 570 Power 5 570 Power 5+ 9117-MMA Power 6 9117-MMB 750 POWER7 44,700 58,500 77,600 / 104800 292,700 16-core 16-core 16-core / 32- core 64 core

Power 5 / Power 6 / POWER7 550 and 570 Comparison

IBM Power Systems

February 25, 2010 40

IBM Upgrades/Migrations to POWER7

IBM Power Systems

February 25, 2010 41

*Power 5 and Power 5+ 570 CANNOT upgrade to POWER7 770

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Supported Expansion Units on POWER7

• Supported Expansion Units
• Expansion units on 12x loops
• 5796 PCI-X I/O Expansion (max 4 per loop)
• Expansion units on 12x DDR loops
• 5802 PCIe I/O W/Disk Drawer (max 2 per loop)
• 5877 PCIe I/O NoDisk Drawer (max 2 per loop)
• Disk Expansion Drawers
• 5786 EXP24 Disk Drawer (SCSI)
• No new SCSI disk drives available
• 5886 EXP12S Disk Drawer (SAS)
• No HSL loop available on POWER7 systems
• Common expansion units NOT supported
• 5094
• 5294
• 5088/0588
• 5095/0595
• 5790
• This means NO IOPs supported
• No IOA adapter cards that require an IOP are supported
• Common IOA cards that requite an IOP
• 4746 Twinax
• 2749 tape/3995/3996
• 2742/4745/2793 2-line WAN
• 5702/5712/5736/571A SCSI (most commonly used for SCSI LTO tape drives)
• 5761 and 5760 Fibre Channel (tape / disk)
• 2849 10/100 Ethernet
• 5700/5701 1B Ethernet
• 2757/2780/5580/5590 (etc) SCSI Disk adapters
• More…
• SCSI devices attached to adapters that require an IOP will not be able to migrate
• LTO LVD and HVD SCSI tape drives will not migrate
• SAS or fibre attached tape drives can be used (will require V6R1 or higher)
• Only IOP-less adapters are supported