Ther ermal mal Simu mulation lation of IGB GBTs s Use sed d - - PowerPoint PPT Presentation

Ther ermal mal Simu mulation lation of IGB GBTs s Use sed d in Hybrid rid- El Elect ectric ric Veh ehicles cles

Ruben Bons Electronics Sector Manager CD-adapco ruben.bons@cd-adapco.com

Power er Del eliv iver ery y in in HEVs

Batteries eries El Electr tric c Mot

• tor
• rs

Power r El Electr tronic

• nics

IGBT T = Insulat sulated d gate e bipolar

• lar transi

nsist stor

• r

Wiki kiped pedia: a:

– “…primarily used as an electronic switch…” – “…is noted for combining high efficiency and fast switching.” – “Availability of affordable, reliable IGBTs is an important enabler for electric vehicles and hybrid cars.”

IGBT Backgr ground

IGBTs s can often en show >95% 5% efficiency iciency 𝜽 = thermal losses electrical power transmitted IGBTs s can transmit nsmit 20 kW, , 50 kW, , or more re electric ctrical al power

– Thermal losses can be >1 kW!

Types es of losses ses

– Conductive – Switching

Ther erma mal l Losses es in in IGBTs

IGBT T packages ges typica cally lly include de an integra egrated d diode

• de as well

ll The e over erall all package ge often en has s mul ultip iple le IGBT/d /diode iode set ets

Physical sical IGBT structu ucture

Physical sical IGBT Structu ucture

Advant ntages ges Disadv dvant ntages ges

Det etail iled ed as assem embly bly

• Get full geometric temperature

distribution

• Identify specific hotspots
• Well-suited for transient
• Longer setup time
• Higher computational cost
• High geometric aspect ratio,

so not favorable for large assemblies

Simpl implif ifie ied d assem embly bly

• Provides geometry for visual

results viewing

• Well-suited for inclusion in a

larger assembly

• Not suitable for transient
• Limited temperature

distribution details

• Need extra calculation to get

junction temperature

RC net etwor

• rk
• Most computationally efficient
• Inherently suitable for

transient

• Directly utilizes vendor data

(assumed accurate)

• No geometric equivalence

(abstraction)

• Requires Java scripting to

implement in STAR-CCM+

• No visual temperature plot

for the IGBT

Ther erma mal l Mode delin ing g App pproache aches

Det etail iled ed Assem embly bly (en encaps psul ulant nt hid idde den)

Simpl implif ifie ied d Assem embly bly (encaps psul ulant nt hid idde den)

The e power assigne ned d to the e block

• ck shou
• uld

ld be the e sum um of the e conduc nducti tion

• n &

switchi tching ng losses ses for all the e IGBT T & diode

• de pads (= Ptot
• tal

al).

). To com

• mpute

e the e jun unct ction ion tem emperat perature ure Tj:

– Measure the temperature at one or more points on the copper base plate – Calculate

Tj = Tbase + [ Rth(j-c)*Ptotal ]

Simpl implif ifie ied d Assembl embly y Mode del in in STAR-CC CCM+: +: Tjun

uncti ction

• n calcula

culati tion

• n

RC Net etwor

• rk

Because ause IGBTs s are bui uilt t for switch ching ing applicat ations, ions, we e need eed to conside nsider if therm ermal l transients nsients are imp mpor

• rta

tant nt Do this by com

• mparing

ring the e electr ectrica ical l time me scale e to the e therma ermal l time me scale. e.

Transie ient Consid ider eration ations