Sunrise Electronics Inc. 11/4/2002 11/4/2002 1 1 1 1 - PowerPoint PPT Presentation

Sunrise Electronics Inc. 11/4/2002 11/4/2002 1 1 1 1 CONFIDENTIAL CONFIDENTIAL

Presentation Agenda  Corporate Overview  Product Capability  Advanced Technology  Question & Answer 11/4/2002 11/4/2002 2 2 2 2 CONFIDENTIAL CONFIDENTIAL

Sunrise Value Proposition  Velocity to market  Service responsiveness  Engineering solutions  Manage inventory Customer-centric  11/4/2002 11/4/2002 3 3 3 3 CONFIDENTIAL CONFIDENTIAL

Sunrise Mission “Excel in customer service & velocity” 11/4/2002 11/4/2002 4 4 4 4 CONFIDENTIAL CONFIDENTIAL

Sunrise Vision “Establish industry benchmark in total customer satisfaction & responsiveness” 11/4/2002 11/4/2002 5 5 5 5 CONFIDENTIAL CONFIDENTIAL

Sunrise Electronics  High mix and high service.  Engineering & tech solutions.  Maximum velocity fabrication.  QTA protos and production.  IPC 6012 Class 3 compliant.  ITAR system registered. 11/4/2002 11/4/2002 6 6 6 6 CONFIDENTIAL CONFIDENTIAL

Overview  30,000 Square feet  32 Associates  High reliability multilayers  QTA Protos & production 11/4/2002 11/4/2002 7 7 7 7 CONFIDENTIAL CONFIDENTIAL

Sunrise Electronics Inc  Since 1996  30,000 Sq Ft Facility  Elk Grove, Illinois  Ph: 847-357-0500 11/4/2002 11/4/2002 8 8 8 8 CONFIDENTIAL CONFIDENTIAL

Features & Benefits  Quotes in 4 hours or less.  QTA fabrication in 12 hours to 10 days.  Standard lead times from 3 days.  Value-added engineering solutions.  Enable technology solutions.  Lead free laminates & surface finishes. 11/4/2002 11/4/2002 9 9 9 9 CONFIDENTIAL CONFIDENTIAL

Capabilities  1 To 30 layer multilayers  BBV’s & Via in pad  Via fill options  High speed digital & RF  20:1 Aspect ratio  IPC Class 3 compliant  High Velocity Fabrication 11/4/2002 11/4/2002 10 10 10 10 CONFIDENTIAL CONFIDENTIAL

Advanced Technology  BBV’s and Micro Via Technology  Sequential Lamination  Via in Pad – Epoxy & Silver Fill  Back drilling – stub removal  High Speed & RF packages  Hybrid dielectric packages  Thin capacitance layers Metal core fabrication  11/4/2002 11/4/2002 11 11 11 11 CONFIDENTIAL CONFIDENTIAL

Blind & Buried Vias  Type I and II uVias.  6 Mil mechanical drills.  10 Mil via pads.  18 Mil via pads standard.  8 Mil standard drills. 11/4/2002 11/4/2002 12 12 12 12 CONFIDENTIAL CONFIDENTIAL

Blind & Buried Vias  Wide variety of process disciplines.  Increase routing density.  Increase component density.  Enhanced signal integrity. 11/4/2002 11/4/2002 13 13 13 13 CONFIDENTIAL CONFIDENTIAL

Via In Pad  Non-conductive epoxy fill preferred.  Reduces inductance.  Increases routing density.  Increases component density 11/4/2002 11/4/2002 14 14 14 14 CONFIDENTIAL CONFIDENTIAL

Peters Via Fill DFM  Min board thickness 0.010”  Max board thickness 0.250”  Min drill size .0098”  Max drill size 0.020”  Max Aspect Ratio 14:1 Micro Via In Pad  Post Plating 11/4/2002 11/4/2002 15 15 15 15 CONFIDENTIAL CONFIDENTIAL

Via in Pad 50% Increased Component Density 11/4/2002 11/4/2002 16 16 16 16 CONFIDENTIAL CONFIDENTIAL

Back drilling  Post plating process to define via stub length.  Reduce signal attenuation.  Improve impedance matching.  Reduce via to via crosstalk. Decrease high speed signal  distortion. Increase channel bandwidth.   Blind via’s without the cost. 11/4/2002 11/4/2002 17 17 17 17 CONFIDENTIAL CONFIDENTIAL

Back drilling DFM  Back drill DFM Rule  BD = PD + 14  Clearance DFM Rule  CL = BD + 18  Z-Axis position +/- .005” 11/4/2002 11/4/2002 18 18 18 18 CONFIDENTIAL CONFIDENTIAL

Thin Dielectric Layers  Dielectric electrostatic capacitance.  Reduced noise & EMI.  Reduced component cost.  Reduced assembly cost. 90% reduced bypass caps.   500 Pico-Farads per in 2 . 11/4/2002 11/4/2002 19 19 19 19 CONFIDENTIAL CONFIDENTIAL

Dielectric Options  FR 406 & FR 408  ITEQ & TUV Isola IS 410 Ventec VT47    Isola IS 620  Rogers 3000 & 4000 & 5000 & ultralam  Polyclad 370HR  Taconic  Nelco 4000-13  Polyimide  Bergquist MP/HT  Cu/Al core 11/4/2002 11/4/2002 20 20 20 20 CONFIDENTIAL CONFIDENTIAL

Controlled Impedance  Single-ended Structures  Micro strip  Stripline  Dual Stripline / Offset Stripline  Edge-coupled Structures / Differential  Micro strip  Stripline  Offset Stripline Broadside Coupled Structures   Coplanar Waveguide 11/4/2002 11/4/2002 21 21 21 21 CONFIDENTIAL CONFIDENTIAL

Technology Roadmap Current Near Term Long Term Category Attribute 2014 2014-2015 2015-2016 Inner Layers (Line/Space) 3/3 mil 2.5/3 mil 2/2 mil Fine Line/Space Outer Layers (Line/Space) 3/4 mil 3/3 mil 2.5/2.5 mil Mechanical (Drilled Hole/Land) 5.9/12 mil 4/10 mil 3.5/8 mil Buried Core Holes Laser Drill (Drilled Hole/Land) NA 4/10 mil 4/10 mil Controlled Depth Drilling - Blind Vias Yes Yes Yes Sequential Lamination - Buried Vias Yes Yes Yes Special Processing Via in Pad Technology - Silver Epoxy Yes Yes Yes Via in Pad Technology - Non Conductive Epoxy Yes Yes Yes Edge Plating Yes Yes Yes High TD - RoHS Yes Yes Yes Halogen Free Yes Yes Yes High Performance Dk=3.0 Df<0.005 Dk<3.0 Df<0.003 Dk<3.0 Df<0.002 Materials Polyimide - High Temp Yes Yes Yes Teflon Yes Yes Yes High Speed RF Signals Yes Yes Yes Drilled Hole/Land 5.9/12 mil 4/10 mil 3.5/8 mil Through Via Holes Registration to internal Land +/- 5.0 mil +/- 4.5 mil +/- 4.0 mil Maximum Copper Plating Aspect Ratio 15 : 1.0 18 : 1.0 20 : 1.0 Maximum Layer Count 50 Layer 60 Layer 60+ Layer Panel / Board Maximum Thickness 0.42 0.62 0.9 Maximum Process Panel Size 24" x 30" 24" x 30" 24" x 30" Impedance Single ended & Differential Pair Tolerance +/- 5% +/- 4% +/- 3% Resistors N/A +/- 15% +/- 10% Embedded Passives Capacitance/Capacitors 2.0 mil Core 1.0 mil Core Thin Film SMOBC Yes Yes Yes HASL Yes Yes Yes Lead Free HASL Yes Yes Yes Electrolytic Hard Gold Yes Yes Yes Electrolytic Soft Gold Yes Yes Yes Palladium No Yes Yes Surface Finish Nickel Yes Yes Yes Carbon Ink Yes Yes Yes Electroless Ni/Au Yes Yes Yes Immersion Silver Yes Yes Yes Immersion Tin Yes Yes Yes Organic Surface Protection (Entek) Yes Yes Yes ISO 9001/2000 Yes Yes Yes IPC 6012 Class 1,2,3 Yes Yes Yes Quality Standards 11/4/2002 11/4/2002 TL 9000 No Yes Yes 22 22 22 22 CONFIDENTIAL CONFIDENTIAL Mil-PRF-31032 No No Yes

Thank you! The Sunrise team is anxious to support you! 11/4/2002 11/4/2002 23 23 23 23 CONFIDENTIAL CONFIDENTIAL