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Status of the Mu3e Detector Dirk Wiedner, Heidelberg On Behalf of - PowerPoint PPT Presentation

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Status of the Mu3e Detector Dirk Wiedner, Heidelberg On Behalf of the Mu3e Collaboration Dirk Wiedner, on behalf of the Mu3e collaboration 28.02.2017 1 The Mu3e Signal + e + e - e + rare in SM o Branching ratio <10 -54

  1. Challenges • High rates: 10 8 μ /s • Good timing resolution: 100 ps • Good vertex resolution: ~200 μ m • Excellent momentum resolution: ~ 0.5 MeV/c 2  Extremely low material budget:  1x10 -3 X 0 (Si-Tracker Layer)  HV-MAPS spectrometer  50 μ m thin sensors  B ~1 T field  + Timing detectors Dirk Wiedner, Mu3e 28.02.2017 40

  2. SciFi Backup Dirk Wiedner, Mu3e 28.02.2017 41

  3. Details … staggered layers Thickness: 433 μ m 700 μ m • theoretical ~ 683 m m • measured ~ 750 m m < 1 g of glue / ribbon 250 μ m Alternative: Square shape fibers 254 μ m Horizontal gap between fibers ~ 4 μ m Dirk Wiedner, Mu3e 28.02.2017 42

  4. Fiber Winding Tool U channel 16 mm ~ 40 cm fiber More R&D to optimize the construction of the ribbons Dirk Wiedner, Mu3e 28.02.2017 43

  5. Readout of Fibers Si-PMs (MPPCs) at both fiber ends SciFi column readout with Si-PM arrays LHCb type detector • 64 channel monolithic device (custom design) • ~250 µm effective “pitch” 50 µm  50 µm pixels • Grouped in 0.25 mm  1 mm vertical columns • • Common bias voltage Dirk Wiedner, Mu3e 28.02.2017 44

  6. Readout of Fibers Si-PMs (MPPCs) at both fiber ends SciFi column readout with Si-PM arrays LHCb type detector  Reduced # of readout channels (2  64)  Easy, direct coupling  Higher occupancy  “Optical” cross talk Dirk Wiedner, Mu3e 28.02.2017 45

  7. SciFi Column Readout light travels preferentially in the cladding and exits the fiber at large angles  “optical” cross talk between Si-PM columns Dirk Wiedner, Mu3e 28.02.2017 46

  8. Readout Electronics • MuTRiG ASIC (KIP) • Fulfills SciFi requirements o Compact design • Installation very close to Si-PM arrays o 32 channels • 4 chips / Si-PM array STiC • Assuming MuTRiG can sustain ~10 MHz hit- rate • Performance to be tested o In particular for low photon yield Dirk Wiedner, Mu3e 28.02.2017 47

  9. Alternative Design with Square Fibers 2-3 layers of 250 m m square double cladding scint. fibers 128 fibers/layer Single fiber Al coating (minimum “optical” cross -talk) 16 mm 0.8 mm Dirk Wiedner, Mu3e 28.02.2017 48

  10. Testing Square Fibers timing performance Fiber test setup developed at PSI 250 µm square fiber 0.5 Nphe threshold Cross talk: σ = 750 ± 17 ps By sputtering 30 nm Al coating on the fiber cross talk < 1% was achieved Dirk Wiedner, Mu3e 28.02.2017 49

  11. Tile Detector Backup Dirk Wiedner, Mu3e 28.02.2017 50

  12. Efficiency tiles e - • Require hit in first & last column • Look for hit in middle channel • Efficiency > 99.5% Dirk Wiedner, Mu3e 28.02.2017 51

  13. Tile Detector • Scintillating tiles 6.5 x 6.5 x 5.0 mm 3 • • 7 Tile Modules per station o 448 tiles/module o Attached to end rings • SiPMs attached to tiles o Distribution PCBs below o Readout through MuTRiG Tile detector 4 x 4 prototype Dirk Wiedner, Mu3e 28.02.2017 52

  14. STiC Readout Developed at KIP for EndoTOFPET-US • STiC 2.0 o Optimized for ToF applications Key features: • o Digital timing & energy information STiC 3.0 o 64 channels (version 3.0) o 50 ps TDC bins o SiPM bias tuning o SiPM tail cancelation possibility (version 3.0) o Currently ≈ 1 MHz hit rate / chip o Up to ≈ 20 MHz in future version Version 2.0 successfully operated in test-beam • Dirk Wiedner, Mu3e 28.02.2017 53

  15. STiC Readout Developed at KIP for EndoTOFPET-US • STiC 2.0 o Optimized for ToF applications Key features: • o Digital timing & energy information STiC 3.0 o 64 channels (version 3.0) o 50 ps TDC bins o SiPM bias tuning o SiPM tail cancelation possibility (version 3.0) o Currently ≈ 1 MHz hit rate / chip o Up to ≈ 20 MHz in future version Version 2.0 successfully operated in test-beam • Dirk Wiedner, Mu3e 28.02.2017 54

  16. STiC Test Beam Dirk Wiedner, Mu3e 28.02.2017 55

  17. STiC Test Beam Dirk Wiedner, Mu3e 28.02.2017 56

  18. STiC Test Beam Dirk Wiedner, Mu3e 28.02.2017 57

  19. HV-MAPS Backup Dirk Wiedner, Mu3e 28.02.2017 58

  20. Prototype Overview Prototype Active Area Functionality Bugs Improvements 1.77 mm 2 MuPix1 Sensor + analog Comparator First MuPix “ringing” prototype 1.77 mm 2 MuPix2 Sensor + analog Temperature No ringing dependence 9.42 mm 2 MuPix3 Sensor, analog, bad pixel First part of dig. dig. on/off , readout 9,42 mm 2 MuPix4 Sensor, analog, Zero time-stamp Working digital dig. and row readout, address for 50% timestamp , of pixels temperature stable 10.55 mm 2 MuPix6 Sensor, analog, ? Removed zero dig. time-stamp and address bug 10.55 mm 2 MuPix7 System on Chip X-talk Fast serial readout Dirk Wiedner, Mu3e 28.02.2017 59

  21. Sensor + Analog + Digital Dirk Wiedner, Mu3e 28.02.2017 60

  22. Thinned Sensors • Prototypes thinned: o MuPix7 thinned to 50 , 62, 75μm • Good performance of thin chips o In lab o In particle beam MuPix4 thinned to 50 μ m Dirk Wiedner, Mu3e 28.02.2017 61

  23. Setup March 2016 Test-Beam @ DESY • Beam-line TB22 o up to 5 GeV electrons • Aconite telescope • MuPix7 prototype • Readout setup from PI Heidelberg MuPix7 @ DESY test-beam in EUDET telescope Dirk Wiedner, Mu3e 28.02.2017 62

  24. Sub-Pixel Efficiencies • Hit efficiency map and projections for 2×2 pixel array • 4 GeV electrons • Bias voltage −40V to enhance the inefficient regions Dirk Wiedner, Mu3e 28.02.2017 63

  25. Temperature Dependence • Pulse shape vs temperature o Injection pulse to pixel discriminator output • Climate chamber o 0°C, 20°C, 40°C, 60°C  Significant change to  Pulse shape  Signal amplitude  Slight change to time M U P IX 7 resolution High bias currents (1W/cm 2 ) HV -85V  Re-calibration Dirk Wiedner, Mu3e 28.02.2017 64

  26. Temperature Dependence • Pulse shape vs temperature o Injection pulse to pixel discriminator output • Climate chamber o 0°C, 20°C, 40°C, 60°C  Significant change to  Pulse shape  Signal amplitude  Slight change to time resolution  Re-calibration Dirk Wiedner, Mu3e 28.02.2017 65

  27. Mechanics Backup Dirk Wiedner, Mu3e 28.02.2017 66

  28. Mu3e Silicon Detector • Conical target • Inner double layer o 8 and 10 sides of 2 x 12 cm 2 • Outer double layer o 24 and 28 sides of 2 x 36 cm 2 • Re-curl layers o 24 and 28 sides of 2x 36 cm 2 o Both sides Dirk Wiedner, Mu3e 28.02.2017 67

  29. Mu3e Silicon Detector • Conical target • Inner double layer o 8 and 10 sides of 2 x 12 cm 2 • Outer double layer o 24 and 28 sides of 2 x 36 cm 2 • Re-curl layers o 24 and 28 sides of 2x 36 cm 2 o Both sides Dirk Wiedner, Mu3e 28.02.2017 68

  30. Mu3e Silicon Detector • Conical target • Inner double layer o 8 and 10 sides of 2 x 12 cm 2 • Outer double layer o 24 and 28 sides of 2 x 36 cm 2 • Re-curl layers o 24 and 28 sides of 2x 36 cm 2 o Both sides Dirk Wiedner, Mu3e 28.02.2017 69

  31. Mu3e Silicon Detector • Conical target • Inner double layer o 8 and 10 sides of 2 x 12 cm 2 • Outer double layer 108 inner sensors o 24 and 28 sides of 2 x 36 cm 2 2736 outer sensors • Re-curl layers ~180 000 000 pixel o 24 and 28 sides of 2 x 36 cm 2 o Both sides Dirk Wiedner, Mu3e 28.02.2017 70

  32. Sandwich Design • HV-MAPS o Thinned to 50 μm o Sensors 2 x 2 cm 2 • Kapton™ flex print o 25 μm Kapton™ o 14 μm Alu traces • Kapton™ Frame Modules o 25 μm foil o Self supporting • Alu end wheels 0.11% of X 0 o Support for all detectors Dirk Wiedner, Mu3e 28.02.2017 71

  33. Thinned Pixel Sensors • HV-MAPS* o Thinned to 50 μm o Sensors 2 x 2 cm 2 • Kapton™ flex print o 25 μm Kapton™ o 14 μm Alu traces • Kapton™ Frame Modules o 25 μm foil o Self supporting • Alu end wheels o Support for all detectors MuPix3 thinned to < 9 0μm Dirk Wiedner, Mu3e 28.02.2017 72

  34. Kapton™ Flex Print • HV-MAPS o Thinned to 50 μm o Sensors 2 x 2 cm 2 • Kapton™ flex print o 25 μm Kapton™ o 14 μm Alu traces • Kapton™ Frame Modules o 25 μm foil o Self supporting • Alu end wheels o Support for all detectors Laser-cut flex print prototype Dirk Wiedner, Mu3e 28.02.2017 73

  35. Pixel Modules • HV-MAPS o Thinned to 50 μm o Sensors 2 x 2 cm 2 • Kapton™ flex print o 25 μm Kapton™ o 14 μm Alu traces • Kapton™ Frame Modules o 25 μm foil o Self supporting • Alu end wheels o Support for all detectors CAD of Kapton™ frames Dirk Wiedner, Mu3e 28.02.2017 74

  36. Overall Design • HV-MAPS o Thinned to 50 μm • Two halves for layers 1+2 o Sensors 2 x 2 cm 2 • 6 modules in layer 3 • 7 modules in layer 4 • Kapton™ flex print o 25 μm Kapton™ o 14 μm Alu traces • Kapton™ Frame Modules o 25 μm foil o Self supporting • Alu end wheels o Support for all detectors CAD of Kapton™ frames Dirk Wiedner, Mu3e 28.02.2017 75

  37. Inner Layers • HV-MAPS o Thinned to 50 μm o Sensors 2 x 2 cm 2 • Kapton™ flex print o 25 μm Kapton™ o 14 μm Alu traces • Kapton™ Frame Modules o 25 μm foil o Self supporting • Alu end wheels o Support for all detectors Rendering of vertex detector CAD Dirk Wiedner, Mu3e 28.02.2017 76

  38. Outer Module • HV-MAPS o Thinned to 50 μm o Sensors 2 x 2 cm 2 • Kapton™ flex print o 25 μm Kapton™ o 14 μm Alu traces • Kapton™ Frame Modules o 25 μm foil o Self supporting • Alu end wheels o Support for all detectors Layer 3 Prototype in Assembling Frame with 50 μ m Glass Dirk Wiedner, Mu3e 28.02.2017 77

  39. Detector Frame • HV-MAPS o Thinned to 50 μm o Sensors 2 x 2 cm 2 • Kapton™ flex print o 25 μm Kapton™ o 14 μm Alu traces • Kapton™ Frame Modules o 25 μm foil o Self supporting • Alu end wheels o Support for all detectors Pixel detector CAD rendering Dirk Wiedner, Mu3e 28.02.2017 78

  40. Thinning • 50 μ m Si-wafers o Commercially available o HV-CMOS 50 μ m (AMS) o 50 μ m for MuPix4 and MuPix7 Dirk Wiedner, Mu3e 28.02.2017 79

  41. Cooling Backup Dirk Wiedner, Mu3e 28.02.2017 80

  42. Liquid Cooling • Beam pipe cooling o With cooling liquid o 5°C temperature o Significant flow possible • For electronics o FPGAs o Power regulators o Mounted to cooling plates • Total power several kW Dirk Wiedner, Mu3e 28.02.2017 81

  43. He Cooling • Gaseous He cooling o Low multiple Coulomb scattering o He more effective than air • Global flow inside Magnet volume • Distribution in Frame • Local flow: V-shapes 400mW/cm 2 x 11664cm 2 • Gap flow: Outer surface ≈ 4.7 KW 28.02.2017 Dirk Wiedner, Mu3e 82

  44. Simulation He cooling 400mW/cm 2 Dirk Wiedner, Mu3e 28.02.2017 83

  45. Test Results • 1:1 Prototype o Layer 3+4 of silicon tracker o Ohmic heating 400mW/cm 2 • Cooling He o at several m/s • Temperature sensors attached to foil o LabVIEW readout • Results promising o ΔT < 60 °K  No sign of vibration in air Dirk Wiedner, Mu3e 28.02.2017 84

  46. He Cooling 750 mW/cm 2 Dirk Wiedner, Mu3e 28.02.2017 85

  47. DAQ Backup Dirk Wiedner, Mu3e 28.02.2017 86

  48. Front End FPGAs • FPGAs on detector (?) Pixel o 112 pieces Sensor • Receive sensor data 1250 Mbit/s o 36-45 LVDS inputs LVDS in x 45 • 6.4 Gbit/s outputs o 8 optical links Front end o … to counting house FPGA 6.4 Gbit/s optical Readout board Dirk Wiedner, Mu3e 28.02.2017 87

  49. Readout Board • FPGA readout boards Front Front Front Front o per sub-detector end end end end FPGA FPGA • 6.4 Gbit/s optical inputs FPGA FPGA o 16-48 inputs 6.4 Gbit/s Optical • 10 Gbit/s optical output x48 o 12 outputs to PCs Readout • Switching network board o One output per PC 10 Gbit/s Optical x12 PC PC PC Dirk Wiedner, Mu3e 28.02.2017 88

  50. Readout Board • FPGA readout boards Front Front Front Front o 4 per sub-detector end end end end FPGA FPGA • 6.4 Gbit/s optical inputs FPGA FPGA o 16-48 inputs 6.4 Gbit/s Optical • 10 Gbit/s optical output o 12 outputs to PCs Readout • Switching network board o One output per PC 10 Gbit/s Optical x12 PC PC PC Dirk Wiedner, Mu3e 28.02.2017 89

  51. Trigger-less DAQ Front end links • o Pixel sensor to on-detector FPGA • 1250 Mbit/s • LVDS o Timing detector readout Optical links from detector • o Front end FPGAs o … to readout boards o 6.4 Gbit/s Optical links in counting • room o Off-detector read out boards o …to PC Farm Dirk Wiedner, Mu3e 28.02.2017 90

  52. Trigger-less DAQ Pixel Front end links • Sensor o Pixel sensor to on-detector FPGA • 1250 Mbit/s • LVDS Silicon o Timing detector readout FPGAs Optical links from detector • x86 o Front end FPGAs o … to readout boards o 6.4 Gbit/s Readout Optical links in counting board • room x4 o Off-detector read out boards o …to PC Farm PC x12 Dirk Wiedner, Mu3e 28.02.2017 91

  53. Trigger-less DAQ Pixel Fiber Tile Pixel Front end links • Sensor Fiber Tile Pixel Sensor Fiber Tile Pixel o Pixel sensor to on-detector Sensor Fiber Tile Sensor FPGA • 1250 Mbit/s O(Tbit/s) x2844 x192 x196 • LVDS Fiber Silicon Tile o Timing detector readout FPGAs FPGAs FPGAs Optical links from detector • x86 12x x14 o Front end FPGAs o … to readout boards o 6.4 Gbit/s Readout Readout Readout Optical links in counting board board board • room x4 x2 x2 o Off-detector read out boards o …to PC Farm PC x12 Dirk Wiedner, Mu3e 28.02.2017 92

  54. Trigger-less DAQ Pixel Fiber Tile Pixel Front end links • Sensor Fiber Tile Pixel Sensor Fiber Tile Pixel o Pixel sensor to on-detector Sensor Fiber Tile Sensor FPGA • 1250 Mbit/s • LVDS Fiber Silicon Tile o Timing detector readout FPGAs FPGAs FPGAs Optical links from detector • x86 x12 x14 o Front end FPGAs o … to readout boards x128 o 6.4 Gbit/s Readout Readout Readout Optical links in counting board board board • room x4 x2 x2 o Off-detector read out boards o …to PC Farm PC x12 Dirk Wiedner, Mu3e 28.02.2017 93

  55. Trigger-less DAQ Pixel Fiber Tile Pixel Front end links • Sensor Tile Fiber Pixel Sensor Fiber Tile Pixel o Pixel sensor to on-detector Sensor Fiber Tile Sensor FPGA • 1250 Mbit/s • LVDS Fiber Silicon Tile o Timing detector readout FPGAs FPGAs FPGAs Optical links from detector • x86 x12 x14 o Front end FPGAs O(Tbit/s) o … to readout boards x128 x48 x56 o 6.4 Gbit/s Readout Readout Readout Optical links in counting board board board • room x4 x2 x2 o Off-detector read out boards o …to PC Farm PC x12 Dirk Wiedner, Mu3e 28.02.2017 94

  56. Trigger-less DAQ Pixel Fiber Tile Pixel Front end links • Sensor Fiber Tile Pixel Sensor Fiber Tile Pixel o Pixel sensor to on-detector Sensor Fiber Tile Sensor FPGA • 1250 Mbit/s • LVDS Fiber Silicon Tile o Timing detector readout FPGAs FPGAs FPGAs Optical links from detector • x86 x12 x14 o Front end FPGAs o … to readout boards o 6.4 Gbit/s Readout Readout Readout Optical links in counting board board board • room x4 x2 x2 x24 o Off-detector read out boards x24 o …to PC Farm PC O(Tbit/s) x48 x12 Dirk Wiedner, Mu3e 28.02.2017 95

  57. GPU-PC • PC with GPU • 10 Gbit/s Fiber input o 8 inputs from sub-detectors • Data filtering o Timing Filter on FPGA o Track filter on GPU o Data to tape < 100 MB/s Dirk Wiedner, Mu3e 28.02.2017 96 GPU computer

  58. GPU-PC • PC with GPU Optical mezzanine connectors • 10 Gbit/s Fiber input o 8 inputs from sub-detectors • Data filtering o Timing Filter on FPGA FPGA PCIe board o Track filter on GPU o Data to tape < 100 MB/s Dirk Wiedner, Mu3e 28.02.2017 97 GPU computer

  59. Timing Filter Under discussion • Entire event on PCIe FPGA • Tile and Fiber data o Easy to match o Look for three tracks • Reject data without three hits o … inside time interval 1 2 3 Dirk Wiedner, Mu3e 28.02.2017 98

  60. Timing Filter Under discussion • Entire event on PCIe FPGA • Tile and Fiber data o Easy to match o Look for three tracks • Reject data without three hits o … inside time interval 1 2 3 Dirk Wiedner, Mu3e 28.02.2017 99

  61. Vertex Filter • Entire event on GPU • Large target o Large spread of muons o Easy vertex separation • Reject data without three tracks o … inside area interval on target 1 2 3 Dirk Wiedner, Mu3e 28.02.2017 100

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