Review on the R&D Activities within the RD51 Collaboration Kondo - - PowerPoint PPT Presentation
INSTR20 - February 24-28, BINP Novosibirsk, Review on the R&D Activities within the RD51 Collaboration Kondo Gnanvo on Behalf of the RD5 Collaboration Outline Introduction to the RD51 Collaboration INSTR20 - February 24-28, BINP
INSTR20 - February 24-28, BINP Novosibirsk,
Kondo Gnanvo
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MPGD Technologies in HEP, NP experiments and beyond:
❖ GEMs ⇨ COMPASS Trackers, CMS Muon Upgrade, ALICE TPC, KLOE2 CGEM, SBS GEMs (JLab), STAR FGT (BNL). ESS n-Detection … ❖ Micromegas ⇨ COMPASS Trackers, ATLAS Muon Upgrade, CLAS12 MVT (JLab), T2K TPC, Muon Radiography … ❖ THGEMs ⇨ COMPASS RICH upgrade, LBNO-DEMO, AT-TPC (NSCL)
RD51
2009
1988 MSGC 1996 Micromegas 1997 GEM 2000 µPIC 2002 THGEM
renewed for 3rd term 2014 2019
Start ~ 2010 with R&D white paper Supported by a collaboration of people & Institutes with the GERN GDD lab at its core
µRWELL
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Angelini F., NIMA 335:69 (1993)
Micro Gap Chambers
Micro Wire Chamber
Biagi SF, Jones TJ. NIM A361:72 (1995)
MicroDot
Ochi et al NIMA 471 (2001) 264
m-PIC
MicroWELL
Micro Mesh Gaseous Structure Gas Electron Multipliers (GEMs)
Micro Gap Wire Chamber
NIMA 398 (1997) 195
Micro Groove
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Development Dissemination Tools and facilities
Exploit existing technologies
Large size single-mask GEMs Resistive Micromegas
Develop novel technologies
μPIC, μR-WELL, GRIDPIX
High-Energy Physics
ALICE, ATLAS, CMS, Compass, KLOE, BESIII, SBS, EIC Detectors
Fundamental research beyond HEP
LBNO-DEMO, active-target TPCs
Beyond fundamental research
Muon radiography, n-detection, X-ray radiographies
Common infrastructures
(GDD lab, common test beam)
Electronics
(Scalable Readout System SRS, instrumentation)
Simulation
(Garfield, Magboltz, Degrad, neBEM)
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WG1: Technologies & New structures ⇨ R&D support for experiments and LHC upgrades WG2: Characterization & Detector physics WG3: Training and dissemination WG4: Software & Simulation Tools WG5: Readout Electronics (RD51 SRS) WG6: MPGD Production & Industrialization WG7: RD51 Lab and Test-Beam Infrastructure
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Thin Film Lab MPT Workshop GDD Lab Test Beams Electronics Simulation Tools Tools & facilities CERN GDD team RD51 groups Expertise & people Meetings & conferences Generic R&D Industrialization Detector physics Activities
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❑ Consolidation of the Collaboration and MPGD community integration (90 Institutes, ~500 members); Conferences, Meetings, Workshops, AIMEs, Schools, Lectures, Trainings ❑ Major progress in the MPGD technologies development in particular large area GEM (single mask), MicroMegas (resistive), THGEM; some picked up by experiments (including LHC upgrades);
❖ ALICE, TPC read-out, ~ 500 m2 of GEM foils ❖ ATLAS, small wheels, 1200 m2 to be instrumented ❖ CMS, GE1/1 forward detectors, 250 m2 of GEM foils ❖ COMPASS RICH, 4.5 m2 to be instrumented, single photon detection
❑ Secured future of the MPGD technologies development through the EP-DT-MPT workshop upgrade and FP7 AIDA & AIDA2020 contribution; ❑ Contacts with industry for large volume production, MPGD industrialization and first industrial runs; ❑ Major improvement of the MPGD simulation software framework for small structures allowing first applications; ❑ Development of common, scalable readout electronics (SRS) (many developers and > 50 user groups); Production (PRISMA company and availability through CERN store); Industrialization (re-design of SRS in ATCA in EISYS); SRS Technology CERN spin-off, APV and VMM interfacing. ❑ Infrastructure for common RD51 test beam and lab facilities (>20 user groups)
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Development of large area detectors driven by RD51 & LHC Experiments Upgrades
Large GEM ⇨ single masks; Large & spark-resistant Micromegas ⇨ Resistive; single photon Detector THGEM + Micromegas ⇨ Hybrid MPGDs;
ALICE TPC upgrade GEM CMS Muon system upgrade GEM ATLAS NSW upgrade Micromegas COMPASS RICH upgrade THGEM + Micromegas
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Calorimetry with MPGD Resistive Material
≈50phe
≈50phe
Fast Timing New Materials (Glass GEM)
The Latest Results of Crystalized Glass GEM,
B10
Gd Neutrons Detection New Large Area Thin Detectors
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ALICE TPC IBF
Discharge studies ALICE/CMS
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FE Hybrids: APV25, VMM3, VFAT, SAMPA … 14
https://indico.desy.de/indico/event/7435/material/1/4.pdf
A multi-purpose Scalable Readout System with different front-end chips is developed and maintained in the RD51 collaboration. This simplifies detector R&D and can be scaled from small prototypes to operational experiments.
detector electronics
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SRS+SiPM (NEXT TPC)
2015
SRS+Timepix (LC-TPC) – Bonn/Desy SRS-FEC+TOTEM DAQ SRS for R&D on Detectors SRS for experiments (ATCA)
SRS & APV25 (PRad JLab)
PRad e-p scattering experiment in Summer 2016 @ JLab (HallB) ▪ PRad GEMs with APV25-SRS (9k strip read out) ▪ Large scale SRS to run in an experiment ⇨ > 9k e- Ch, ▪ @ a trigger rate = 4 kHz ▪ Untold success story of SRS SRS crate / SRU combo
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❑ State-of-the-art facility pioneering MPGD technologies through advanced manufacturing techniques ❑ Contributing to generic R&D and large volume production for upgrades of LHC experiments New building with advanced capabilities
Rui De Oliveira et al., Micro-Pattern Technologies
https://ep-dep-dt.web.cern.ch/micro-pattern-technologies
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Clean Rooms Hosting groups from RD51 and providing access to facilities Acting as interface to Thin Film Lab & MPT workshop at CERN
❑ MPGD Detectors ❑ Gas system and services ❑ Readout electronics (std and custom RD51 SRS&APV) ❑ Radioactive Sources & X-ray tubes ❑ Cosmic stand ❑ Interface with CERN services (RP, gas, metrology, irradiation facilities,…)
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▪ Test beam periods at EHN1-H4 North Area ▪ shared between RD51 groups ▪ Typically 3 periods of 2 weeks / per year Control Room Gaz Area Experimental Area (H4) Storage Area Examples of the test beam user teams
CMS (GEM) WIS/A/C (WELL, THGEM) ATLAS NSW (mm) BESS III & SHIP (GEM) LAPP/DEM/IRFU(µm) ALICE TPC (GEM & µm) ~ 30 groups in total with several running in parallel
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pioneered by CMS GEM Muon Upgrade collaboration & RD51 Cool Rui De Oliveira, CERN PCB workshop
NS2 Triple GEM assembly technique ❖ Mechanical stretching with small frames with the use of a set of screws, fittings for the stretching ❖ Control of the stretching and the flatness of the GEMs ❖ No glue involved: Chamber can be re-opened ❖ No need for spacers in active area ❖ BUT: Lots of screws and rigid supports to hold tension
Progress on large area GEMs Serge Duarte Pinto et al., Jinst, November 26, 2009 [http://arxiv.org/pdf/0909.5039v2.pdf]
Single Mask Techniques for large GEM foils production ❖ Allow for the production of large GEM foils (> 50 cm x 50 cm) ❖ Require single photo lithography mask on one side of the GEM foil during the different etching processes ❖ Big step forward for current and future GEM project like CMS Muon detector upgrade, SBS and SoLID @ JLab, Muon Chamber for PANDA @ FAIR Limitation from mask alignment ➩ max active area ~ 40×40 cm 2 No alignment required ➩ Very large GEM foil
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Monitored HV (continuous line) and current (point) as a function
R&D effort by the RD51 Coll & the ATLAS Muon Upgrade ❖ playing with the induction of the signal in the readout to protect against the damaging effects of spark ❖ A sketch (not in scale) of the resistive-strip protection principle with a view along and orthogonal to the strip direction ❖ Induced signal on the strips (no direct collection charges)
Spark signals on the oscilloscope (on 50 Ω, attenuated 1:100) and under neutron irradiation
Unacceptable rate of discharge with standard Micromegas ❖ Not destructive for the detector ⇨ Robust and sturdy device ❖ However: long dead time and discharge critical for the FE chips (need to be very well protected)
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Hybrids MPGDs for COMPASS RICH1 PD Upgrade: MWPCs replaced by THGEMs + CsI + Micromegas Typical PARAMETERS:
❖ Diam. = 0.4 mm, Pitch = 0.8 mm ❖ Thick. = 0.4 mm, Rim = 10 μm ❖ Fast signal (ns), Gain @ HV = 2kV: 105 atmospheric pressure
Ring reconstruction
GEM-like multipliers for large area UV-RICH detectors PCB Etching and drilling Simple and robust & cost effective
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The µ-RWELL_PCB is realized by coupling: 1. a “suitable WELL patterned kapton foil as “amplification stage” 2. a “resistive stage” for the discharge suppression & current evacuation: i. “Low particle rate” (LR) << 100 kHz/cm2: single resistive layer → surface resistivity ~100 M/ (CMS-phase2 upgrade - SHIP) ii. “High particle rate” (HR) >> 100 kHz/cm2: more sophisticated resistive scheme must be implemented (MPDG_NEXT- LNF & LHCb-muon upgrade) 3. a standard readout PCB
❖
Like Micromegas ➩ One amplification stage, no need to stretched etc …
❖
Like GEM ➩ Simple structure (Just like GEM foil); ideal for a full cylindrical detector Robust and simple detector
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GEM KLOE-2 @ Frascati,
INSTR2014, Novosibirsk GEM: BoNuS rTPC in Hall B @ JLab
Tagged SF, JLAB 2014
MPGD2015 Trieste, Italy Micromegas CLAS12 (Hall B, JLab)
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https://arxiv.org/pdf/1011.5528.pdf
Even Spherical GEM
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24 ps
Single pad (2016) ⌀1cm Multi pad (2017) ⬡ 1cm 10x10 module □ 1cm
Scaling up From single pad to multi-pad module Photocathode Robustness Florian Brunbauer, INSTR20, Novosibisrk Feb 26, 2020 https://indico.inp.nsk.su/event/20/session/3/contribution/17/material/slides/0.pdf Cherenkov radiator + Photocathode + Micromegas Prototype in Test beam
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Coupling fast camera readout with GEM amplification ❑ Many applications in: ❖HEP (optical readout TPC) ❖Radiography ❖Medical Imaging …
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GEMPIX (F. Murtas et al.)
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A large TPC prototype for a linear collider detector P. Schade, J. Kaminski, NIMA, 628, 1, 1 February 2011, Pages 128-132 https://indico.cern.ch/event/391665/contributions/1827282/attachments/1230061/1802690/GridPix.pdf
LC-TPC
https://cds.cern.ch/record/2025932/files/PoS(TIPP2014)060.pdfT
256 x 256 pixels, 55 x 55 μm pitch, about 1.4x1.4 cm2 sensitive area
CAST CAST InGrid & TimePix: the ultimate gaseous TPC (H. Van Der Graaf)
https://agenda.linearcollider.org/event/7795/contributions/ 40334/attachments/32507/49403/QUAD_development.pdf
The “QUAD”
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https://indico.cern.ch/event/709670/contributions/3020862/attachments/1672921/2684467/
DLC photocathodes µRWELL with DLC Resistive DLC GEM
https://indico.cern.ch/event/709670/contributions/3020863 /attachments/1672927/2684424/NEW_structures.pdf
Graphene layers
http://cds.cern.ch/record/2238855/files/CER N-THESIS-2016-199.pdf?version=1
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Advanced materials can boost detector performance and applicability. Solid converters and photocathodes enable new detector concepts and resistive materials with well-controlled parameters can be used to develop robust and performant MPGDs. Coarse 2D strip anode 3D printed THGEM
Feedthroughs Embedded resistors Capacitively coupled pads Spherical readout structures
Powering and readout electrodes
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▪ Micro Pattern Gas Detector: versatile technology .. Offers different options for different requirements ▪ MPGD field is expanding with the emergence of “Resistive” and new materials ▪ New processing techniques will open the field for new micro structures ▪ RD51 Collaboration is the glue for the MPGDs communities and a critical support for the development of MPGDs and emergence of new technologies