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Real Time Embedded Systems " Memories Memories " rene.beuchat@epfl.ch LAP/ISIM/IC/EPFL Charg de cours LSN/hepia Prof. HES 1998-2008 R.Beuchat / Memories 2 General classification of electronic memories Non-volatile


  1. Real Time Embedded Systems " Memories Memories " rene.beuchat@epfl.ch LAP/ISIM/IC/EPFL Chargé de cours LSN/hepia Prof. HES 1998-2008 R.Beuchat / Memories 2

  2. General classification of electronic memories • • Non-volatile Memories Volatile Memories � Static RAM (RAM/SRAM) � ROM � S tatic � PROM � S ynchronous � EPROM � Dynamic RAM � EEPROM (DRAM/SDRAM, DDR) � Flash EPROM NVRAM � D ynamic N on V olatile � E lectrically RAM � R andom � E rasable � A ccess � P rogrammable � M emory MRAM � R ead Magnetoresistive RAM � S ynchronous � O nly FRAM � M emory � D ual Ferromagnetic RAM � D ata R ate � Z-RAM (Zero transistor) 3 1998-2008 R.Beuchat / Memories

  3. Objectives • Having an overview of the different kinds of memories on the market • Understanding the internal architecture of dynamic memories, specifically SDRAM 5 1998-2008 R.Beuchat / Memories

  4. Memory Model Random Access Memory : at Address � DATA Address Data: Content 0 1 1 0 1 1 0 1 0x00 0 0 0 0 0 0 0 0 0 1 0 0 0 1 0 1 0x01 0 0 0 0 0 0 0 1 Write 0 0 1 0 1 1 1 1 0 0 0 0 0 0 1 0 1 1 0 1 0 1 0 1 0 0 0 0 0 0 1 1 0 1 1 0 1 0 0 1 0 0 0 0 0 1 0 0 Read . . . . . . . . 1 0 1 0 1 1 0 1 0 1 1 1 1 0 1 1 0 0 1 1 1 0 0 0 0 1 1 1 1 1 0 0 1 1 0 0 0 1 0 1 0 1 1 1 1 1 0 1 1 0 1 0 1 0 0 1 0 1 1 1 1 1 1 0 0 1 1 1 1 0 1 0 0x7F 0 1 1 1 1 1 1 1 6 1998-2008 R.Beuchat / Memories

  5. Content • Non Volatile Memories • Volatiles Memories : Static • Volatiles Memories : Dynamic � Asynchronous � Synchronous � Dual Data Rate � RamBus � Evolution / Market 7 1998-2008 R.Beuchat / Memories

  6. Non Volatile Memories 1998-2008 R.Beuchat / Memories 8

  7. Volatile Memories Dynamic Memories 1998-2008 R.Beuchat / Memories 57

  8. DRAM (asynchronous basic memory) • Main characteristics: � Dynamic Memory � Rom/Column Organization � Control signals: /RAS, /CAS, /WR, (/OE) � Burst access possibilities: � Nibble mode � Static Column Mode � Page Mode � Fast Page Mode (FPM) � Extended Data Out (EDO) 58 1998-2008 R.Beuchat / Memories

  9. DRAM Memorization elements All acceded on a row at the same time � Power consummation 59 1998-2008 R.Beuchat / Memories

  10. DRAM multiplexed Addresses: Row/Column 60 1998-2008 R.Beuchat / Memories

  11. DRAM multiplexed Addresses: Row/Column 61 1998-2008 R.Beuchat / Memories

  12. DRAM Data Bus : Separated In/Out Bi-directional 62 1998-2008 R.Beuchat / Memories

  13. DRAM Memories controller Processor interface : Address multiplexer 63 1998-2008 R.Beuchat / Memories

  14. DRAM, circuits multiples Control signals organization on a memory module Ex: 32 bits data bus width, with parity 64 1998-2008 R.Beuchat / Memories

  15. DRAM read access 65 1998-2008 R.Beuchat / Memories

  16. DRAM write access 66 1998-2008 R.Beuchat / Memories

  17. DRAM late write 67 1998-2008 R.Beuchat / Memories

  18. DRAM Read-Modify-Write 68 1998-2008 R.Beuchat / Memories

  19. DRAM Precharge time • Between 2 access there is the recovery time • The vertical (column) lines are precharge to an intermediate voltage • When access to the memory is done, the driver is less stressed to transfer the high/low logical level • This take time !! ~30-50 ns 69 1998-2008 R.Beuchat / Memories

  20. DRAM Refresh • The memory need to be refreshed to maintain its content • Particular Cycles : � RAS only � CAS before RAS � Hidden refresh 70 1998-2008 R.Beuchat / Memories

  21. DRAM Refresh 71 1998-2008 R.Beuchat / Memories

  22. DRAM Refresh 72 1998-2008 R.Beuchat / Memories

  23. DRAM Refresh 73 1998-2008 R.Beuchat / Memories

  24. DRAM Accès multiples, page Page mode 74 1998-2008 R.Beuchat / Memories

  25. DRAM Accès multiples, nibble Nibble mode 75 1998-2008 R.Beuchat / Memories

  26. DRAM Accès multiples, static column Static column mode 76 1998-2008 R.Beuchat / Memories

  27. DRAM Accès multiples, static column Static column mode 77 1998-2008 R.Beuchat / Memories

  28. DRAM Accès multiples, EDO EDO 78 1998-2008 R.Beuchat / Memories

  29. VRAM (Video RAM) • Asynchronous Dynamic Memory • Added "Serial Register" • Transfer between Dynamic array and serial line • Independent serial transfers 79 1998-2008 R.Beuchat / Memories

  30. VRAM (Video RAM) Ex: First VRAM 64k x 4, 4 serial bits 80 1998-2008 R.Beuchat / Memories

  31. VRAM (Video RAM) simple model 81 1998-2008 R.Beuchat / Memories

  32. VRAM parallel register+counter+mux 82 1998-2008 R.Beuchat / Memories

  33. VRAM parallel register+counter+mux • The serial register is build from a parallel register � the full content of the selected line (Row) is transferred in a large register • During the column phase, the address is transferred in a counter: the start address of the line • The counter select a multiplexer, thus the parallel register is transform in a serial register! 83 1998-2008 R.Beuchat / Memories

  34. SDRAM Synchronous Dynamic RAM 1998-2008 R.Beuchat / Memories 84

  35. SDRAM (Synchronous DRAM) • synchronous DRAM Memories • 16 Mbits..256 Mbits • x4, x8, x16, x32 • 3.3V, 2.5V � 1.8V • Clk 200MHz • 2 Banks / 4 Banks • PC100 SDRAM standard • Command ACTIVE to send with the Row and Bank address • Read, Write Command with Column address • Concurrent Precharge between 2 banks 85 1998-2008 R.Beuchat / Memories

  36. SDRAM • Clock to synchronized every signals • Internal Pipeline • New column address possible in every transfer cycle • Internal banks available to shadow the precharge • Self-refresh (Self-Refresh command ) 86 1998-2008 R.Beuchat / Memories

  37. SDRAM Bank0 Bank1 87 1998-2008 R.Beuchat / Memories

  38. 88 R.Beuchat / Memories SDRAM 1998-2008

  39. 89 R.Beuchat / Memories SDRAM 1998-2008

  40. SDRAM Cas Latency (CL) Read cycle 4 burst accesses 90 1998-2008 R.Beuchat / Memories

  41. SDRAM Write data with command CL=3 91 1998-2008 R.Beuchat / Memories

  42. 92 R.Beuchat / Memories CL=2 SDRAM 1998-2008

  43. SDRAM 4 banks ex: IS42S32800B • Nb row (12) ≠ Nb Column(9) • 4 banks • x32 bits width (4x8bits) • 256 Mbits : � 4 x 2M x 32 • Masked by DQM<3..0> 93 1998-2008 R.Beuchat / Memories

  44. SDRAM 4 banks ex: IS42S32800B See the full documentation For all specific timings relationships http://www.issi.com/pdf/42S32800B.pdf 94 1998-2008 R.Beuchat / Memories

  45. Module DIMM SDRAM • Module DIMM 100-Pin • Bus x32 • Synchronous • SDRAM Memory 95 1998-2008 R.Beuchat / Memories

  46. SDRAM (x32, x36) 96 1998-2008 R.Beuchat / Memories

  47. SDRAM (x64, x72) 97 1998-2008 R.Beuchat / Memories

  48. PC100 SDRAM DIMM Dual In Line Memory module • Specification from Intel for DIMM 100MHz • EEPROM memory on the module for the specification of the DIMM � SPD : Serial Presence detect • Specification for memory from 64Mbytes to 1024 Mbytes (1GBytes) • Module without buffer • Module with register to be used with up to 36 chips • Old specification (historical) 98 1998-2008 R.Beuchat / Memories

  49. SGRAM Synchronous Graphic RAM • 128kx32, 256kx32, 512kx32 • Synchronous • Double banque • Burst 1, 2, 4, 8 ou pleine page • Block Write, Write par bit • Auto precharge, auto refresh • 3.3V 99 1998-2008 R.Beuchat / Memories

  50. SGRAM Synchronous Graphic RAM 100 1998-2008 R.Beuchat / Memories

  51. 101 R.Beuchat / Memories SGRAM 1998-2008

  52. 102 R.Beuchat / Memories SGRAM 1998-2008

  53. Graphics Memory GDDR • Features � 2.2V +/-0.1V VDD/VDDQ power supply supports 900 / 800MHz � 2.0V VDD/ VDDQ wide range min/max power supply supports 700MHz � 1.8V VDD/ VDDQ wide range min/max power supply supports 500 / 600MHz � Single ended READ Strobe (RDQS) per byte � Single ended WRITE Strobe (WDQS) per byte � Internal, pipelined double-data-rate (DDR) architecture; two data accesses per clock cycle � Calibrated output driver � Differential clock inputs (CK and CK#) � Commands entered on each positive CK edge � RDQS edge-aligned with data for READ; with WDQScenter-aligned with data for WRITE � Eight internal banks for concurrent operation � Data mask (DM) for masking WRITE data 103 1998-2008 R.Beuchat / Memories

  54. Graphics Memory GDDR • Features � 4n prefetch � Programmable burst lengths: 4, 8 � 32ms, 8K-cycle auto refresh � Auto precharge option � Auto Refresh and Self Refresh Modes � 1.8V Pseudo Open Drain I/O � Concurrent Auto Precharge support � tRAS lockout support, Active Termination support � Programmable Write latency(1, 2, 3, 4, 5, 6) � Boundary Scan Feature for connectivity test(refer to JEDEC std., not in this version of Specifications) 104 1998-2008 R.Beuchat / Memories

  55. Graphics Memory 105 1998-2008 R.Beuchat / Memories

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