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Metallizer for BD-R/RE Production and Beyond Oerlikon Systems
- R. Bieri
Page 2 15/03/2011 Media Tech 2011
- R. Bieri SYOM
Oerlikon Systems R. Bieri Head of Metallizer Balzers, March 2011 - - PowerPoint PPT Presentation
Oerlikon Systems R. Bieri Head of Metallizer Balzers, March 2011 - - PowerPoint PPT Presentation
Metallizer for BD-R/RE Production and Beyond Oerlikon Systems R. Bieri Head of Metallizer Balzers, March 2011 Layer Stack done on Oerlikon Metallizer Page 2 15/03/2011 Media Tech 2011 R. Bieri SYOM Oerlikon Metallizer: more then 20
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Page 3 15/03/2011 Media Tech 2011
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SDS 131 BIG SPRINTER SPRINTER-9/13 SPRINTER-8 SPRINTER-5 SDS 100
90 . . . . 93 . . . . 94 . . . . 95 . . . . 96 . . . . 97 . . . . 98 . . . . 99 . . . . 00 . . . . 01 . . . . 02 . . . . 03 . . . . 04 . . . . 05 . . . .
MO Disc CD-RW, DVD+/-RW, DVD-RAM, BD-R/RE BDXL
Oerlikon Metallizer: more then 20 Years in the OD Industry
..2011..
CDI 901 CDI 915 TWISTER SWIVEL98 CUBE SPEED & SWIVEL2000 SWIVEL & Cube Star & CUBE LITE RF 2003
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BD Recordable Media Layers, the „Heart“ of the Recordable Disc
It„s all about the layers! done on Oerlikon Metallizer
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The right Metallizer for your Process HtL, LtH, Pre-Recorded
Recordable LtH & Pre-Recorded “Sprinter” Metallizer Recordable HtL (-R, -RE, -XL) Swivel & Cube Star Metallizer Pre-Recorded & Recordable LtH
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Sprinter Family: The Industry Standard
Sprinter-5 BD-R Sprinter-9 BD-R/RE Sprinter-13 BD-RE, BDXL
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The Complete Layer Stack in one System
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The Complete Layer Stack in one System
Protective Layer Reflective Layer Protective Layer Recording Layer
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Sprinter Advantages
Speed: Highest Throughput Protective Layer Reflective Layer Protective Layer Recording Layer Flexible Configuration: the right sputter source for your process Uniformity: Excellent Layer Uniformity
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Sprinter Advantages: Speed
Speed: Highest Throughput
- Dry Cycle Time 2.8 sec
- > 1200 discs/h
- fast target change
- high uptime
Flexible Configuration: the right sputter source for your process Uniformity: Excellent Layer Uniformity
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Speed: “Indicat” for ARQ21 DC & RF and Disc Loader
“Indicat” Indirect cooling plate Fast Target Change Time < 30 sec fixed cooling membrane Disc Loader Dry Cycle Time:
Sprinter-5: < 2.8 sec Sprinter-9: < 2.8 sec * Sprinter-13: < 2.8 sec
(* incl. process time < 1.7 sec)
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Sprinter Advantages: Uniformity
Protective Layer Reflective Layer Protective Layer Recording Layer Speed: Highest Throughput
- Dry Cycle Time 2.8 sec
- > 1200 discs/h
Flexible Configuration: the right sputter source for your process Uniformity: Excellent Layer Uniformity
- < +/- 2.5 % for most sputter materials
- Disc rotation during sputtering
- stable production condition
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Magnet system tuning to reach film thickness uniformity: ± 2.5 % within a disc
(for most sputter materials)
Thickness Uniformity
42.00 43.00 44.00 45.00 46.00 47.00 48.00
- 60.00
- 40.00
- 20.00
0.00 20.00 40.00 60.00 Radius [mm] Thickness [nm]
top-down +2.5%
- 2.5%
left-right
Uniformity: Layer Uniformity for your Process
Thickness Uniformity
35.00 35.50 36.00 36.50 37.00 37.50 38.00 38.50 39.00 39.50 40.00
- 60.00
- 40.00
- 20.00
0.00 20.00 40.00 60.00 Radius [mm] Thickness [nm]
top-down +2.0%
- 2.0%
left-right
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Sprinter Advantages: Flexibility for any Process
Speed: Highest Throughput
- Dry Cycle Time 2.8 sec
- > 1200 discs/h
Flexible Configuration:
- DC, DC pulsed, DC Flexicat
- RF, RF Flexicat
- Cooling Station CS21
- MSQ Multi Source
Uniformity: Excellent Layer Uniformity
- < +/- 2.5 % for most sputter materials
- Disc rotation during sputtering
BD-R SL BD-RE SL BD-R DL BD-RE DL BDXL 4th Gen OD
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Flexible Configuration: Process Station Selection
ARQ21 RF ARQ21 DC CS21 MSQ MCIS HS21 Window ARQ21 RF Flexicat ARQ21 DC Flexicat Disc Loader
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Selected Sputter Rates for ARQ21DC and ARQ21RF
ARQ21 DC
Al-alloy 33 nm/sec Ag-alloy 33 nm/sec TeGeSb 10 nm/sec Cu-alloy 30 nm/sec SiN 3 nm/sec ZnS-SiO2 12 nm/sec GeCrN 2.5 nm/sec GeN 2.5 nm/sec
ARQ21 RF
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MSQ (4 x ARQ81) MSQ - Multi Source Quattro
- One to four DC /RF sputter cathodes in one process chamber
- Alloy sputtering (with individual power supply for each cathode)
- Serial sputtering to reduce investment costs (less process chambers and power supplies)
- Optimized geometry for superior radial composition uniformity when mixing different target materials
- Ideal for sputtering thin layers (<10nm)
- Ideal for low power sputtering
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ARQ21RF & DC Flexicat Cathode Movable Magnet Array for Uniformity Change
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ARQ21RF & DC Flexicat Cathode Mode a.) Layer Uniformity depending on magnet position
Thickness Uniformity (new Ag Target)
40.00 41.00 42.00 43.00 44.00 45.00 20.00 25.00 30.00 35.00 40.00 45.00 50.00 55.00 60.00
Radius [mm] Thickness [nm] 0% 10% 20% 30% 40% 50%
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Uniformity ZnS-SiO2 Flexicat 21 cathode
20 25 30 35 40 45 50 55 60 Radius [mm] Thickness
2kWh Flexicat 21 (new target) 130kWh Flexicat 21 (old target)
Less than 2% thickness uniformity over whole target life!
ARQ21RF & DC Flexicat Cathode Mode b.) Constant layer uniformity over target life
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The right Metallizer for your Process HtL, LtH, Pre-Recorded
Recordable LtH & Pre-Recorded “Sprinter” Metallizer Recordable HtL (-R, -RE, -XL) Swivel & Cube Star Metallizer Pre-Recorded & Recordable LtH
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Single & Dual Cathode Metallizer for:
Aluminum Silver, Ag-Alloys Silicon Gold, CD-Gold Reactive Sputtering (SiN, etc) RF sputtering
SWIVEL & Cube Lite CUBE STAR & CUBE STAR FLEX
Single Layer Sputter System Overview Swivel, Cube Lite & Cube Star
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Swivel & Cube Lite for DC & RF Sputtering Single Cathode System
- Same base design for Swivel & Cube Lite
- Focus target cathode or flat target cathode
- Fixed or moving inner mask
- DC, DC reactive or RF sputtering
- Lowest running costs & smallest footprint
- Excellent service accessibility
- “Task oriented” touch screen panel, error tracking
- Large installed base
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- Flexible cathode and pivot arm configuration for
DC and DC reactive sputtering
- Dual cathode design enables sputtering of very
thick layers
- Flip Unit for front and back side metallization
- Smallest footprint, everything integrated
- “Task oriented” touch screen panel
- Error tracking / service support / analysis tool
- Large installed base
Cube Star Dual Cathode System
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The Right Cathode for every Material Swivel, Cube Lite, Cube Star
Cathode Name Main Sputter Material Application Remarks ARQ 931S
Ag, Ag-Alloy, Al, Si, Au DVD9 L1 & L0, BD L0 Focus Target
ARQ931SiN
Si reactive for SiN BD Backside Coating SiN Focus Target
ARQ 950
Ag/Ag-Alloy DVD R DL BD-ROM DL L1 Focus Target
ARQ 941
Conductive Material Flat Target w center hole
ARQ 21 DC & RF
Conductive & Dielectric Material Barrier Layer BD-R LtH Flat Target w/o center hole
Cube Lite Swivel, Cube Lite, Cube Star
- Highest flexibility
- Excellent uniformity
- Outstanding target utilization -> longest target life
- Fastest target changes
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Swivel ARQ931: best Target Utilization
Weight new target
4.5 kg
Weight used target
2.1 kg
Target utilization
> 52% (Silver)
= 1 mio shots @ 10nm
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Wrap-Up: Metallizer for today's and tomorrows OD Media
Recordable LtH & Pre-Recorded “Sprinter” Recordable Media (-R, -RE, -XL) Swivel & Cube Star Pre-Recorded & Recordable LtH
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