Miniaturized Energy-Efficient Integrated Neural Interfaces Chul Kim Department of Bio and Brain Engineering KAIST
Microelectrocorticography ( µ ECoG) μ Flexible Modular Array Emerging µ ECoG technologies - High spatiotemporal resolution - Fully implantable - Minimally invasive - Long-term monitoring Slide 1
ENIAC: Encapsulated Neural Interfacing and Acquisition Chip No external components or wires Slide 12 CICC2017, JSSC2018b, JSSC2018c, JSSC2017, VLSI2015a, VLSI2016, ProcIEEE2017, BioCAS2017
Neural Recording ADC – State-of-the-Art Large Gain Max range Slide 3
Neural Recording ADC – Improvements ADC-Direct Front-End Max range Slide 4 JSSC2018b
Neural Recording ADC – Micrograph Slide 5 ISSCC2018
Neural Recording ADC – in vivo tests LFPs in marmoset non-human primate Slide 6 ISSCC2018, JSSC2018b
Neural Recording ADC – in vivo tests LFPs in marmoset non-human primate Slide 7 ISSCC2018, JSSC2018b
Collaboration “Modular” µ ECoG Implants Flexible Array Joint proposal opportunities for µ ECoG systems working on freely moving subjects for next-generation Scalp Outer skull table brain imaging with: Diploe Skull 1) < 1mV spatial resolution; Inner skull table 2) > 1000 recording channels; Dura mater Arachnoid CSF 3) > 100 stimulation channels; Pia mater 4) > at least 24 hours operation time, and; Cortex 5) coverage of entire brain. 1 mm Joint proposal opportunities for unobtrusive wireless energy-efficient brain-machine interface systems. 1 mm Slide 8
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