SLIDE 1 Measurement of thermal conductivity
Part A: P t B Part B:
- Time domain thermoreflectance
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C Λ =
effusivity
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Modified Angstrom method takes into account thermal conductance from sidewalls to ambient Modern application to suspended polycrystalline Si microcantilevers (10 micron width) microcantilevers (10 micron width)
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h i i l i h
2
anharmonicity also increases the heat capacity – thermal expansion causes the f
2 P V
C C VT α κ − =
vibrational modes to soften, increasing the vibrational entropy per atom
V
C V α κγ =
α = volume coefficient of thermal expansion
3 1
V B P
C Nk C T =
γ = Grüneisen constant κ = compressibility
1 3
P B
T Nk αγ − =
1 dV V dT α =
D D
d V dV γ Θ = Θ
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SLIDE 21 Can get around this with a Can get around this with a multilayer where at least
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Typical calibration of Au film resistance vs. T
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( ) ( ) P T r K qr lπ Δ = Λ
Solution for an infinite half-space
lπΛ
K0 is the zeroth order modified Bessel function Think of this as the circular thermal wave Take the Fourier transform of this frequency domain solution
SLIDE 28 For a low thermal conductivity thin film For a low thermal conductivity thin film
- n a high thermal conductivity substrate
(Factor of 2 because current is at frequency ω) (Factor of 2 because current is at frequency ω)
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Thermoreflectance Methods
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Measurement of Thermal Conductivity Part B: Time-domain thermoreflectance
David G. Cahill, Materials Research Lab and Department of Materials Science, U. of Illinois
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Time-domain thermoreflectance
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Time-domain thermoreflectance
Clone built at Fraunhofer Institute for Physical Measurement, Jan. 7-8 2008
SLIDE 43 psec acoustics and time-domain thermoreflectance
reflectivity depend on strain and temperature
acoustic properties or acoustic properties or film thickness
th l ti thermal properties
SLIDE 44 Schmidt et al., RSI 2008
modulated pump p p beam (fundamental Fourier component at frequency f) at frequency f)
- Evolution of surface
- Evolution of surface
temperature
time
SLIDE 45 Schmidt et al., RSI 2008
temperatures measured by time-delayed probe
measured by rf lock-in measured by rf lock in amplifier
SLIDE 46 Analytical solution to 3D heat flow in an infinite half-space, Cahill, RSI (2004)
- spherical thermal wave
- Hankel transform of
surface temperature
- Multiply by transform
- f Gaussian heat
source and take source and take inverse transform
- Gaussian-weighted
- Gaussian-weighted
surface temperature
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Iterative solution for layered geometries
SLIDE 48 Signal analysis for the rf lock-in
- In-phase and out-of-phase signals by series of sum and
difference over sidebands
- ut-of-phase signal is dominated by the m= 0 term
- ut of phase signal is dominated by the m= 0 term
(frequency response at modulation frequency f)
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Windows software
author: Catalin Chiritescu author: Catalin Chiritescu, users.mrl.uiuc.edu/ cahill/ tcdata/ tdtr_m.zip
SLIDE 50 Thermoreflectance data for isotopically pure Si p
- Two free fitting parameters
– thermal conductivity, 165 W/ m-K – Al/ Si interface conductance, 185 MW/ m 2-K
Phoenix, Arizona 11
SLIDE 51 Time-domain Thermoreflectance (TDTR) data for TiN/ SiO2/ Si
SiO2
TiN Si
depends on temperature temperature
the “effective” thermal conductivity
grown SiO2 layer
2
(interfaces not modeled separately)
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TDTR: early validation experiments
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Nothing really new...just faster and smaller
SLIDE 54 Thermal conductivity mapping
- At t= 100 ps
- At t= 100 ps,
– in-phase signal is determined by the heat capacity of the Al film capacity of the Al film – out-of-phase signal is mostly determined by the effusivity (ΛC) 1/ 2 of the substrate
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SLIDE 55 Thermal barrier coatings
ZrO2: Y coating on (Ni,Pt)Al bond coat on Ni based bond-coat on Ni-based super-alloy (Rene N5)
SLIDE 56 ZrO2: Y thermal barrier
500 th l l
between room temperature and engine p g
SLIDE 57 ZrO2: Y thermal barrier, depth profile
thermal waves is 100 nm
along a line to create a g depth profile
- dull but important result:
thermal conductivity is isotropic and homogeneous