Thermal Interface Material Thermal Interface Material Performance - - PowerPoint PPT Presentation

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Thermal Interface Material Thermal Interface Material Performance - - PowerPoint PPT Presentation

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Thermal Interface Material Thermal Interface Material Performance Measurement Performance Measurement Long Win Science & Technology Co., Ltd. www.longwin.com longwin@longwin.com 886-3-4643221 886-3-4986875 2007/07/16 Contents Contents

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SLIDE 1

Thermal Interface Material Thermal Interface Material Performance Measurement Performance Measurement

Long Win Science & Technology Co., Ltd. www.longwin.com longwin@longwin.com 886-3-4643221 886-3-4986875 2007/07/16

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SLIDE 2

Contents Contents

  • 2. Thermal Conductivity Measurement
  • 3. Contact Resistance
  • 4. Thermal Resistance (Impedance) Measurement
  • 1. Introduction Heat Transfer
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SLIDE 3

Contents Contents

  • 2. Thermal Conductivity Measurement
  • 3. Contact Resistance
  • 4. Thermal Resistance (Impedance) Measurement
  • 1. Introduction Heat Transfer
  • 1. Introduction Heat Transfer
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SLIDE 4
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SLIDE 5

LED Thermal Flow Path

P T T R

a J Ja

－ =

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SLIDE 6
  • A. Conduction
  • A. Conduction
  • B. Convection
  • C. Radiation

X T kA Qconduction ∂ ∂ − = &

) ( Ta Ts hA Qconvection − = &

) (

4 4

Ta Ts A Qradiation − = εσ &

) ( Ta Ts A h − =

Heat Transfer Mechanism

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SLIDE 7

Radiation

4

2500~100,000 Evaporate and condense

3

50~20,000 Liquid force convection

1

25~250 Force convection 2~25 Nature convection

Order Order h [w/m h [w/m2

2*

*℃ ℃] ] Type Type

h (Heat Transfer Coefficient)

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SLIDE 8

Thermal Resistance and Ohm’s Law

Electrical Resistance Voltage A Voltage B Current R = Voltage A - Voltage B Current

Units: Ohm

Thermal Resistance Temperature A Temperature B Power Dissipation θAB = Temp A - Temp B Power Dissipation

Units: °C/Watt

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SLIDE 9

Thermal resistance analysis

Tamb Tfin Tblock Thp1 Thp2 Heat Pipe TIM Tjunction

θj/bk ≤ 0.65 -------------- TIM, Contact θbk/hp1 ≤ 0.05 -------------- Bounding, Pipe θhp1/hp2 ≤ 0.02 -------------- Pipe θhp2/fin ≤ 0.05 -------------- Bounding, Fin θfin/amb ≤ 0.23 ~ 0.53 ---- Fan

Sink

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SLIDE 10

Components:

  • A. Cooler B. Pad / Grease
  • C. Power supply D. Interface card
  • E. LED thermal module …

System:

  • A. D/T PC B. N/B PC
  • C. Servo system D. Rack system
  • E. Projector …

Application

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SLIDE 11

Application

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SLIDE 12

Application

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SLIDE 13
  • a. Solid state structure
  • a. Solid state structure,

such as metal heat sink.

  • b. Fluid state structure
  • b. Fluid state structure,

such as: (a) heat pipe structure (b) compressor coolant structure

  • c. Liquid state structure
  • c. Liquid state structure,

such as water cooling structure.

Thermal Conduction Thermal Conduction

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SLIDE 14

L T T A K Q

c h −

=

Q：transferred heat K：thermal conduction coefficient of solid state zone

  • f substance

A：effective heat transfer area of solid state zone Th：temperature in high-temperature solid state zone Tc：temperature in low-temperature solid state zone L：sampling distance between high and low temperature solid state zones

Fourier Law Fourier Law

Not Easy for DT DT ＆ Thickness Thickness Measurement

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SLIDE 15

Heater Guard Heater Insulator H Tg H FORCE Insulator H Tm

T1 Upper Meter Bar T2

P Specimen

T3 Lower Meter Bar T4 T5 Reference Calorimeter T6

Cooling Unit Insulator

LVDT measure Thickness

TA TD

Follow ASTM 5470D Standard Follow ASTM 5470D Standard

ASTM (American Society for Testing and Materials)

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SLIDE 16

TL3 TL1

TL2

Tu Tm Tl

Qin

h

Qout

Ti1 or Ta Water cooling or air cooling module Thermal isolated material Thermal isolated material Td Tc

Qin = I × V

Heat Source

Cylinder with programmable loading

Ball joint (Gimble) to make sure contact surface pressure load uniform @ Upper and lower block with alignment fixture LVDT measure Thickness Specimen pad/grease

  • r grease

Longwin TIM Tester Scheme

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SLIDE 17

Longwin TIM Tester- 9091IR

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SLIDE 18

Longwin TIM Tester- 9091IR

Bond Line Thickness Effect Pressure Effect

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SLIDE 19

Longwin TIM Tester- 9091IR

Thermal Cycle Test for Reliability

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SLIDE 20

Contents Contents

  • 2. Thermal Conductivity Measurement
  • 2. Thermal Conductivity Measurement
  • 3. Contact Resistance
  • 4. Thermal Resistance (Impedance) Measurement
  • 1. Introduction Heat Transfer
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SLIDE 21
  • 1. Laser flash
  • 1. Laser flash (Transient)
  • 2. Hot disk
  • 2. Hot disk (Transient)
  • 3. Hot wire
  • 3. Hot wire (Transient)
  • 4. Heat flux
  • 4. Heat flux (Steady)

K K (

(Thermal Conductivity Thermal Conductivity） ）Measurement

Measurement

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SLIDE 22

⎥ ⎦ ⎤ ⎢ ⎣ ⎡ = s m C k

p 2

ρ α

α

ρ

p

C

= Thermal diffusivity = Density = Heat capacity

Length Velocity m s m s m × = × =

2

L V C × × =

1

α

X T A k Q ∂ ∂ − = &

Transient Steady state

K K Measurement Measurement

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SLIDE 23

Laser Flash Laser Flash

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SLIDE 24

Hot Disk Hot Disk

Thermal Insulation Hot Disk （Transient Plane Source Method, TPS）

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SLIDE 25

Heat Flux Heat Flux

ASTM 5470D ASTM 5470D

Heater Guard Heater Insulator H Tg H FORCE Insulator H Tm

T1 Upper Meter Bar T2

P Specimen

T3 Lower Meter Bar T4 T5 Reference Calorimeter T6

Cooling Unit Insulator

LVDT measure Thickness

TA TD

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SLIDE 26

Follow ASTM-5470 D

LW 9021D

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SLIDE 27

Longwin TIM Tester- 9091IR

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SLIDE 28

HOT FACE HEATER HOT FACE HEATER COLD FACE HEATER COLD FACE HEATER

Tu Tl Th Tg Heat flow (Q) d Copper surface plate Test sample Guard heater Heat flow transducer Copper surface plate

At thermal equilibrium :

Rs = N (Tl-Tu) / Q – R0

Where Rs = sample thermal resistance N = proportionality constant Tl = lower surface temperature Tu = upper surface temperature Q = heat flux transducer output R0 = constant thermal resistance

ASTM E1530

Heat Flux Heat Flux

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SLIDE 29

cooling

T6 T5 T4 T3 T2 T1

Heat Source Heat Flux thermal Isolate Material

Bar Material K Measurement

5 T 4 T 34 T 3 T 2 T 3 T 2 T 3 6 T 5 T 2 T 1 T = = = =

Fourier Law

X T KA q ∂ ∂ − =

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SLIDE 30

Fourier Law with ASTM-5470 D Thermal Guard concept, For steady state can be got k value.

Bar Material K Measurement

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SLIDE 31

Diamond 895-2300 Silver 429 Copper 386 Gold 317 Aluminium 237 Brass 120 Platinum 71.6 Iron 80.2 Lead 35.3 Quartz (273K) 6.8-12 Glass 1.35 Wood 0.04 Styrofoam 0.033 Wool 0.04 Silica aerogel 0.017 Air (100 kPa) 0.0262 Water 0.6062 Ice (273K) 2.2 Mercury 8.514

C M W

Table of Thermal Conductivity

(@ 298K)

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SLIDE 32

Contents Contents

  • 2. Thermal Conductivity Measurement
  • 3. Contact Resistance
  • 3. Contact Resistance
  • 4. Thermal Resistance (Impedance) Measurement
  • 1. Introduction Heat Transfer
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SLIDE 33

Thermal Contact Resistance = Rc_upper + Rc_lower Thermal Contact Resistance = Func.( roughness, pressure, temperature, material, TIM )

Contact Resistance Contact Resistance

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SLIDE 34

Surface Roughness Measurement

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SLIDE 35

Surface Roughness Measurement

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SLIDE 36

Surface Roughness Measurement

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SLIDE 37

0.45

20~35 20 4.4-4.5

Polish Al-Cu 0.83

10 20 4.4-4.5

Polish Al-Cu 0.18

15 20 1.3-1.4

Polish Al-Cu 0.24

5 20 1.3-1.4

Polish Al-Cu 0.48

20 20 1-2

Polish SS-Al 0.61

10 20 1-2

Polish SS-Al 2.78

20 20 20-30

Polish SS-Al 3.45

10 20 20-30

Polish SS-Al

Impedance

℃*cm2/w

Pressur e MPa Temperature

℃

Roughnes s μm Surface Different Metal Contact Resistance

(From Holman, Ref.12, and Kreith and Bohn, Ref.16)

Table of Contact Resistance

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SLIDE 38

0.88

0.7~7 30 0.25

Polish Copper (vacuum) 0.07

1.2~20 20 1.27

Polish Copper 0.18

1~5 20 3.81

Polish Copper 0.88

1.2~2.5 150 2.54

Polish Aluminium 2.63

0.3~2.5 90~200 2.54

Polish 416 Stainless Steel 5.26

4~7 20 1.14

Polish 304 Stainless Steel

Impedance

℃*cm2/w

Pressure

MPa

Temperature

℃

Roughness

μm

Surface Same Metal Contact Resistance (From Holman, Ref.12, and Kreith and Bohn, Ref.16)

Table of Contact Resistance

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SLIDE 39

Contact Resistance v.s. Pressure

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SLIDE 40

Contact Resistance Measurement

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SLIDE 41

Contents Contents

  • 2. Thermal Conductivity Measurement
  • 3. Contact Resistance
  • 4. Thermal Resistance (Impedance)
  • 4. Thermal Resistance (Impedance)

Measurement Measurement

  • 1. Introduction Heat Transfer
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SLIDE 42

Definition of Thermal Resistance

A Q T T I

2 1

× − =

Q T T R

2 1 −

=

T1 T2 L Area = A

A Q T T I

2 1

× − =

Q T T R

2 1 −

=

L T T A K Q

c h −

=

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SLIDE 43

Ta

Heat Source Meter Bar

Tc Tl

thermal isolated material

Qin

Fan Cooler Module Air flow rate & flow pattern Qout

Tm Tu

Heat loss Qine = I × V

CPU Cooler Thermal Resistance

  • ut

c

Q －Ta T R =

L T T A K Q

c h −

=

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SLIDE 44

Heat Flux Power

1.Meter Bar Size：

  • a. 31 × 31 mm
  • b. 37 × 37 mm
  • c. 25.4 × 25.4 mm
  • d. User define
  • 2. Power Supply：
  • a. 180W
  • b. 300W
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SLIDE 45

DT Cooler Module Test NB Cooler Module Test

Test Application

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SLIDE 46

Q T T R X Tu T KA Q X T T T T X Tu T T T

d c 3 2 L2 L1 L1 d 1 u c

− = − ⋅ = − + = − − = l l

TL3 TL1 TL2 Tu Tm T

Qinh

heat loss

P

Qouth

Ti1

water cooling or air cooling thermal isolated material specimen /pad

  • r grease

thermal isolated material Td Tc

Qine = I × V

Heat Source

TIM Thermal Resistance

PAD / Grease

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SLIDE 47

TIM Test Section-9091IR

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SLIDE 48

LED Thermal Resistance

P T T R

a J Ja

－ =

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SLIDE 49

LED Junction Temperature Measurement

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SLIDE 50

LED Graphite Heat Spreader

Graphite Sheet Copper Base Mount LED Temperature Sensor

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SLIDE 51

TIM Research Equipments

  • A. Interface material

Liquid state Solid state Phase variation LW-9021D LW-9091IR Combined Material

Thermal Lab Apparatus

  • B. Interface

relationship Surface Roughness Load Pressure 3-dimension microscope Non-shape-changing material (Load Cell) shape-changing material

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SLIDE 52

Thank You