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Material Properties Design Considerations Fabrication Assembly Tips Questions
Material Design Fabrication Properties Considerations Assembly - - PowerPoint PPT Presentation
Material Design Fabrication Properties Considerations Assembly - - PowerPoint PPT Presentation
Material Design Fabrication Properties Considerations Assembly Tips Questions Whenever two materials have different coefficients of thermal expansion, temperature changes create mechanical stress. The mechanical stress will cause PCB
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Whenever two materials have different coefficients of thermal expansion, temperature changes create mechanical stress. The mechanical stress will cause PCB reliability issues.
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Simulate Estimate
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IPC 2152 IPC 2221
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°C | Amperes | mils | Ounces/Foot2
UltraCAD.com/articles/pcbtempr.pdf
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Electroplating Etching
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- Etching is hard!
- Heavy copper internal layers
- Require high-resin prepreg
- Heavy copper outer-layers
- Uneven board
- Difficult to Silk-screen
- Difficult to Solder-Mask
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- Heavy Copper Conducts Heat Too Well
- Custom reflow profiles
- Hand Soldering
- Rework Nightmare
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2 oz 1 oz 1 oz 2 oz
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Heavy Copper Stackup Specifications
Q: How do I specific heavy copper in my stackup? Should I tell my fabricator that I want 2 oz. plated up to 3 oz. or let the board shop decide?
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Embedded Copper / Bus Bar
Q: When would you recommend a bus-bar or embedded copper instead of heavy copper?
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Trace and Space Minimums
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