LED Back Light Cooling for Display Back of Display Display Heat - - PowerPoint PPT Presentation

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LED Back Light Cooling for Display Back of Display Display Heat - - PowerPoint PPT Presentation

LED Back Light Cooling for Display Back of Display Display Heat Pipe Heat Sink LED Back view of Meter Panel Front view of Meter Panel Thermal performance Plate Heat dissipation 10W Fin (Attached LED) LED temp. < 90oC at ambient 65oC


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SLIDE 1

LED Back Light Cooling for Display

Front view of Meter Panel Back view of Meter Panel Display Back of Display Heat Pipe Heat Sink LED

Heat Pipe Heat Sink Fin Heat Pipe Plate (Attached LED) Thermal performance Heat dissipation 10W LED temp. < 90oC at ambient 65oC under natural convection condition Advantage 1) Silent (no fan) 2) High reliability (no fan)

1

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SLIDE 2

LED Head Lamp Cooling

Heat pipe (heat dissipation to frame) Thermal performance Heat dissipation 15W LED temp. < 90oC at ambient 40oC under natural convection condition Advantage 1) High performance 2) High reliability (no fan) Frame Heat sink

LED Head Lamp

2

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SLIDE 3

LRU Cooling in Aircraft

LRU unit example

Individual LRU packed in cabinet

Air flow by use airplane air cooling system or in-built fan

Cooling concept development example 1

Electronic boards Heat sink LRU module Heat pipe

Cooling concept development example 2

Heat pipe

  • Heat pipe transfer heat

to chassis for cooling

  • Remote heat exchanger.

Heat pipe transfer heat to heat exchanger outside of box.

Cooling concept development example 3

Heat pipe Heat sink

Advantages:

  • Passive cooling, no

moving parts, reliable.

  • Higher heat transfer.
  • Robust design, low form

factor.

3

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SLIDE 4

Vapor Chamber Base (4mm Thk.) Solder (0.15mm Thk.) Copper(0.3mm Thk.) Ceramic (0.6mm Thk.) Copper(0.3mm Thk.) Casing IGBT Die (0.2mm Thk) Solder (0.15mm Thk.) Cover Silicon gel (optional)

Cooling IGBT

DC/DC Inverter for Motor Speed Control

Cooling of Power Semiconductor- Smart Grid

Cold Plate

4

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SLIDE 5

Base: A1100, 700 x 330 x 20mm Fin: A1100, 700 x 150 x 0.5mm, Pitch 9mm, 51pcs Heat Pipe: D15.88 x 19pcs

Air Cooled Heat Pipe Heat Sink for IGBT

700 400 510

Cross-section of HP

5

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SLIDE 6

Examples of some heat sinks for semiconductor power device

Heat pipe with ceramic insulator joints for cooling high power (kW) thyristor. Metal saw machining technology can produce any size and shape heat sinks.

6

IGBT and Semiconductor Power Devices

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SLIDE 7

Vapour Chamber

7

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SLIDE 8

CPU

For Blade Server

MCM 1 KW Vapor Chamber Vapor Chamber for 2U-4U Server Fins Copper-Water Vapor Chamber

For Blade Server

Substrate TIM Captive Hardware

Vapor

Vapor Chamber Heat Sinks for Server

8

Two dimensional heat flow

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SLIDE 9

Heat Pipes Copper Fins Vapor Chamber Base

Heat In Heat Out

Vapor Chamber Heat Pipe Fins

Vapor Flow Liquid Flow

0.160 0.180 0.200 0.220 0.240 0.260 0.280 0.300 20 25 30 35 40 45 Air Flow [CFM] Rca [oC/W] Design VC+HP (Test Results) Design VC+HP (Calculation) Solid Base (Calculation)

250W GPU

Thermal performance of Vapour Chamber + Heat Pipes

Vapour Chamber + Heat Pipes for Graphic Chip

9

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SLIDE 10

Ultra Thin Vapour Chamber

 Ultra thin  High heat dissipation capability

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SLIDE 11

Loop Heat Pipe

11

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SLIDE 12

Distinguishing features: ① Porous structure only in evaporator ② Transport lines made from bare tube ③ Separated liquid & vapour flow 1 2 3 4

Evaporation Heat transfer by vapour Condensation Liquid transport by capillary effect

Operating Principle

Evaporator Wick Condenser Liquid Heat Source Heat Sink Vapour Flow Container Liquid Flow

1 3 4

Liquid line Condenser Vapour channel Liquid reservoir Wick Evaporator (grooved tube) Vapour line Vapour channel (grooved portion) Heat input Heat output

1 2 3 4

Loop Heat Pipe: Concept

Loop Heat Pipe Advantages: ① High heat flux capability ② Long distance heat transfer ③ Orientation independent operation

12

Wick

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SLIDE 13

Evaporator + compensation chamber (liquid reservoir) Condenser (different configurations possible) Vapour line Liquid line Liquid flow Vapour flow Wick Liquid reservoir Vapour flow channels Bayonet tube (for uniform liquid distribution inside wick core)

Loop Heat Pipe Design and Working

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SLIDE 14

Why Loop Heat Pipe ?

High heat transfer capability Longer distance heat transport Orientation independent operation No leakage issues (safe system) No moving parts (reliable & powerless system) Smaller system volume (two phase system) High system performance at high heat loads

14

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SLIDE 15

Loop Heat Pipe: Application Areas

15

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SLIDE 16

Vehicle Thermal Management

16

Vehicles

Ground Transport: Automotive Air Transport: Aircraft

 High heat load  Long distance heat transport  Variable Orientation  Acceleration & Vibrations Issues  Multiple heat sources

Challenges

 Thermal Control (Cooling/Heating)  Energy Conservation

Objectives

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SLIDE 17

Aviation Applications

Galley Heating Wing Anti Icing Engine Anti Icing DM-Fuel Cell Cooling

Co-generation (Power + Heat) System

CPC Rack LRU

Thermal control: Heating Thermal control: Cooling Interior Exterior 1 2 3

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SLIDE 18

Load d cabine net (Gal alley ey ) LHP Conden enser ser Fuel cell stack ack LHP Evapo porat ator

  • r

Vapour ur chamber amber or heat at sprea eade der with h heat at pipes s Vapour ur line

~

Elect ctric c Output utput

Water purifier Fuel supply syste tem

Portab able e water er Fuel in By By-product products s out Liquid d line Air in Air out

LHP-DMFC Cogeneration System

Heat t exch changer Cold ld wate ter In Hot t wate ter r Out 18 > 1 m

Specifications: Large scale Heat load: 0.5 – 1 kW Distance: > 1 m

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SLIDE 19

Existing Anti Icing System

Hot air bled from the engine compressor Air exhausted Internal swirl

Engine Anti Icing

Heat required: 5.75 kW/m

Wing size: B737 (Small plane): 9 m B777(large plane): 20 m

19

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SLIDE 20

LHP based Ice Protection System

Heat transfer distance: 5 m Q = 2 x 6.9 = 13.7 kW 510 mm 45 mm 175 mm Gravity LHP Evaporator Liquid reservoir LHP System Liquid line Vapour lines vapour from evaporator Liquid to evaporator Leading edge Leading edge Loop heat pipe condenser Vapour line Liquid line

Condenser details

20

Specifications: Large scale Heat load: 0.5 – 1 kW Distance: > 1 m

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SLIDE 21

Condenser plate Vapour line Liquid line Heat spreader Evaporator

CPC Rack Cooling

Nickel or Titanium wick Charging line Tube connector Heat spreader Liquid chamber From liquid line From vapour line Bayonet tube 10 mm 150 mm

Specifications: Small scale Heat load: 30 – 50 W Distance: 100- 150 mm

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SLIDE 22

Automotive Applications

22

Battery Cooling  Heat load: 0.5 – 1 kW  Distance: 0.25 – 1 m LED Headlamp Cooling  Heat load: 25 – 50 W  Distance: > 150 – 250 mm

Spreader plate LHP Condenser LHP Evaporator Battery Stack Heat Pipes Loop heat pipe prototypes Loop heat pipe prototype

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SLIDE 23

Condenser Liquid line Vapour line 1000 mm Evaporator

Nickel wick with copper evaporator tube

Wick installed inside evaporator

Loop Heat Pipe Prototype

Evaporator Internal Details

Ungrooved CC section Grooved evaporator portion Nickel wick Copper tube

23

250 mm

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SLIDE 24

Cylindrical Evaporator: Performance Results

 Copper-water LHP with Nickel wick  Horizontal heat mode  50% charge ratio  Heated length: 55mm (20 W/cm2)

0.11 0.13

Variable conductance Constant conductance 24

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SLIDE 25

Orientation Tests

25

Horizontal heat mode Top heat mode

0.5 m 0.25 m 1 m 1 m THM 0.5 m THM 0.25 m THM Horizontal HM 40 50 60 70 80 90 100 100 200 300 400 500 600 Evaporator Temperature, °C/W Heat Load, W

0.0 0.5 1.0 1.5 2.0 2.5 100 200 300 400 500 600 Total Thermal Resistance, °C/W Heat Load, W

Loop heat pipe was able to transfer > 500 W at any orientation with heat source temperature < 100 ºC