GSTP – ASCMSA Analog Silicon Compiler for Mixed Signal ASICs Group 4 – Development of Microcamera Integrated Radiation-tolerant Imaging System Werner Ogiers FillFactory NV Schalienhoevedreef 20B B-2800 Mechelen www.FillFactory.com GSTP/ASCMSA/Integrated Radiation tolerant Imaging System – Final Presentation – ESTEC, 7 March 2001 1
Contractors • 1997 – 2000 • Originally IMEC Image Sensor Group • Since 12/1999 partly by FillFactory – IMEC spin-off for CMOS imagers – transfer of all people/patents to new company – based in Mechelen, Belgium – activities • custom and off-the-shelf CMOS camera chips • studio digital photography • high-speed imaging • industrial vision • aerospace GSTP/ASCMSA/Integrated Radiation tolerant Imaging System – Final Presentation – ESTEC, 7 March 2001 2
Overview • Objective: one-chip camera • Challenges, choices • Specifications, architecture • Prototype • Evaluation • Final implementation • Evaluation • Conclusions and future plans GSTP/ASCMSA/Integrated Radiation tolerant Imaging System – Final Presentation – ESTEC, 7 March 2001 3
Objective, SOW … to design, develop, fabricate and test a novel microcamera chip, to be used as a monitoring camera for space applications with as few components as possible. … based on CMOS technology … allows for easy co- integration of … control logic … ADC … interfaces, and on the long term image compression circuitry � IRIS Integrated Radiation tolerant Imaging System GSTP/ASCMSA/Integrated Radiation tolerant Imaging System – Final Presentation – ESTEC, 7 March 2001 4
Space Applications for CMOS APS • Target: low-end – Visual SC monitoring – Landers and rovers this contract – Robotics • Feasible: – Optical navigation TRP:ASCoSS (12227/96/NL/SB) GSTP/ASCMSA/Integrated Radiation tolerant Imaging System – Final Presentation – ESTEC, 7 March 2001 5
Overview • Statement of work: one-chip camera • Challenges, choices • Specifications, architecture • Prototype • Evaluation • Final implementation • Evaluation • Conclusions and future plans GSTP/ASCMSA/Integrated Radiation tolerant Imaging System – Final Presentation – ESTEC, 7 March 2001 6
IRIS Challenges • Integrated: CMOS APS + logic – CMOS imagers immature – no mixed-signal experience • Radiation tolerant: CMOS reputation – zero knowledge – trust technology • Imaging System – choice of two CMOS APS styles • direct readout • integrating GSTP/ASCMSA/Integrated Radiation tolerant Imaging System – Final Presentation – ESTEC, 7 March 2001 7
Technology? Direct readout • Direct readout CMOS Active Pixel Sensor • IMEC’s FUGA15 used on Teamsat • Photo-current though resistor => V(t) • Non-linear R => wide dynamic range • No blooming • Static offsets => correct with LUT LUT processed image • No single-chip solution R V=R.I(t) I(t) raw image GSTP/ASCMSA/Integrated Radiation tolerant Imaging System – Final Presentation – ESTEC, 7 March 2001 8
Technology? Integrating • Integrating CMOS APS • ~ CCD, ~film • Exposure: photocurrent on C • Readout: C to V • (Correlated) Double Sampling • Cosmetically ‘perfect’ • Little experience – IBIS1 sensor (1997) V= ∑ I(t) I(t) raw image GSTP/ASCMSA/Integrated Radiation tolerant Imaging System – Final Presentation – ESTEC, 7 March 2001 9
Choices • Integrating CMOS APS – IBIS1 architecture – Larger area: 640 x 480 14µm pixels – ADC – Logic • Radiation hardening? – None – Applying known rules would explode chip area • Chip integration? – Sensor core unknown – First two-chip prototype => Conservative approach: 2 stages GSTP/ASCMSA/Integrated Radiation tolerant Imaging System – Final Presentation – ESTEC, 7 March 2001 10
Phase 1 flow System and chip specification Two-chip solution: IRIS1 imager with control FPGA Flight demonstration: VMC/IRIS1 on XMM, Cluster-II, … GSTP/ASCMSA/Integrated Radiation tolerant Imaging System – Final Presentation – ESTEC, 7 March 2001 11
Phase 2 flow IRIS2 single-chip camera IRIS2 electro-optical and radiation characterisation Demonstration microcamera GSTP/ASCMSA/Integrated Radiation tolerant Imaging System – Final Presentation – ESTEC, 7 March 2001 12
Overview • Statement of work: one-chip camera • Challenges, choices • Specifications, architecture • Prototype • Evaluation • Final implementation • Evaluation • Conclusions and future plans GSTP/ASCMSA/Integrated Radiation tolerant Imaging System – Final Presentation – ESTEC, 7 March 2001 13
Camera Specifications Desired IRIS proposal (technical limits in 1997) Resolution > 512x512 640x480 Frame rate 25Hz (video) 9Hz ADC > 8 bit 8 bit Radiation Tolerant ??? Readout Windowing, Windowing, subsampling, … subsampling, … Interfaces SC CCSDS packets compatible Various parallel and serial IFs Sensitivity Mv=5 stars Slightly less (ASCoSS: Mv=5) Power-save Yes No On-chip line Yes No drivers GSTP/ASCMSA/Integrated Radiation tolerant Imaging System – Final Presentation – ESTEC, 7 March 2001 14
IRIS Functionality Readout Full frame, One window of interest, Y-subsampled 1,2,4,8, X-subsampled 1,2,4,8, X-binned 1,2,4,8, Y-interleaved 1,2,4,8 Frame rate Full frame ~9Hz Windowed pro rata e.g. 320 x 240 x 36Hz TC/TM protocol ESA-style CCSDS Command interfaces RS-485-style ..3.125Mb/s Sync serial Sync parallel (bus) Data interfaces RS-485-style ..12.5Mb/s Sync serial ..12.5Mb/s Sync parallel ..3.125MB/s Commanded operation Yes Autonomous operation Start up and take stream of images Exposure control Manual (TC needed); limited automatic control loop Remote control 8 programmable output lines Remote signal sensing 3 analogue input channels GSTP/ASCMSA/Integrated Radiation tolerant Imaging System – Final Presentation – ESTEC, 7 March 2001 15
Not Included/Missing • Image memory – over 300 kB needed • Support for external memory – pin limited • Synchronous ‘snap shot’ shutter – requires larger pixel – result: ‘rolling blade’ electronic shutter => Imaging rate = output data rate GSTP/ASCMSA/Integrated Radiation tolerant Imaging System – Final Presentation – ESTEC, 7 March 2001 16
IRIS Chip Architecture 640 x 480 pixel array and double sampling column amplifiers Analogue path: •Multiplexer •Amplifier Control logic: •ADC •Image sequencer •I/O interfaces •CCSDS packetiser GSTP/ASCMSA/Integrated Radiation tolerant Imaging System – Final Presentation – ESTEC, 7 March 2001 17
IRIS Pixel Architecture • Patented ‘well pixel’ uses bulk of silicon to trap photo- electrons – Near-100% fill-factor: only metal-covered area is blind – Increased sensitivity – Increased NIR sensitivity: use filter – Risk for inter-pixel crosstalk – Risk for local blooming-like effects GSTP/ASCMSA/Integrated Radiation tolerant Imaging System – Final Presentation – ESTEC, 7 March 2001 18
Typical Application Telesense Inputs Thermistor IRIS Camera-on- a-Chip Lighting Remote Control Bus Pan and Tilt Motor Sync Parallel IF Sync Serial IF Packet Telecommand Data Acquisition System with Decoder Memory GSTP/ASCMSA/Integrated Radiation tolerant Imaging System – Final Presentation – ESTEC, 7 March 2001 19
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