for ICT Products: A Simpler Approach Thomas Okrasinski, P.E. Nokia - - PowerPoint PPT Presentation
Quantifying Environmental Life Cycle Impacts for ICT Products: A Simpler Approach Thomas Okrasinski, P.E. Nokia Bell Labs tom.okrasinski@nokia-bell-labs.com Marc Benowitz, Ph.D. iNEMI marc.benowitz@inemi.org 1 Outline / Agenda
Thomas Okrasinski, P.E. Nokia Bell Labs tom.okrasinski@nokia-bell-labs.com Marc Benowitz, Ph.D. iNEMI marc.benowitz@inemi.org
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◼ Motivation ◼ Life Cycle Assessment (LCA) Principles ◼ LCA Estimator Methodology ◼ Examples ◼ Summary / Next Steps ◼ Q & A
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Australia Southern Africa Alaska
Bering Sea Appears Largely Ice-Free from NOAA-20
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2002 2007 2020
0.5 0.8 1.4
Potential ICT equipment energy savings by 2020
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Gigatons CO2
Zero Growth Line
ICT today: about 2% of global greenhouse gas emissions
An opportunity for tremendous impact on remaining 98%
ICT can enable a 15% reduction in global emissions by 2020* Enabling applications examples
▪Smart utilities ▪Smart transport ▪Smart buildings ▪Smart industry
Smart 2020: Enabling the low carbon economy in the information age (GeSi/The Climate Group)
2008
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Enhanced ICT Growth and Impact:
◼ Linear → >6% Global GHGE by 2040 ◼ Exponential → > 14% GHGE by 2040 ◼ Smart Phones
17-125 Mt CO2e in 10 years (> 7X increase) short 2 year life → manufacturing drives impact smart phone growth 5.6B (2030) – 8.7B (2040)
◼ ICT Infrastructure
159 - 495 Mt CO2e in 10 years (> 3X increase) primarily driven by data centers growth
2020 thru 2040
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Impact Assessment Categories - Examples
Global Criteria
Regional Criteria
Local Criteria
Other Criteria
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Eco Impact / LCA quantification:
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Companies, customers, analysts, legislators, NGOs want it
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Gauge progress, measure impacts / benefits, assess eco-opportunities
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But…
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Eco-impact LCAs are complex and data / time demanding
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Data gaps & method inconsistencies → apples vs oranges
LCA / Eco-Impact Challenges
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Scope
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Four major life cycle stages for ICT products
Raw Materials Extraction; Intermediate Components and Sub-assemblies Manufacturing Intermediate Transport and Assembly of ICT Product Final Transport, Distribution, and Installation of ICT Product Use and Servicing of ICT Product Takeback, Recycling, final disposition of ICT Product Total Eco Footprint Embodied Eco Footprint Operational Eco Footprint Manufacturing Stage Transport Stage Use Stage End-of-Life Stage 9
▪ Eco-impact Assessment of ICT Products
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Methods and data are similar for most classes of products
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~ 90% of parts have common application in ICT product types
▪ Goals/Approach
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Simplified processes to more easily derive eco-impact information
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Categorize targeted components (that produce the dominant eco-impact)
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Provide a reasonable accuracy - suited to ICT industry’s needs
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Provide a means for continuous improvement → relative to continuing technological developments
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Component Categorization
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ICT – Common Component Groups
Printed Wiring Boards (PWBs) Integrated Circuits - including semiconductor devices Electro–Mechanical Components - fans, motors, etc. Metals / Metallic Mechanical Components - cabinets, frames, structural parts, heat sinks, etc. Polymeric Mechanical Components - plastic parts Displays - electronic display / imaging devices Power Supplies Large Capacitors Batteries Cables - signal, RF, power cords, wires, optical fiber
ICT - Specialized Component Groups
Optical / Opto-electronic Devices - laser amplifiers, etc. Radio Frequency Components - power amplifiers, antennas, etc. Disk Drives Camera Devices - CCDs, etc. Copier Components - photoreceptor drum, fuser, laser scanning unit, toner cartridge, printer head, ink cartridge Other – Lamps, Crystals, Polarized Glass
Component groups with similar materials and manufacturing processes
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Component Type Eco-impacts
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Bare Printed Wiring Boards (PWB) ▪ Rules / Parameters / Criteria:
❑ Size (sq. cm) ❑ Layers (#) ❑ Single vs. double sided ❑ Surface finish (e.g. ImSn, ImAg, ENIG) ❑ Board material (FR4, etc)
▪ Algorithm:
❑ Simple summation model ❑ Pattern Recognition / Regression Analysis
GWPPWB = AB [α + (β SF) + (γ BL)]
Where: AB is the area of the PWB α is the “intercept” coefficient β is the “PWB surface finish type” coefficient SF is the PWB surface finish type γ is the “PWB layer” coefficient BL is the number of layers in the PWB
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Large Integrated Circuits (ICs) ▪ Rules / Parameters / Criteria:
❑ Package Type (e.g. BGA,,PLCC, QFP, TQFP) ❑ Inputs / Outputs (pin count)
▪ Algorithm:
❑ Simple summation model ❑ Pattern Recognition / Regression Analysis
GWPIC = NIC [α + (β IT) + (γ CIO)]
Where: NIC is the number of ICs in this classification α is the “Intercept” coefficient β is the ”IC classification type” coefficient IT is the IC classification type (current range: e.g., PLCC → IT = 1; BGA → IT = 2; QFP → IT = 3; TQFP → IT = 4) γ is the ”IC pin count” coefficient CIO is the number of input / outputs for the IC type
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Eco-impact of Manufacturing Stage
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Contribution of components, sub- assemblies, cabinets and packaging materials + Intermediate Transports + ICT Assembly Processes + Software Development + ICT Product Testing + Packaging Process * For estimation simplicity: factors may be applied for the process steps (in blue) Surface Mounting Process Thru- hole Mounting Process Circuit Pack Assembly Process ICT Product Assembly Process Bare PWBs & Components ICT Subassemblies Cabinets, Frames, Chassis ICT Product Testing Process ICT Product Packaging Process
Finished ICT Product
Packaging Materials Software/Firmware Load 15
▪ Rules / Parameters / Criteria
❑ Location of final product assembly (nodal point – by region) ❑ Location of product integration center / warehouse (nodal point – by region) ❑ Location of final product installation (nodal point – by region) ❑ Final product shipping weight ❑ Transport mode – surface / air ❑ Transport mode GWP factors (per kilogram of shipped product weight per kilometer traveled) Additional factors to be considered include: ▪ Transportation equipment used ▪ Fuels used ▪ Transport load factor ▪ Empty return rate for transport means
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▪ Rules / Parameters / Criteria:
❑ Location where product is used – by region ❑ Power consumption – per typical product configuration and feature set ▪ Function of product usage (e.g. active, idle / sleep modes, etc.) ▪ Include power to cool equipment internally and externally ❑ Power usage per annum – this can be an average daily power usage based on a typical pattern
❑ Product operating life (e.g., typical operating life or design life) ❑ Servicing – eco-impact associated with servicing of ICT product (may be significant, e.g. network equipment) → estimate as a factor
Product Type On Mode Standby Mode Off Mode Avg Lifetime Hours/Year Hours/Year Hours/Year Years Laptops 2,628 876 5,256 4 Desktops 4,380 1,095 1,095 6 Router 8760 5 Wireless base station 7008 1752 10 Optical switch (Central Office) 8760 20
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▪ Rules / Parameters / Criteria (Simplistic Approach): ❑ Breakdown of product into its constituent components and materials – e.g., circuit boards, frames / chassis, metals, polymers, etc. ❑ Conversion factors for eco-impacts of recycling operations for constituent materials – examples:
▪ PCs - Europe: 70% recycling & incineration / 30% landfill (e.g. WEEE requirements) ▪ LAN & Office Telecom: switches / servers - 80% recycling & incineration / 20% landfill ▪ Telecom Networks: routers, telepresence, fixed line network interface - 90% recycling & incineration / 10% landfill
❑ End-of-Life GHG factors – includes de-installation, transport to recycling facility / disposal site
▪ Full recycling (w/ integration back into raw materials extraction / intermediate mfg) ▪ Incineration (w/ energy recovery) ▪ Landfill (w/ landfill gas energy recovery)
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Circa 2012
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Examples (circa 2012)
Full life cycle eco-impact profile - PCF ▪ Equipment types can be aggregated into network / system configurations for further eco-impact assessment ▪ Lifecycle Stage impacts vary greatly
Total PCF: 20,000 kg CO2e Total PCF: 800 kg CO2e Total PCF: 100 kg CO2e
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❑ Measuring eco-impact of ICT products is imperative for determining direct impact and enabling effects ❑ LCA estimation approaches can employ commonalities of ICT components and key parameters (hot spot analysis) for simplifying ICT product eco-impacts ❑ LCA estimator proof-of-concept tool provides LCA practitioners with a means to assess GHG emissions of ICT products over their full life cycle – manufacturing, transport, use, and end-of-life treatment ❑ Members of ICT industry are collaborating on LCA data collection and tools development (e.g. iNEMI, PAIA) and measurement / reporting standards (e.g. ITU, GHG Protocol)
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▪ iNEMI LCA Eco-impact Estimator Project (Phase 3)
❑ Eco-impact estimator ported to a hosted environment (Purdue Univ.) ❑ Update life cycle eco impact data for key component categories / technology advances – e.g. PWBs, ICs, cables, mechanical parts ❑ Expand eco-impact to additional aspects, e.g. water resource depletion ❑ Longer term: model available for broader industry use with governance ❑ Additional participants/contributors encouraged
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