SLIDE 1
18TH INTERNATIONAL CONFERENCE ON COMPOSITE MATERIALS
1 General Introduction Polymer composites incorporating ferroelectric and piezoelectric particles, randomly distributed within the polymer matrix, are considered as a novel class
- f engineering materials. The electrical response of
these hybrid materials can be suitably adjusted by controlling the type and the amount of the ceramic
- inclusions. Modern electronic devices require new
high dielectric permittivity materials with enhanced dielectric strength [1-3]. These materials are expected to address the engineering demands for suitable dielectric properties and exhibit improved mechanical strength and ease processing at a relative low cost. Ceramic-polymer composites can be used in various applications including integrated capacitors, acoustic emission sensors, smart skins and leakage current controllers [1-4]. In this study, ceramic fillers and carbon materials are used as epoxy reinforcements resulting in composites with enhanced dielectric, electrical, and thermo-mechanical properties. The carbon fillers used are carbon black [CB], vapor grown carbon fibers [VGCF] and exfoliated graphite nanoplatelets [xGnP]. Possible synergy on the composites performance between ceramic and carbon fillers is also investigated by fabricating and characterizing composites containing both ceramic and carbon fillers at various ratios. 2 Experimental 2.1 Materials The polymer used is a low viscosity epoxy resin with the trade name Araldite LY 564 and curing agent Aradur-HY2954 both provided by Huntsman Advanced Materials. The ceramic reinforcement is BaTiO3 powder of two sizes. One with mean particle diameter less than 2 μm and another with mean particle diameter in the range of 30-50 nm both supplied by Sigma Aldrich. The carbon fillers used are: i) nano-size high structure carbon black (CB) with mean particle diameter in the range of 40-50 nm (KETJENBLACK EC-600 JD), provided by Akzo Novel Polymer Chemicals LLC, ii) vapor grown carbon fibers (VGCF) with mean particle diameter less than 150 nm (Pyrograf III, PR-19 PS grade), supplied by Pyrograf Products, Inc., and iii) exfoliated graphite nanoplatelets (xGnP-1) with mean particle diameter less than 0.1 μm and an average thickness of 10-20 nm supplied by XG Sciences (East Lansing, MI). 2.2 Fabrication of Composites The dispersion of the BaTiO3 in the epoxy took place in a dissolver device (VMA Getzmann GmbH). The compound was stirred in a vacuum container to avoid air entrapment. During processing the temperature was increased up to 60 oC to facilitate the filler wetting by the epoxy. The compound was placed in a sonic bath for 20 min to enhance further the dispersion quality by breaking any remaining agglomerations. The above process was used to produced a BaTiO3-epoxy master-batch compound with a content of 20 phr (filler parts per hundred epoxy parts) BaTiO3. Dilution down to 5 and 10 phr was used to produce composites with different filler content. Both sizes of BaTiO3 powder were used. The filler-epoxy solution was purred in to a mold and cured at T=80 oC for 1 hour followed by post curing at T=100 oC for 4 hours. Alternatively, a second fabrication method was used. In order to avoid agglomeration the filler powder (ceramic or carbon) was mixed with isopropyl alcohol (IPA) using a sonication probe (misonix 4000) for 40 minutes at 40% amplitude. The agglomerate free powder, collected after the removal
- f IPA through filtration, was mixed at room
temperature with the proper amount of monomer
DIELECTRIC BEHAVIOR AND THERMO-MECHANICAL PERFORMANCE OF BATIO3 REINFORCED AND CARBON REINGORCED EPOXY COMPOSITES
- A. C. Patsidis1,2, G. C. Psarras2, K. Kalaitzidou1*
1 Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, USA, 2 Department of Materials Science, University of Patras, Patras, Greece