RTP Company Overview of LDS Technology Brice Filipczak October - - PowerPoint PPT Presentation

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RTP Company

Overview of LDS Technology Brice Filipczak October 2016 - SIANE

RTP Company is an independent, privately owned thermoplastics compounder with global manufacturing, engineering support, and sales representation.

• 1,500+ employees
• $500+ million annual sales
• RTP Company operates 18 plants in America, Asia and Europe

ABOUT RTP COMPANY

High-Tech Compounds to Unfilled Resins

• 60+ resins
• 100s of modifiers
• Broadest range of

competitive compounds

(From talc polypropylene to nanotube PEEK)

Annual Production

• 6,000+ commercial

products

• 1,750+ new products

per year

CUSTOM SOLUTIONS

SELECTIVE PLATING LASER DIRECT STRUCTURING

6,5 mm 3,5 mm

Advantages

• Standard single shot

tooling

• Great design flexibility
• Specialized

formulations

• Limited number of

platers/lasers

THERMOPLASTICS TRIANGLE

Amorphous Semi-crystalline High Performance Thermoplastics Engineering Thermoplastics Commodity Thermoplastics

PEEK PEI PPS PES PPA PSU PC PET PA 66 PC/ABS PBT PA 6 PPO PTT PMMA ASA ABS PC/PBT POM SAN PS PVC LDPE PP HDPE LLDPE

LDS PROCESS

Additive Process Selective metallization of thermoplastic injection molded parts by Laser Direct Structuring 3 Step Process 1.Injection molding 2.Laser activation 3.Selective metallization

OVERVIEW OF LDS TECHNOLOGY

Generation of a micro-etched surface

Modified Polymer Activated Additive by Laser

APPLICATIONS

• Connectors
• Sensors
• Antennas for

handheld devices

– Phones – Cameras – GPS

• Security Covers
• Various components

for part consolidation

APPLICATION 1: OMNIPOD CHASSIS “We had challenges plating the chassis, which was a second shot to the lower housing without

• verstating the first shot,” said
• Clare. “RTP Company’s compound

gave us better control of the plating process by providing a wider processing window. This ability to tailor materials ideally suited to our needs is what will help make the OmniPod successful.”

OmniPod has been successful with Insulet receiving multiple awards, such as the 2006 Medical Design Excellence Award.

APPLICATION 2: HOUSINGS

Circuit patterns can be applied directly onto plastic housings and components in two and three dimensions. 3-D patterns can be applied with lines and spaces down to 0.005 inch (0.127 mm) with a resolution of 0.001 inch (0.025 mm).

Cybershield, Inc. is a subsidiary of Elk Corporation. Based in Dallas, TX Cybershield is an industry leader in the design and manufacture of metallized plastic engineered solutions for electronic equipment OEMs. For more information, visit their website at www.cybershieldinc.com.

MATERIALS AVAILABLE

• PC
• ABS
• PC/ABS
• Nylon 6/6 with glass and mineral
• LCP with glass and mineral
• PPA with glass and mineral
• PEI with glass and mineral
• PEEK with glass and mineral

NEW GENERATION LDS PRODUCTS

Material Description

• n

RTP LDS Grade PC High flow High impact Black RTP 399 X 131442 A Black PC High flow High impact Colorable RTP 399 X 131471 A Natural PC 10% GF High flow Impact modified Black RTP 399 X 131489 Black PC 20% GF High flow Impact modified Black RTP 399 X 131494 A Black PC/ABS 20% GF High flow Impact modified Black RTP 2599 X 131441 D Black PC 30% GF High flow Impact modified Black RTP 399 X 131494 Black PA Alloy GF Low warpage Natural RTP 299 M X 131508 Natural PA Alloy GF Low warpage Black RTP 299 M X 131487 A Black

• PC based LDS to compete with MEP 3730 & MEP 3734
• Better impact properties
• Injection molding for thin-walled parts
• Short lead time
• High modulus LDS based on PC, PC/ABS
• High temperature, low warpage PA 6/6 based LDS grade

developed for PVT process

SELECTED LDS MATERIAL DATA

RTP 399 X 113385 B RTP 699 X 113386 B RTP 2599 X 113384 C RTP 299 X 113399 H RTP 4099 X 117359 D RTP 3499-3 X 113393 C Resin PC ABS PC/ABS PA 6/6 PPA LCP Description

• n High Impact

Black High Impact Black High Impact Black Glass Fiber Mineral Black Glass Fiber Mineral Black Glass Fiber Mineral Black Tensile Strength (MPa) 50 41 50 110 114 117 Flexural Modulus (MPa) 2400 2400 2400 9000 10300 12400 HDT @ 455 kPA (°C)

• 249

279 274

SELECTED LDS MATERIAL DATA

RTP 399 X 131442 A RTP 399 X 131442 C RTP 399 X 131442 D RTP 399 X 131471 A RTP 399 X 135121 J

Resin

PC PC PC PC PC

Description

Low Cost Fast Plating Higher Cost Medium Cost White Color Higher Cost Fast Plating Medium Cost

Tensile Strength (MPa)

49 50 49 52 55

Flexural Strength (MPa)

78 85 78 91 100

Flexural Modulus (MPa)

2200 2400 2100 3000 3000

Notched Izod Impact (J/m)

450 900 600 500 450

Flammability, UL94

HB HB V-0 HB V-0

Color

Black Black Black White Black

NEW GENERATION LDS PRODUCTS

Item RTP 399 X 131442 C MEP 3730 Specific gravity 1.27 1.26 Melt flow rate, 260C/5kg (g/10min) 12 11 Mold shrinkage, 3.2mm (%) 0.7 0.6 Notched Izod Impact Strength (J/m) 900 550 Unnotched Izod Impact Strength (J/m) NB NB Tensile strength (MPa) 51 50 Tensile elongation (%) 80 >60 Tensile modulus (MPa) 2300 2100 Flexural strength (MPa) 85 82 Flexural modulus (MPa) 2400 2350 Dielectric constant 1 GHz 2.87 3.0 3 GHz 2.85

• 5 GHz

2.84

• Dissipation factor 1 GHz

0.0077 0.0050 3 GHz 0.0064

• 5 GHz

0.0063

ADDITIONAL INFORMATION WEB.RTPCOMPANY.COM/INFO/DATA/LDS/

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