Corporate Presentation 2020 Core Values Engineering Manufacturing - - PowerPoint PPT Presentation

SLIDE 1

Corporate Presentation 2020

SLIDE 2

Core Values

Engineering Manufacturing Solutions Customer Service

SLIDE 3

Mechanical Division Established

• Fabrication

Electronics Library Team Established Northern California PCB Layout Facility Established Southern California PCB Layout Facility Established Established PCB Division in Taiwan Established PCB Division in China Flex & Rigid- Flex PCB

Established

Component Division Established Component Division Expanded

• High Speed I/O
• Push-Pull Circular Connector/

Snap Latch Series Component Division Expanded

• Interconnect Components
• Cable Assemblies

Component Division Expanded

• Magnetics

Division

2012 1993 1997 2000 2002 2005 2006 2007 2011 2015

Packaging Systems Established

2016 2017 2018

Interconnect Division Established

2014

Component Division Expanded

• Power Transformers

Mechanical Division Expanded

• Design Capabilities

Milestone

2015

Circular Connectors Expanded

• IP54 - IP68
• First Responder/ Law Enforcement
• Self-wiping Sockets
• Custom Disposable

2019

SLIDE 4

Divisions

PCB Layout PCB Interconnect Solutions Components Mechanical Packaging Systems

PCB Layout → Routing Service → Library Service Cloud Library Management Mechanical Design Thermal Analysis Quick Turn High Mix Low Volume Medium to High Volume Multilayer/Buildup Medical and Industry High Speed I/O Connectors QSFP28, SFP28, QSFP+ XFP, SFP+, SFP, MiniSAS HD Push-Pull Connectors Custom Cables Turnkey Solution USB, SATA, HDMI, BTB HDMI/USB Cable Assemblies RF, Memory Card, FPC, Power Cord Planar Transformers RJ45 W/ Magnetics Power Transformers, LAN Magnetics High Speed Module Systems System SI/PI Modeling Enhanced Thermal Packaging Design & Fabrication Solutions Plastic Injection Die-Cast Molding Sheet Metal Stamping Screw Machine Cable & Wire Harness Spray Finishing

SLIDE 5

Technical Sales: 13 Corporate Offices / Design Center: 2 Inside Sales: 22, QA: 5 Engineer: 20 Regional Sales Locations: 36 Sales Representatives: 99

North America Sales Coverage

SLIDE 6

Mechanical Fabrication Component Factories PCB Factories PalPilot Design Center & Alliance Partners Corporate Offices / Design Center: 2 Inside Sale: 20 SQI: 6 Regional Sales Locations: 6 Sales Representatives: 50

Asia Factory & Sales Coverage

SLIDE 7

Revenue Totals Based on all Combined PalPilot Business Units

North America Revenue / 2009-2020*

*Projected *

2009 2010 2011 2012 2013 2014 2015 2016 2017 2018 2019 2020 120 US$ Million 100 US$ Million 80 US$ Million 60 US$ Million 50 US$ Million 130 US$ Million 110 US$ Million 90 US$ Million 70 US$ Million

SLIDE 8

PalPilot Sales by Industry

SLIDE 9

PCB Layout

SLIDE 10

PCB Design Services

PalPilot’s continuous resource-training and investments in state-of-the-art tools enable us to offer precision design services to meet the needs of today’s demanding product challenges.

• High-speed (>26Gbps/channel)
• High Density
• Highly Constrained
• High-Layer (>40 layers)
• 2000+ pin BGA
• 0.35mm pitch
• Controlled Impedance
• Backdrill
• Blind and Buried Vias
• HDI
• Via-in-pad

PCB Technologies

• Veteran PCB Designers
• Close Interaction
• Anywhere, Anytime
• Flexible Schedule
• Industry Leading Software
• Concurrent Engineering Collaboration
• Around-The-Clock Routing Support

Key Features

• SFP28, QSFP28
• Infiniband
• XAUI
• PCle Gen 3, PCle Gen 4
• Gigabit Ethernet
• Fibre Channel
• DDR3, DDR4
• RF and Microwave
• ATCA & Micro-TCA

Industry Applications

SLIDE 11

Cloud Library Management

Supported Platforms Capabilities

• OrCAD CIS
• Concept HDL
• Cadence Allegro
• Solidworks and STEP
• Schematic Symbol Creation
• Footprint Creation
• IPC-7351, IPC-7251, JEDEC

Standards

• Custom Land Pattern – Z-Axis

Dimension

• 3D CAD Models

Visit us:

SLIDE 12

PCB

SLIDE 13

Quick-Turn Prototype Pre-Production Volume Production Complete Solution Throughout Product Life Cycle

Commitment to Quality

PCB Fabrication

Quick Turn, 5-10 Days from Asia High Mix Low Volume Medium to High Volume Multilayer/Build up Flex, Rigid-Flex UL ISO9001 (Quality System) IATF16949 (Automotive) ISO13485 (Medical) AS9100 (Aerospace) ISO14001 (Environmental) OHSAS18001 (Safety)

Certifications

SLIDE 14

PCB Fabrication Capabilities

RIGID BOARDS FLEX BOARDS

Layers

1 – 40L

Max Board Size

24” x 40”

Max Board Thickness

.315”

• Min. Board Thickness

4L – 16 mil, 6L – 24 mil, 8L – 40mil, 10L – 48 mil, 12-16L – 63 mil

HDI Boards

Blind, Buried & Stacked Vias

Impedance Control

≤50 OHMS = ±5OHMS >50 OHMS = ±10%

Aspect Ratio Mechanical

15:1 | 35:1 (ATE)

• Min. Line Width

2.5 mil

• Min. Line Space

2.5 mil

• Min. Mechanical Drill / Pad 6 mil | 16 mil

Min Laser Drill / Pad

4 mil | 10 mil

PTH Dia. Tolerance

±3 mil

NPTH Dia. Tolerance

±1 mil

Hole Position Deviation

±3mil

Outline Tolerance

±4 mil

Solder mask Dams

3 mil

Aspect Ratio Laser

1:1

Flammability

94V-0

Layers

1 – 12L

Max Board Size

8.6” x 13.8”

Max Board Thickness

.040” without stiffener

• Min. Board Thickness

4 mil

• Min. Line Width

3 mil

• Min. Line Space

3 mil

• Min. Mechanical Drill

4 mil

Outline (Laser) Tolerance

±2 mil

Cover Layer Dams

8 mil

Flammability

94V-0

Impedance Control

≤50 OHMS = ±5OHMS >50 OHMS = ±10%

SLIDE 15

PCB Fabrication Capabilities

RIGID – FLEX METAL SUBSTRATE PCB

Layers

2 – 40L

Max Board Size

15.75” x 30.0”

Board Thickness

.00788” - .1968”

Impedance Control

≤50 OHMS = ±5OHMS >50 OHMS = ±10%

• Min. Line Width

2.5 mil

• Min. Line Space

2.5 mil

• Min. Mechanical Drill / Pad 6 mil | 16 mil

Min Laser Drill / Pad

4 mil | 10 mil

Max Buried Via

8 Mil

PTH Dia. Tolerance

±3 mil

NPTH Dia. Tolerance

±2 mil

Hole Position Deviation

±3mil

Outline Tolerance

±4 mil

Solder Mask Dams

3 mil

Aspect Ratio Mechanical

20:1

Aspect Ratio Laser

1:1

Aluminum Substrate, Copper Subs, Aluminum Substrate and Copper Substrates Metal-Substrate Control Depth capability (mm)

±0.05

Counter bore depth-controlled capability (mm)

± 0.10

Maximum copper weight (OZ)

12

Heat Sink ViPPO Resin Fill

[Conductive and Non-Conductive]

Metal – Buried PCB Embedded Resistance Embedded Capacitance Hybrid Lamination Micro-Via Copper Fill Heavy Copper UL – 6oz

SPECIAL PROCESSES

SLIDE 16

PCB Fabrication Capabilities

ATE / Burn-In Board

Layers

2 – 80L

Max Board Size

15.75” x 30.0”

Board Thickness

.093” - .250”

DUT/Drill Pattern Pitch

.0118” (.3mm) minimum

• Min. Line Width

2.5 mil

• Min. Line Space

2.5 mil

• Min. Mechanical Drill / Pad 4 mil | 10 mil

Min Laser Drill / Pad

3 mil | 6 mil

Inner Layer Spacing Pad/Trace 1.5 mil Aspect Ratio Mechanical

35:1

Stub Drilling Max Depth

0.30 (.3mm pitch) – 0.130 (.5mm pitch)

Stub Drill Diameter

0.0079 (.3mm pitch) – 0.01(.5mm pitch)

Surface Finish

ENIG | ENIPIG | Hard Gold Selective Gold | Flash Gold

Impedance Control

≤50 OHMS = ±5OHMS >50 OHMS = ±10%

SLIDE 17

PCB Fabrication – Materials & Surface Finish

LAMINATE MATERIAL SUPPLIERS SURFACE FINISHES

• Standard Tg FR-4
• Mid Tg FR-4
• High Tg FR-4
• High Speed Materials
• Mixed Dielectric Constructions
• Halogen Free
• High CTI
• Polyimide (adhesive, adhesiveless)
• PET / Polyester
• Metal Core
• Isola
• Sheng Yi
• ITEQ
• Ventec
• Nelco
• Panasonic
• Rogers
• Taconic
• Dupont
• Taiflex
• Leaded HASL
• Lead Free HASL
• Immersion Gold (ENIG)
• Immersion Gold (ENEPIG)
• Immersion Silver
• Immersion Tin
• Hard Gold (Fingers)
• Selective Hard Gold
• Wire Bondable Soft Gold
• Flash Gold
• OSP
• Carbon Ink

SLIDE 18

Packaging Systems

SLIDE 19

Packaging Systems

IC Substrate

• Coreless laminate Substrate
• High Power Ceramic Substrate
• Thin Film Ceramic Substrate
• Glass Substrate Solutions (Development)

Package Assembly Systems

• Coreless Package Systems
• High Frequency LNA/PA
• Optical Package Solutions
• SiP, 2.5D & POP Assemblies

Substrate & Package Design Service

SLIDE 20

Packaging Systems

PCB & Substrate SI/PI Modeling & Measurement

• Insertion Loss
• Return Loss
• Eye Pattern Generation
• Cross Talk

Specialized Material Deployment

• Next Generation Polyimide Laminate Systems
• 25um via Generation, 25um L/S
• High Conductivity ITO Replacement
• High Transparency
• High Conductivity
• Low Cost

SLIDE 21

Interconnect Solutions

SLIDE 22

Plastic Push Pull Watertight M12/ M8 Metal Push Pull Disposable Easy Clean High Voltage Custom Mixed Contacts Sterilizable Thread Locking Bayonet Locking Color Codes Multiple Keying Features Push Pull Latching Touch Proof Power & Signal Fast Data Transfer IP68 High Mating Cycles

Interconnect

PCB Mount Multiple Sizes Break Away EMI Protection

SLIDE 23

Plastic Connectors

• TOUCH PROOF
• LIGHT WEIGHT
• MIXED CONTACTS
• CUSTOM OPTIONS
• OZONE FREE
• STERILIZABLE
• DISPOSABLE
• BREAK AWAY
• METAL TO PLASTIC
• COLOR KEYING
• IP67 PROTECTION
• CUSTOM SOLUTIONS

PLASTIC CONNECTORS

SLIDE 24

Metal Shell Connectors

• HIGH MATTING CYCLES
• CUSTOM SLUTIONS
• 6 HOUSING STYLES
• UP T0 64 CONTACTS
• MIXED CONTACTS
• IP68 PROTECTION
• EASY CLEAN
• QUICK DE-MATING
• THREADED LOCKING
• RUGGED / ROBUST
• 90 DEGREE PCB
• 360 DEGRE SHIELDING

METAL CONNECTORS

SLIDE 25

We utilize our standard Medical grade cable to meet long term and short builds. All our cables are designed to meet the medical criteria and requirements within the specified fields of medicine .

Features

Med edical Grad rade Mixe ixed Con Conductors Twis isted Pair irs Shie ield lding Silic ilicone TPE & TPU Coa Coaxial Fib iber Optic tics Ja Jack cket t Co Color Optio tions Fle lexible e

Custom Cables Industrial & Medical Quality

SLIDE 26

Complete Solutions

Added Value

Over Molds Devices Raw Cable and Assemblies

Turnkey Solution Competitive Pricing

SLIDE 27

Manufacturing Expansion

• Molding Capabilities
• Full Assembly Process
• Self Contained Particle Monitoring

Features Advantage ✓ Sterile Environment ✓ Medical Final Packaging ✓ Incoming Particulate Inspection ✓ Value Added in Medical Applications

Clean Room

Classification 8

SLIDE 28

Components

SLIDE 29

Connectors

USB Connectors RJ45

▪ USB 3.1 ▪ USB 3.1 Type-C ▪ USB 3.0 ▪ USB 2.0 ▪ USB Type A ▪ USB Type B ▪ USB Type AB ▪ Mini USB ▪ Micro USB ▪ Type A (1.0 Spec) ▪ Type B (1.0 Spec) ▪ Type C (1.3 Spec) ▪ Type D (1.4 Spec) ▪ Type E (1.4 Spec) ▪ Mini-HDMI ▪ Micro-HDMI

HDMI

• 0.4 Pitch.

0.8H/0.9H/1.0H/1.5 /H2.0H.

• 10 Pin~60 Pin
• Designed to Prevent

Tin Wicking

• Narrow Design to

Reduce Space for PCB

BTB

▪ 1x, 2x Series ▪ USB Combo ▪ LED Option ▪ EMI Shield Option ▪ Right Angle, Vertical

SLIDE 30

RF Connector Custom Memory Card

▪ 1.2H/1.5H/2.5H Plug and Socket Series 0.81/1.00/1.13/1.32/1.37 Wire ▪ Supports Insert Molding Process for Sealing ▪ Strong Chamber for Better Molding and Mating Guide

• Plastic Cover
• Stamping Contact
• Insert Molding

Mechanical Structure

• 1.5/1.30H Push Pull Type

Micro SD

• Locking Feature for the

Design

• Anti Card Fast Eject Function
• Detection Switch Pin

Attached

• Low Profile Sim Card

FPC

• 0.3mm, 0.5mm Pitch

1.0H

• 6 Pin ~ 67 Pin
• Front and Backflip

Lock

• Designed to Prevent

Tin Wicking

• Superior Solder Peg

Connectors

SLIDE 31

Cable Assembly

HDMI USB RF

• Matches high

frequency characteristics

• 1.2H/1.5H/2.5H plug

and socket series 0.81/1.00/1.13/1.32/ 1.37 wire

• USB 2.0 A to B
• USB 3.0 to 3.1
• USB 3.1 Type-C
• Custom Design
• USB Committee

Member

• HMDI 19 Pin Male to Male
• HDMI 19 Pin Male to DVI-D
• Custom Design
• Low Noise
• High Volume Manufacturing

Capabilities

• Premium Certified 4K60

HDMI Cables / Smallest OD Designs Available

Power Cord

• EU ROHS directive and EU

REACH Regulation

• China ROHS directive;

Norway PoHS directive

• California 65 proposal and

HR4040

• PAHS ( polycyclic aromatic

hydrocarbons ) control

• Adjacent benzene two

formic acid salt control

USB Type-C Cable

SLIDE 32

RJ45 With Magnetics

10/100/1000 Base-T ǀ 10GBase-T ǀ RJ45 + USB Combo ǀ PoE/PoE Plus with Internal Diode Bridge

TYPES

Single Port ǀ Multiple Port Stacked Port ǀ Low Profile ǀ Vertical Custom Configurations ǀ Optional Emi Tabs

PACKAGES FEATURES

Integrated Magnetics ǀ Tab Up or Tab Down ǀ LED Color Options Surge Protection ǀ RoHS Compliant

SLIDE 33

Power Magnetics – LAN Magnetics

Power Transformers SMD & Wire Wound Inductors LAN Magnetics

• 350μH OCL
• PoE rated at 350mA
• PoE+ rated 600mA
• 1500 Vrms Isolation
• 10/100/1000Base-T
• 10Gbase-T
• 2.5Gbase-T
• RoHS Compliant
• Low Profile
• Small Size
• Surface Mount
• High Current
• Low DCR
• High Energy Storage
• Low-Loss
• Magnetically Shielded
• RoHS compliant
• Planar Transformers up to

5000W

• High Frequency

Transformers

• Laminated Transformers
• Flyback Transformers
• High Power Density
• Step Up/Down
• Build-to-print
• Custom Design Support

Current Sense Transformers

• Current range 0.01-300A
• Frequency 50Hz — 400Hz
• Accuracy 0.1, 0.2, 0.5, 1
• Insulation 4000 VAC/1min
• ANSI C57.13/IEC60044-1
• Custom Turns-Ratio option
• RoHS compliant

SLIDE 34

Mechanical

SLIDE 35

Industrial Design Mechanical Design Prototyping Soft Tooling Hard Tooling Production

Mechanical Solutions

SLIDE 36

✓ Design tools : PRO/E Solidwork/ simulation tool / inspection and verification tool design ✓ Mechanical design : enclosure / transmission / structure system design ✓ DFM (Design for Manufacturing) : plastic / sheet metal / die casting / extrusion ✓ Successful Projects : scanner / printer / POS / E-bicycle / portable product

Design & Review Design Analyses Tooling Fabrication Mass Production

Mechanical Design Capabilities

SLIDE 37

Mechanical Fabrication Capabilities

Injection Molding

• Insert Molding
• High End & Super Slim Plastic

Injection

• Gate Cut in Mold Technology
• Die-Casting: (High Pressure)

Aluminum, Zinc

• Robotic Forming
• Stamping & Blanking Presses
• Training Certification for

Welders

• Paint, Powder Coating, Silk

Screening

Metal Stamping Surface Finish

• Fully Automatic Spray

Painting Lines (8)

• Flat Bed, Manual, UV Spraying
• Anti-Finger Print Finish
• Soft Touch Finish

CNC & Extrusion

• Precise 1, 2, 3 Head CNC
• Surface treatments:

Anodizing, Powder Coat

• Sandblasting, Wiredrawing

Screen/Pad Printing, Laser Carving, Etching

SLIDE 38

www.palpilot.com