Connectors: HiLo Interconnect Wednesday, October 04, 2017 Company - - PowerPoint PPT Presentation

Company Overview – March 12, 2015

Connectors: HiLo™ Interconnect

Next Level Integration Next Level Integration

Wednesday, October 04, 2017

Connectors: HiLo™ Interconnects

Lows Highs

• High Density: 0.8mm pitch and above
• High Speed: 1 dB cut-off measured at 9.3

GHz

• High I/O: Available with over 2400

positions

• High Reliability: Proven dual-beam gold-

plated high strength copper alloy contacts

• High Speed Assembly: Pick and place

compatible

BGA/LGA Socketing Module Interconnect

• Low Profile: Socket height less than 2mm
• Low Cost: A few cents per mated pair in

high volume production

• Low Tooling Cost: Tooling cost for custom

footprints less than $1,000

• Low Insertion Force: One ounce per

contact

Flexibility

• Any Application: Production IC socket,

module-to-board connector, flex to PCB

• Quick Delivery: Prototype quantities shipped

in 2 weeks

• Any Footprint: Not limited to standard arrays
• r geometries. Design freedom for mixed pitch,

selectively populated, and non-grid arrays

• CTE Compliant: Designed to accommodate

thermal mismatch

HiLo™ INTERCONNECT OVERVIEW

Connectors: HiLo™ Interconnects

The HiLo system consists of two contacts: A pin (male) and socket (female) Pin (Male)

• Base material: Phosphor Bronze (typical)
• Plating: Gold over Nickel (typical)
• Diameter 0.3mm (0.012”) for 1mm pitch +
• Diameter 0.2mm (0.008”) for 0.8mm pitch +

Socket (Female)

• Base material: Beryllium Copper
• Plating: Selective Gold over Nickel (typical)
• Different contacts tooled for different pitch

Dual beams make contact to pin J-Lead on bottom of contact is surface mount soldered to BGA pattern on PCB

PRODUCT INFORMATION

Connectors: HiLo™ Interconnects

HiLo™ connector housings are manufactured from drilled laminate instead

• f molded plastic:
• Improved Solder Joint Reliability: For large area array connectors, a

CTE mismatch between the connector and PCB materials can result in significant stresses and failures under thermal cycling applications. HiLo minimizes these CTE mismatch stresses by utilizing a laminate with a CTE similar to the customer’s PCB.

• Better Flatness: Drilled laminate connectors also exhibit less warp

and twist during reflow compared to molded connectors. ISI’s HiLo designs have a tendency to conform to the substrate material during reflow resulting in high quality, reliable solder joints. Resin Tg X-Y CTE Dielectric Constant FR4 125

• C

10-14 3.9-4.5 High Temp Epoxy 210

• C

10-14 3.6-3.7 Polyimide 250

• C

6-9 3.6 HiLo is available with the following laminate materials:

PRODUCT INFORMATION

Connectors: HiLo™ Interconnects

HiLo uses a standard, high volume, production process to make custom product variants:

• Data driven process: Engineering

files load directly into production equipment

• Standard panel size eliminates

job-specific tooling

• Standard materials + standard

process + unique data file = custom product

• Automated optical inspection

ensures quality on 100% of units manufactured

High-accuracy, multi-head drilling Automated contact insertion Precision routing Automated optical inspection

HiLo™ MANUFACTURING

Connectors: HiLo™ Interconnects

• Pins are inserted into two layers of laminate and

planarized.

• Bottom layer is drilled at same diameter as pin to provide

interference fit

• Top layer is drilled at larger diameter to provide

clearance for solder joint

Typical Configurations:

This end of pin is soldered to PCB, BGA or LGA This end of pin is inserted into socket

Pin Field Socket

Pin inserts into dual beam contact J-lead solders to PCB

• Socket contacts are captured in three layers of laminate.
• Bottom layer holds contact barrel and serves as main

structural body of socket.

• Center layer is drilled at a larger diameter to allow contact

beams to move

• Thin top layer serves as a guide when inserting pin field

Note: Drawings shown are for reference only. ISI manufactures with different materials, dimensions, etc. to suit various

• applications. Please consult ISI for accurate drawings for your application.

PRODUCT INFORMATION

Connectors: HiLo™ Interconnects

Solder ball forms joint around pin tip Pin inserted into dual beam contact. (Gold to Gold contact) J-Lead soldered to motherboard (J cut off in cross- section)

BGA Substrate

Motherboard

HiLo™ Cross Section - BGA Socketing Application

Nickel plating in inside of barrel prevents solder from wicking up contact

PRODUCT INFORMATION

Connectors: HiLo™ Interconnects

A’-A” A’-A” B’-B” B’-B”

Cross Section Samples Indicate:

• Good alignment of socket ‘J’ lead to PCB pad
• Uniform wetting of solder

PRODUCT CROSS SECTION

Connectors: HiLo™ Interconnects

• Any Pitch (& Mixed Pitch!)
• Any Pattern

Optimize interconnect for your application without increasing cost or lead-time

• 2500+ Positions
• Mounting hardware and alignment features available

APPLICATIONS

Connectors: HiLo™ Interconnects

ISI HiLo Connectors

APPLICATIONS

Connectors: HiLo™ Interconnects

High Pin-Count ASIC Optical Module

ISI Solution: HiLo Flexible Interconnect System

APPLICATION – IC SOCKETING

• Socket solders to existing SMT footprint
• Suitable for high speed applications
• Does not require mounting holes or backer plates
• Laminate construction provides advantages in assembly process and reliability
• Low profile design allows room for heatsink
• Alignment features and mechanical retention features can be added as

required

Challenge

An OEM wants to make certain components Field Replaceable Units:

• High pin count ASIC
• Optical Module

Connectors: HiLo™ Interconnects

APPLICATION – IC SOCKETING

Challenge

You do not want to commit expensive FPGAs to your prototype and development boards.

ISI Solution: HiLo FPGA Socketing

• ISI has standard designs for all 1mm pitch FPGA BGA

packages, up to 1932 I/O

• Socket can be soldered to existing footprint on motherboard
• Allows customers to utilize footprint compatible products within

FPGA product family

• Reduces development costs by re-using expensive FPGAs

Connectors: HiLo™ Interconnects

IC Socketing In this application, the pin field is typically soldered directly to the IC, and the socket is soldered to the motherboard

 Ball Grid Array (BGA) Socket – standard product line for FPGAs from Xilinx, Altera, Actel  Land Grid Array (LGA) Socket  Ceramic Column Grid Array (CCGA) Socket  Micro Pin Grid Array (μPGA, mPGA) Socket for Intel & AMD devices (ISI pin field not required)

Step 2: Socket soldered to motherboard Pin Field Socket Step 1: IC soldered to HiLo Pin Field to create ‘MicroPGA’ Step 3: IC + Pin Field inserted into Socket

APPLICATION – IC SOCKETING

Connectors: HiLo™ Interconnects

HiLo™ Standard Products for FPGA BGA Packages – for the list online, click here.

APPLICATION – IC SOCKETING

Connectors: HiLo™ Interconnects

Pinfield Socket

Mated set

APPLICATION - 3D MODULE INTERCONNECT

Challenge

Fit a complex, multi-component circuit into a small cylindrical space.

ISI Solution

Custom circular high density connector designed to facilitate stacking of round PCBs. Board-to-board spacing optimized at each level by utilizing various connector pin lengths.

Connectors: HiLo™ Interconnects

Challenge

Replace a standard microprocessor with a high performance FPGA plus memory to accelerate computing-intensive algorithms while reducing power consumption.

ISI Solution

A high density module and custom microPGA connector were designed and assembled to enable the module to be inserted into standard ZIF socket in a multi-processor server.

APPLICATION - MODULE INTERCONNECT

Connectors: HiLo™ Interconnects

Board-to-Board Interconnect In this application, the socket is typically soldered to the motherboard, and the pin field is soldered to a second PCB or substrate. Applications include:

• Mezzanine Boards
• Daughter Cards
• Modules
• Interposers

Daughter Card Motherboard HiLo™ Pin Field HiLo™ Socket Board-to-board spacing can be changed by increasing pin length and pin carrier thickness

MODULE-TO-BOARD INTERCONNECT

Connectors: HiLo™ Interconnects

ISI offers a family of removal tools that can be used with HiLo™ BGA socketing systems

• 2. ‘Hook’ end of tool

under pin field

• 1. Adjust tool to proper width with

three adjustment screws

• 3. Press on edges of tool

to extract pinned IC

P/N E00001-2

P/N E00001-2: 2-sided tool with minimum keepout requirement. Recommended for HiLo™ systems up to 700 positions P/N E00002-2: 2-sided tool. Recommended for HiLo™ systems with 700 to 1200 positions P/N E00004-2: 4-sided tool. Recommended for HiLo™ systems with over 1200 positions, or over 45mm in size

P/N E00004-2: 4-sided tool P/N E00002-2: 4-sided tool

APPLICATION INFORMATION

Connectors: HiLo™ Interconnects

Available upon request: HiLo Signal Integrity Test Report Customer test report for 0.8 and 1 mm pitch HiLo evaluation board. Socket Assembly Guideline Provides PCB and stencil design guidelines for HiLo socket assembly. Qualification Data / Reliability Testing (Contech Research) Performance qualification testing performed to EIA 364 and MIL-STD-1344 connector standards

ADDITIONAL DOCUMENTATION

Low Level Circuit Resistance (LLCR) Vibration Mechanical Shock Insulation Resistance (IR) Dielectric Withstanding Voltage (DWR) Thermal Shock Humidity (Thermal Cycling) Engagement and Separation Force Mating and Unmating Force Thermal Aging Durability Normal Force Gas Tightness (separate report) Mixed Flowing Gas (separate report) Current Carrying Capacity Characteristic Impedance Voltage Standing Wave Ratio (VSWR) Propagation Delay Via Time Domain Transmission (TDT) Crosstalk Via Network Analysis (Frequency Domain) Loop Inductance

Connectors: HiLo™ Interconnects

Products per Board Boards per System Products per System Contacts per System HiLo Pin Field, 540 Position 35 272 9,520 5,140,800 HiLo Socket, 540 Position 35 272 9,520 5,140,800 HiLo Pin Field, 630 Position 23 272 6,256 3,941,280 HiLo Socket, 600 Position 23 272 6,256 3,941,280 Board to Board, 141 Position 34 272 9,248 1,303,968 HiLo Socket, 141 Position 34 272 9,248 1,303,968 Leaded Carrier, 8 leads, 7 pins 51 272 13,872 208,080 235 272 63,920 20,980,176 Product Total

ISI’s HiLo™ system was selected as the exclusive interconnect for supercomputer that involved nearly 21 million contacts per system.

SUPERCOMPUTER PROGRAM

Connectors: HiLo™ Interconnects

• ISI’s revolutionary HiLo connector system uses standard materials and

processes to create a connector with a pinout optimized for your system

• This ‘design freedom’ allows system architects to increase density,

performance, and modularity in next-generation products

• ISI HiLo and custom board-to-board interconnect products are

currently qualified for use in many defense and high-reliability applications

• HiLo is priced competitively with area-array connectors in the industry

THE ISI DIFFERENCE

Company Overview – March 12, 2015 Company Overview

Connectors: HiLo™ Interconnects IC Obsolescence & RoHS FPGA Computing 3D & Advanced Packaging

THANK YOU!

Company Overview Website

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THANK YOU!

Contact ISI to engage on your next project:

741 Flynn Road / Camarillo, California 93012 (805) 482-2870 www.ISIPKG.com Address: Phone: Website:

» Bob Garon

(630) 707-0991 bob.garon@molex.com Cell: Email: Midwest USA

» Brian Witzen

(919) 633-0798 brian.witzen@molex.com Cell: Email: Eastern USA (714) 993-9618 (714) 261-3733 dave.gagnon@molex.com Office: Cell: Email: Western USA

» Dave Gagnon