Andy Longford Managing Partner PandA Europe ELFNET pointing the - - PDF document

Andy Longford

Managing Partner PandA Europe

”ELFNET – pointing the way to future standards in Lead- free Electronics”

BIOGRAPHY Since 1998, Andy has been a director of PandA Europe, a European technical market consultancy company involved in Semiconductor chip Manufacturing, specialising in Packaging and Electronics Interconnection. He is currently involved in a number of European programs for MEMS package needs and has published a number of technical papers related to chip packaging technology. Andy is the chairman of the UK Industrial Advisory group for work on conductive adhesives. He has been Chairman of the SEMI European Test, Assembly and Packaging (TAP) Standards Committee since 1994 and is currently Co-Chair of the SEMI European Regional Standards Committee and a member of the SEMI International Standards

• Committee. From 2004, as part of the European ELFNET project, Andy is responsible for

coordinating the Industry network activity in Lead(Pb) Free Electronics in Europe. Within SEMI he is now involved with the formation of working groups for the development of Standards in Flip Chip and Wafer level packaging. ABSTRACT ‘ELFNET – European Lead-Free Soldering Network’, is a new European network of national research organisations, technical experts and industry bodies in microelectronics. It aims to provide a platform to coordinate, integrate and optimise lead-free soldering research, thereby enabling electronic producers in the EU to meet the RoHS Directive and face a lead-free

• future. ELFNET will operate in 19 European countries and is funded by the European

Commission. The ELFNET project comprises of a number of work packages, the key ones being the Technical Expert Groups (TEG) and Industry Networks (IN). These groups are charged with determining, collating and prioritising the key research and business issues relevant to the implementation of lead-free soldering technology in Europe. This presentation will explain the working of the ELFNET project and introduce the issues already determined, which in many of the areas investigated indicate a strong requirement for

• standardisation. Understanding the network capability and using the resources it makes

available, will provide a platform for developing and introducing the new standards in lead free electronics in Europe.

CONTACT INFORMATION PandA Europe Lambourn, Berks, RG17 8YP United Kingdom andy@pandaeurope.com www.pandaeurope.com

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ELFNET Unit 3 - Curo Park Frogmore St Albans Hertfordshire AL2 2DD United Kingdom Tel +44 (0) 870 458 4242 Fax +44 (0) 870 458 4273 email info@europeanleadfree.net www.europeanleadfree.net

ELFNET - European Lead-Free Soldering Network is partially funded by The European Commission

Pointing the Way to Future Standards in Lead(Pb)-Free Electronics

Milan 6 October 2004

Presented by: Andy Longford (PandA Europe) ELFNET WP3 Leader / co-ordinator – Group Leader of Automotive/Industrial IN-2

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Presentation Outline

Elfnet history and objectives Elfnet operational structure The Drivers (environment) for Lead Free electronics Lead Free in Semiconductor Devices Elfnet results Benefits expected from Elfnet

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Elfnet Mission Statement

ELFNET [European Lead Free soldering NETwork] is a European network

• f national research organisations, technical experts and industry bodies

enabling lead-free solutions in micro-electronics. It provides a platform to coordinate, integrate and optimise research to enable electronic producers in the EU to optimise solutions and meet the EU deadline to introduce lead-free soldering in consumer products by 1 July 2006 ELFNET is funded by the European Commission and operates in 19 European countries. By facilitating ‘best practice’, ELFNET will continue to contribute to Europe’s competitiveness in electronics manufacturing beyond 2006

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Development of the Network

June 2000

– Alarm over inaction resulted in research & industry meeting

Oct 2001 & Oct 2002

– Research review meetings discover massive fragmentation, unknown and outdated projects

Industry demands better coordination by RTD’s across member states BUT funding not available EU FP6 Proposal developed Jan-June 2003 December 2003 – Eu agreed €2.3M (230 person-months) over 3 years Start date April 2004 (delayed from Jan 2004) Elfnet Kicked off in Amsterdam – June 2004 September 2004 – Website Launched

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Project Goal

“To urgently coordinate, integrate and optimise the critical mass of European research in lead-free soldering; providing pan-European support for implementation of the RoHS Directive” To a deadline of July 2006 for consumer products To a deadline of 2010 or before for IT-network products To implement lead-free technology in sectors outside scope of RoHS (e.g. automotive, aerospace) To develop Roadmaps for future requirements.

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Specific Objectives

To focus research

– At least 5 new projects worth at least €10 million

To refine R&D strategies

– 54 meetings – 200 Affiliate members – 100,000 visitors to website

To link existing networks

– Signposting – Exchange meetings

To harmonise knowledge base

– Identify every knowledge source and provider – Disseminate for 30 Projects – Translate into local language

To provide a focal point

– Interface with stakeholders

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Network Steering Committee National Networks

Initiate Networks in each Member State Provide Hub for link to Europe Report Implementation Status

Technical Expert Groups

Collate State-of-the-Art Identify Priority Areas Nurture Key Projects

Industry Networks

Feedback Key Industry Issues Benchmark Status Connect to Research Base

ELFNET Structure

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European Set up …

National Networks

France ENSEIRB Portugal ISQ Spain INASMET Netherlands TNO Sweden IVF Belgium IMEC Austria UNIVIE Italy PDM Ireland NMRC Germany TUB Denmark DELTA Norway SINTEF Switzerland EMPA Finland HUT UK ITRI Poland PAS Slovakia SAS Czech Rep. IPM Greece IMMG

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Technical Set up …

Technical Expert Groups

Recycling

TU Berlin, Germany ITRI, UK Shipley Europe, UK

Reliability

EMPA, Switzerland IMMG, Greece ITRI, UK NMRC, Ireland Helsinki University of Technology, Finland Philips, Netherlands

Assembly

IVF, Sweden DELTA, Denmark IMEC/TFCG, Belgium Celestica, UK Solectron Europe, Germany

Solders

ITRI, UK University of Wien, Austria Avantec, France Heraeus, Germany Loctite Multicore, UK

Components

ENSEIRB, France Shipley Europe, UK AMI Semiconductor, Belgium FCI, France Schneider Electric, France Panda Europe, UK Philips, Netherlands

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Industry Set up …

Includes sectors outside the RoHS Directive Will include many additional ‘Affiliate’ industry partners subscribed to the project

Industry Networks

Consumer Automotive & Industrial IT &Telecoms Aerospace

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The Drivers …. The Environment

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General global lead-free initiatives 1995 2000 2005 2010 1990

1991-93 DTI project UK

ITRI, Multicore, GEC-Marconi, BNR (Nortel)

1992-96 NCMS project USA

National Centre for Manufacturing Sciences

1999-2002 NEMI project USA

North American Electronics Manufacturing Initiative

1996-99 EU project IDEALS

Siemens, Philips, Marconi, Multicore, Witmetaal

1994-96 JIEP project Japan

Lead-free committee

1998-99 NEDO project Japan

JWES, JEITA, EIAJ

year 2000-02 JIEP project Japan

Low temperature soldering

2001-03 Standards project Japan

Harmonised test methods

2002-2003 NEMI project USA

Follow-up key issues

2002-2006

IMR IMECAT COST 531 LEADFREE PROTIN LFS-for_SME’s EFSOT

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EU Lead-Free Soldering ‘Activity’ 2008 2000 2002 2004 2006 1998

EU Date > 2008

Alloy Selection Implementation Issues Technology Transfer

Japan Pressure EU Date < 2006

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RoHS - Research Lead-Free Status

EU research

– Originally leading but now fragmented, sparse and late – Funding mechanisms hinder rapid deployment – National boundaries exacerbate lack of coordination

Japanese research advanced, US investing $millions First major EU technical conference June 2003, Brussels EU Technical Advisory Committee (TAC) meetings still in progress Final but critical technical issues being addressed only now

– Specific process & materials issues – Testing & Compliance – Standards – Technology development for the future

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Lead-Free Projects - EU

Research IMECAT – Assembly LEADFREE – Reliability DESREL – Reliability EFSOT – Environmental INNOLOT – Harsh Environments PROTIN - Tin Whiskers IMR – Lead-Free Soldering Technology Transfer LFS-for SME’s GREENROSE LEADOUT Networks COST 531 NoNE BFE Coordination …… ELFNET

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What about Semiconductors ?

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From SEMI/GECI meeting April 2001 / ELFNET 2004

The component issues …. “back end”

Dry pack additions due to MSL increases Lead platings – acceptance criteria re whiskers, ductility, solderability Molding compounds (Halogen Free) ”hi-lead” alternatives re C4, CCGA etc Die attach epoxies (thermal issues) Substrates BGA balls Wiring bonding to new lead frame finishes Solderability test specs/requirements Inspection/acceptance criteria Package reliability

– Heat resistance test requirements – Standardised processes – Life testing

Process implications Solutions for other than IC’s:

– Discretes & LEDs – Connectors – Electrolytic & Film capacitors – Switches, Etc

Shelf life Availability – global supply

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Lead free Components ….

Related TEG’s

– Components – Materials – Assembly – Reliability – Recycling

Related Industry Networks

– Consumer – Automotive – Communications – Aerospace

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Key “Lead-Free” Issues

Compliance Standards Supply Chain Higher process temperatures Harsh environments Tin whiskers New alloys Recycling Alternative joining technologies

…. as initially Identified by ELFNET (June 2004)

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Component Standardisation issues ….

Aspects :

– Materials, new and emerging – Process, new and emerging – Technology – relevant developments – Who Standardises ?

Elfnet Identifies

– Issues – Projects – Information Providers

Elfnet Links to

– SEMI, Jedec, IPC, Cenelec, Jeita, Jeida, ITRI, etc – Also to Organisations, Communities and Others

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ELFNET ….. ..….will point the way to all aspects of Lead free In Europe

Communication of key issues …. Coordination of rapid technology development

– Rapid access to research results, reducing time-to-market – Dynamic benchmarking – research and industry – Maximum resource leverage – optimised research – Minimised cost impact and increased competitiveness

Pan-Europe Network with harmonised knowledge base European focal point for international development – eg China Reclaimed global leadership Extension of RoHS aims to other product sectors Support platform for further hazardous material removal initiatives eg. EUP proposals

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ELFNET Membership

Founder Members

– 35 Project Contractors

Affiliate Members

– Will apply to join via website, approved by NSC

• Resident in Europe
• Active in research
• Willing to contribute knowledge

– Join and contribute to NN’s, TEG’s & IN’s freely

Subscribers

– Will join via website automatically – receive newsletter

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The ELFNET team ….. ……Thank you for your attention