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9 th International Congress M Molded Interconnect Devices th 30 th , 2010 September 29 t Nuremberg Fu uerth, Germany A Fluidic 3D-MID Fabricate ed by a New LDS Compatible Sacrificial 2K-Process with Thermal Management of a Power-LED

slide-1
SLIDE 1

9th International Congress M September 29t Nuremberg – Fu

A Fluidic 3D-MID Fabricate Sacrificial 2K-Process with P LED A Power-LED as an A

Thomas Leneke*, Sören Hirs * TEPROSA Otto-von-Guericke U P.O. Box 4120, 39016 Molded Interconnect Devices

th – 30th, 2010

uerth, Germany

ed by a New LDS Compatible Thermal Management of a li i E l pplication Example

sch* and Bertram Schmidt** A, ** IMOS , niversity Magdeburg Magdeburg, Germany

slide-2
SLIDE 2

Introduction

Otto-von-Guericke-University

Chair of Microsystems

MEMS Packaging

Core Competenc

3D-MID Activi 3D MID Activi

Equipment Equipment

  • 1K/2K Injection Molding

Service Service

  • Consultation/Conceptual D
  • LDS/Hot Embossing/Aerosol Structuring
  • PVD/Galvanic/Electroless Metallization
  • Soldering/Wire-Bonding/Flip-Chip

Connection

  • Simulation/CAD
  • Prototyping/Pilot Run
  • Testing/Qualification

Slide 2

  • Thermal/Electrical/X-Ray Testing

Dipl.-Ing. Thomas Leneke Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de

y of Magdeburg

Introduction

Reliability

Proof of Concept TM & 3D-MID

ces

ities

Outlook Results Embedded Ducts

ities

Research Research

  • Reliability of Chip on MID/Flex

Design

Outlook

  • MEMS on MID
  • Product Miniaturization by MID
  • Medical MID Systems
  • MID Sensor Structures

Fluidic 3D-MID MID 2010

  • Sept. 29th, 2010, Fuerth, Germany
  • MID Sensor Structures
slide-3
SLIDE 3

Introduction – 3D-MID

sensor-substrates hearing aid

MECHANIC GEOMETRIC OP

antenna

ELECTRIC ELECTRIC FLUI MAGNETIC

?

Slide 3 ? Dipl.-Ing. Thomas Leneke

D Spectrum

Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de

  • ptical transceiver

camera module

TIC

LED package Introduction Proof of Concept TM & 3D-MID Outlook Results Embedded Ducts Outlook

IDIC

flow sensor (microvalve)

Fluidic 3D-MID MID 2010

  • Sept. 29th, 2010, Fuerth, Germany

inclination sensor

slide-4
SLIDE 4

Introduction – Technology

3D-Metallization (LDS) SMD Power Supply C Multilayer

Slide 4 Dipl.-Ing. Thomas Leneke

y Demonstrator

Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de

Touch Sensor

Introduction Proof of Concept TM & 3D-MID

Flip-Chip

Outlook Results Embedded Ducts

Channels

Outlook

Channels

Fluidic 3D-MID MID 2010

  • Sept. 29th, 2010, Fuerth, Germany
slide-5
SLIDE 5

Introduction – Fluidic

Applications: chemical, life sciences, autom thermal management Requirements: tubes, channels, cavities sealing, plugging, connecting I/O ports, nozzle valves, pumps, sensors Limitations: injection molding, material

[1] Munz et al A 3

Slide 5

[1] Munz et. al., A 3 with Integrated [2] Warkentin et. a Based on MID,

Dipl.-Ing. Thomas Leneke

c & 3D-MID

Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de

motive

Introduction

  • nly straight

Proof of Concept TM & 3D-MID

g by injection molding by injection molding

Outlook Results Embedded Ducts

hybrid [1,2]

Outlook

3/2 Normally Closed Polymer Piezoelectric Microvalve

Fluidic 3D-MID MID 2010

  • Sept. 29th, 2010, Fuerth, Germany

3/2 Normally Closed Polymer Piezoelectric Microvalve MID Electronics, MID Conference 2002 l., Miniature Flow Sensor Systems and Accelerometers MID Conference 2002

slide-6
SLIDE 6

Thermal Managemen C li M th Cooling Metho

Slide 6 Dipl.-Ing. Thomas Leneke

t & 3D-MID d

Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de

  • ds

Introduction Proof of Concept TM & 3D-MID Outlook Results Embedded Ducts Outlook

Fluidic 3D-MID MID 2010

  • Sept. 29th, 2010, Fuerth, Germany

Source: Advanced Electronic Packaging ISBN: 100-471-466093

slide-7
SLIDE 7

Thermal Managemen g Materials

unit Vectra E820i LDS Pocan DP T7140 LDS density

1.79 1.75

⎥ ⎦ ⎤ ⎢ ⎣ ⎡ cm³ g tensile modulus

9000 12000

[ ]

MPa melt temperature

335 255 [ ]

C °

⎤ ⎡ W thermal conductivity

0.26 0.3

⎥ ⎦ ⎤ ⎢ ⎣ ⎡ ⋅K m W

Slide 7 Dipl.-Ing. Thomas Leneke

t & 3D-MID

Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de

water copper Introduction

0.99 8.92

Proof of Concept TM & 3D-MID

  • 120000

Outlook Results Embedded Ducts

1084.4

Outlook

0.59 381

Fluidic 3D-MID MID 2010

  • Sept. 29th, 2010, Fuerth, Germany
slide-8
SLIDE 8

Thermal Managemen g Demonstrato

Slide 8 Dipl.-Ing. Thomas Leneke

t & 3D-MID

Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de

  • r

Introduction Proof of Concept TM & 3D-MID Outlook Results Embedded Ducts Outlook

Fluidic 3D-MID MID 2010

  • Sept. 29th, 2010, Fuerth, Germany
slide-9
SLIDE 9

Thermal Managemen g Improved Demon

Slide 9 Dipl.-Ing. Thomas Leneke

t & 3D-MID

Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de

nstrator

Introduction Proof of Concept TM & 3D-MID Outlook Results Embedded Ducts Outlook

Fluidic 3D-MID MID 2010

  • Sept. 29th, 2010, Fuerth, Germany
slide-10
SLIDE 10

Proof of Concept - S p

  • integration of the 3D-MID in

a cooling circuit t f li id fl

  • measurement of liquid flow,

reservoiur temperature & LED temperature pump

Slide 10 Dipl.-Ing. Thomas Leneke

Setup

Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de

p

Introduction Proof of Concept TM & 3D-MID Outlook Results Embedded Ducts Outlook

Fluidic 3D-MID MID 2010

  • Sept. 29th, 2010, Fuerth, Germany

reservoir, radiator

slide-11
SLIDE 11

Proof of Concept - S p

  • T-type thermocouple is used to determine LE
  • silicon seal is opened to establish thermal co
  • LED forward current is varied between 300 –

Slide 11

Test setup to determine the LED temperature with a thermocouple. in the silicon seal.

Dipl.-Ing. Thomas Leneke

Setup

Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de

p

ED temperature

  • ntact to the LED chip

– 600 mA

Introduction Proof of Concept TM & 3D-MID Outlook Results Embedded Ducts Outlook

Fluidic 3D-MID MID 2010

  • Sept. 29th, 2010, Fuerth, Germany

The tip of the thermocouple is inserted

slide-12
SLIDE 12

Proof of Concept - R p

  • measurements of the LED

temperature at various currents temperature at various currents

  • thermal management with and

without thermal via support

  • ∆Tvia shows the temperature

difference between the active difference between the active cooling with and without thermal vias

Slide 12 Dipl.-Ing. Thomas Leneke

Results

Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de

Introduction Proof of Concept TM & 3D-MID Outlook Results Embedded Ducts Outlook

Fluidic 3D-MID MID 2010

  • Sept. 29th, 2010, Fuerth, Germany
slide-13
SLIDE 13

3D-MID Embedded C Previous Utiliza

  • connection of single channels by flexible tu
  • difficult handling due to snapping tubes
  • manual gluing is difficult and time consumin
  • unnecessary long channel increases pressu

→ new integrated solution i

Slide 13

→ new integrated solution i

Dipl.-Ing. Thomas Leneke

Channels

Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de

ation

bes

Introduction

ng ure drop

Proof of Concept TM & 3D-MID Outlook Results Embedded Ducts Outlook

is desirable !!

Fluidic 3D-MID MID 2010

  • Sept. 29th, 2010, Fuerth, Germany

is desirable !!

slide-14
SLIDE 14

3D-MID Embedded C

To create MID embedded channel structure

Fabrication Pro

To create MID-embedded channel structure new overmolding 2K-process

CREATE OVERMOLD WITH COMPONENT 1 COMPONENT 2

Slide 14 Dipl.-Ing. Thomas Leneke

Channels

Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de

es for fludic applicatoins a

  • cess

es for fludic applicatoins a is developed.

Introduction

REMOVE LDS 2K

Proof of Concept TM & 3D-MID

COMPONENT 1 LSS …

Outlook Results Embedded Ducts Outlook

Fluidic 3D-MID MID 2010

  • Sept. 29th, 2010, Fuerth, Germany
slide-15
SLIDE 15

3D-MID Embedded C

  • mallable to the desired shape

Component A Requ

p

  • withstand overmolding process (tempera
  • removable (selectively to component B)

( y )

Component A

candidate Solvent LCP-LDS compatible? PBT Phenol Yes PSU Toluol No PPE Phenol Yes PGA NaOH Yes Brass HNO3+HCL Yes Cu Steel

T t lt f th h i l l bilit f

Slide 15

Test results of the chemical solubility of various polymers and metals and their compatibility to the LDS process.

Dipl.-Ing. Thomas Leneke

Channels

Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de

uirements

ature, pressure)

Introduction Proof of Concept TM & 3D-MID Outlook Results Embedded Ducts Outlook

Fluidic 3D-MID MID 2010

  • Sept. 29th, 2010, Fuerth, Germany
slide-16
SLIDE 16

3D-MID Embedded C Component B Over

Material: Vectra E820i LDS + very low viscosity h i l i t t Proce

  • inje

i j + chemical resistant

  • expensive
  • inje
  • inje

Overmolding Issues pressure velocity

extreme environment for com

Slide 16

extreme environment for com

Dipl.-Ing. Thomas Leneke

Channels

Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de

rmolding

ssing ection pressure (up to 100 MPa) ti d ( t 40 / )

Introduction

ection speed (up to 40 ccm/s) ection temperature (320 °C)

Proof of Concept TM & 3D-MID Outlook Results Embedded Ducts Outlook

time to freeze

mponent A to resist

Fluidic 3D-MID MID 2010

  • Sept. 29th, 2010, Fuerth, Germany

mponent A to resist

slide-17
SLIDE 17

3D-MID Embedded C Component A Rem

initial condition after 2 days

after 5 Process sequence of an embedded by dissolving a sacrificial meta

Slide 17 Dipl.-Ing. Thomas Leneke

Channels

Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de

moving

Introduction Proof of Concept TM & 3D-MID Outlook Results Embedded Ducts

5 days after 8 days

Outlook

channel formation al component.

Fluidic 3D-MID MID 2010

  • Sept. 29th, 2010, Fuerth, Germany
slide-18
SLIDE 18

3D-MID Embedded C Improved Demon

tubes to connect: 2 (previous 10) (p ) flow rate: 38 ml/min (previous 26 ml/m

(including supply, drain, etc.)

wetted surface: 12 3 cm² (previous 30 6 cm²

Slide 18

wetted surface: 12,3 cm (previous 30,6 cm

Dipl.-Ing. Thomas Leneke

Channels

Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de

strator

Introduction Proof of Concept TM & 3D-MID Outlook Results Embedded Ducts Outlook

min) ²)

Fluidic 3D-MID MID 2010

  • Sept. 29th, 2010, Fuerth, Germany

)

slide-19
SLIDE 19

Results and Com

∆T

Slide 19 Dipl.-Ing. Thomas Leneke

parison

Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de

p

Introduction Proof of Concept TM & 3D-MID Outlook Results Embedded Ducts

T ≈ 9,5 °C

Outlook

Fluidic 3D-MID MID 2010

  • Sept. 29th, 2010, Fuerth, Germany
slide-20
SLIDE 20

Conclusion and Ou

  • sacrificial injection molding process is develo
  • thermal characteristics are determined for dif
  • sacrificial LDS compatible process for embed
  • proof of concept for the developed thermal m

Current designs (left) and intended design (right). The integration of a meander structure is desirable to improve the thermal performance

Slide 20

meander structure is desirable to improve the thermal performance.

Dipl.-Ing. Thomas Leneke

utlook

Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de

  • ped

fferent thermal cases dded channels is developed

Introduction

management 3D-MID is given Todo:

Proof of Concept TM & 3D-MID

  • find more appropriate

sacrificial components/process ( l t h i l t hi )

Outlook Results Embedded Ducts

(electrochemical etching)

  • development of

appropriate thermal

Outlook

pp p model of the system

  • improve temperature

measurement

Fluidic 3D-MID MID 2010

  • Sept. 29th, 2010, Fuerth, Germany

measurement

slide-21
SLIDE 21

Contact

Dipl.-Ing. Thomas Leneke Otto-von-Guericke-Universtität Magdeburg Magdeburg IMOS – TEPROSA P.O. Box 4120 39016 Magdeburg Phone: +49 (0) 391 / 67-18228 Fax: +49 (0) 391 / 67-12609 eMail: thomas.leneke@teprosa.de Internet: www.teprosa.de

Slide 21 Dipl.-Ing. Thomas Leneke Tel: +49 (0) 391 / 67-18228 eMail: thomas.leneke@teprosa.de

Acknowledgement Acknowledgement

Fluidic 3D-MID MID 2010

  • Sept. 29th, 2010, Fuerth, Germany