“Trends in Advanced Packaging Technologies ” An IMAPS ‐ UK view Andy Longford Chair ‐ IMAPS UK – 2007 ‐ 9 PandA Europe IMAPS UK ‐ IeMRC Interconnection event December 2008 1
International Microelectronics And Packaging Society “ Everything in electronics between the chip and the system …”
Membership • IMAPS is the largest Microelectronic packaging society in the world! Individual 2453 Corporate 287 Int'l Affiliates 1136 Students 287 TOTALS 4163 Data; February 2008 Trend is increasing membership
IMAPS ‐ UK Membership Individual 50 Corporate (33 x 2) 66 Academics 4 Students 2 Life members 8 Data ‐ September 2008 TOTALS 130 Trend is increasing membership • IMAPS – UK is a registered ‘Charity’ organisation with an aim to interface Industry with Academia • IMAPS ‐ UK is a member of the UK Electronics Alliance(UKEA) – working as a Trade Association to support development of the UK industry
IMAPS Future
Packaging Trends • The Packaging market • Packaging in Europe • Trends in – Technology – Values – Volumes Courtesy – FICO NL December 2008 7 PandA Europe
IC Package units growth • 2007 = 151 bn ‐ CAGR: 9.55% • 2012 = 261 bn Since the end of 2001, annual IC unit shipments DCA have grown an astounding WLP QFN 120% from 68.5 billion in DFN FBGA 2001 to 151.1 billion in BGA QFP 2007. SOT TSOP SO CC PGA DIP Source - Electronic Trends December 2008 PandA Europe 8
Package Market ‐ Summary From 2007 – 2012 .... a 70% increase Volumes – CAGR = 9.55% Value – CAGR = 11.46% Average price is up 8.61% ..... Cost of packaging will increase December 2008 PandA Europe 9
Package Technology Drivers • ITRS Roadmaps ITRS Roadmaps … … • • Market Pull or Market Pull or “ “envelope envelope” ” push push • • Effect of package parameters Effect of package parameters … … • • Fabrication Infrastructure (design support?) Fabrication Infrastructure (design support?) • • Time to Markets Time to Markets • • Ways to lower cost Ways to lower cost • ….The Grand Challenge is .The Grand Challenge is … Cost … … …and who pays ? and who pays ? Cost … December 2008 PandA Europe 10
Package Types: 1. Plastic IC Packages 2. Leadless IC 3. Discretes 4. Opto 5. Advanced (Embedded & TSV) 6. Ceramics and Metal can 7. MEMS (Cavity Plastic) 8. Custom (App Specific) December 2008 PandA Europe 11
Package Market shares 1% 3% 1% 1% 2007 = 188 bn units 20% 24% 2012 = 295 bn units 19% 31% package types 1% IC plast 3% 1% 2% 9% IC leadless Discrete 20% Opto 38% 26% Adv pkg Cer & Met MEMs Custom Source – Electronic Trends / PandA December 2008 PandA Europe 12
Packaging in Europe • Advanced Packaging • SiP & WLP • MEMs • PhotoVoltaics • Opto’s December 2008 PandA Europe 13
Market generators Sector Innovation Design Manufacturing Utilisation Aerospace USA Europe Europe USA Automotive Europe Europe Asia Europe Broadcast Europe USA Asia Europe Communications Europe USA USA USA Computing USA USA Asia USA Consumer Asia Asia Asia Asia Industrial Europe USA Asia Asia Medical USA Europe Europe Europe Military Europe USA Europe USA Security Europe USA USA USA Source EPN / PandA December 2008 PandA Europe 14
Packaging Market in Europe • Application Driven .... – Non Commercial • Security, Medical, etc. – Military – Aerospace • Hermetic, Hi ‐ Rel – Advanced designs • Phones, Sensors • Inherently… Low Volume • Typically …. HIGH VALUE December 2008 PandA Europe 15
The European (Packaging) process • Application design (ASP) • Prototype • Pre ‐ production • Outsource Production – Export Designs Courtesy – MENTOR PandA Europe December 2008 16
Europe’s Packaging Need … Smaller – Faster – Cheaper ....but what are the defining trends? – Capability Infrastructure of: • Design .... Mentor, Synopsis, Cadence, etc. all developing package design software – based on SiP – Will add significant cost ...but achieve 1st time success • Assembly ... New expertise is developing to address technology issues of advanced packaging – Institutes (IMEC, Fhg IZM, etc.) offer cost effective programmes • Equipment ... Europe continues to lead in design and supply of machinery to support new technology – EVG, ASM, STS all offering WLP/TSV developments • Facilities .... Limited large scale options, but a range of specialised units continue to provide necessary services. – Development of volumes require outsourcing December 2008 PandA Europe 17
Trends in packaging • Technology • Values • Volumes • Locations December 2008 PandA Europe 18
Development of Chip ‐ substrate Technology Leadframes Substrates Units/lot & PDIP KK Sensors QFP SOIC QFN(MLF) Logic ICs TECHNOLOGY OVERLAP CUSTOM WLP RF & ASIC SmartCard CSP BGA Ceramic K Pb-free PWB Memory 1980 2000 2010
Development of Advanced Packaging Technology Units/lot Wafer PWB technology & KK TECHNOLOGY Memory CUSTOM OVERLAP WLP SmartCard CoC PWB BGA CSP K COB DCA Flip Chip Pb-free 1980 2000 2010
Trends in Packaging st Generation nd Generation rd Generation th Generation 1 st 2 nd 3 rd 4 th Generation Generation Generation Generation 1 2 3 4 LF & TAB LF & TAB BGA BGA 3D SiP 3D SiP Opto/MEMS Opto/MEMS IC IC IC IC TCP PoP Wireless PiP Stacked Die Interconnect MCP TBGA FCBGA Optical Interconnect Package Size PBGA QFP BB + Memory CPU + Cache Memory Memory Stack PLCC aEPS (Embedded Active & Passive) EPS (Embedded Discrete) DIP Stacked EDS EPS (Passive Circuit) MEMS Devices SOJ SOP EDS MCM ‐ EDS Resistor Ta 2 O 5 capacitor Inductor PI capacitor EDSi IPD/AIC aWLPoP WLCSP aWLP aWLP ( w/ Heat Slug (w/ Active Die aWLP & Passive) /Shield) 1980 1990 2000 2010 2020 source ‐ Jisso December 2008 PandA Europe 21
Emerging (Advanced) Technology Heterogeneous Integration to Maximize Utilization of Thickness Dimension Assembly + Assembly + Substrate Assembly + IC (WLCSP) PiP EPS IPD (Package ‐ in ‐ package) (Integrated Passive Device) (Embedded Passive in Substrate) PoP EDS aWLP (Package ‐ on ‐ package) (Embedded Die in Substrate) (Fan ‐ out WLCSP) Assembly + System TSV ‐ Via Last (Wireless Connectivity Modules) (Through Silicon Via) source – ASE Group December 2008 PandA Europe 22
TSV Trends Courtesy ASE Group 2007 2009 2012 >2014 1000 CMOS Image Sensor (Sensor + DSP + RAM) Thickness Interconnect Minimum Pitch Dimension (µm) FC Solder Bump 3D Stacked DRAM/Flash Pitch Logic (CPU + Cache Memory) 100 Baseband Au Stud FC Bump Pitch Sensor I/O Sensor I/O RF Power 10 Vertical Device Analog on CMOS DRAM / NVM Cache Memory CPU Multi-level 3D IC (CPU + Cache + DRAM + Analog + RF + Sensor + I/O) 1 Via First Via Last ITRS 65 nm ≦ 5 µm Via Size: 50 – 100 µm 5 - 30 µm ≦ 2 µm Min Global Metal Pitch Source ‐ EMC ‐ 3D & ASE Data December 2008 PandA Europe 23
Market trends 2007 ‐ 2012: 1. Values 2. Volumes December 2008 PandA Europe 24
Package Market ‐ Downturn Criteria: ‐ Recent Forecast Changes due to Economic pressures .... ‐ Market Uncertainties ‐ No investment in “new” equipment ‐ Packaging “lags” IC build Latest Estimates: 25 ? 2009 – Flat to down 5% 2010 – back on track 7 ‐ 8% growth December 2008 PandA Europe
Packaging Trends ? TO & DIP will not die Source ‐ Prismark December 2008 PandA Europe 26
Package Market Values 16 14 Market $ 12 2007 – 35 bn 10 2012 – 58 bn bn $ 8 6 2007 4 2012 2 0 t s m g t e o s s e s k M a t t M o e p e P l E t P l O r s d c & v M u a s C d C e i r D A I e L C C I December 2008 PandA Europe 27
Advanced IC Packages 13bn 12.5 bn 2012 source – Philips/Gartner December 2008 PandA Europe 28
Package Market volumes 0.8 1.0 0.5 1.0 2007 = 188 bn units 45.0 45.0 2012 = 295 bn units 40.0 55.0 IC plast 0.8 2.0 0.5 IC leadless 7.0 32.1 Discrete Opto 65.0 112.5 Adv pkg Cer & Met MEMs Custom 75.6 Source – Electronic Trends / PandA December 2008 PandA Europe 29
Sub- Contract packaging trend Source of Assembly, Test and Material Revenue Revenue by End Application Revenue by PackageType Source – ASE Group December 2008 PandA Europe 30
IMAPS Future ‐ Technology Bill Bottoms
IMAPS Future ‐ Technology To Survive we are going to have to expand the portfolio of the We have to society move up the pyramid IMAPS Traditionally Very Strong in this region
New Initiatives for IMAPS ? Solar Lab on a Chip Materials ‐ Nano LED Packaging
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