Trends in Advanced Packaging Technologies An IMAPS UK view Andy - - PowerPoint PPT Presentation

“Trends in Advanced Packaging Technologies ” An IMAPS‐UK view

Andy Longford Chair ‐IMAPS UK – 2007‐9 PandA Europe

1 IMAPS UK ‐ IeMRC Interconnection event December 2008

International Microelectronics And Packaging Society “Everything in electronics between the chip and the system …”

Membership

• IMAPS is the largest Microelectronic packaging society in the

world!

Individual 2453 Corporate 287 Int'l Affiliates 1136 Students 287 TOTALS 4163

Data; February 2008 Trend is increasing membership

IMAPS‐UK Membership

• IMAPS – UK is a registered ‘Charity’ organisation with an aim to interface

Industry with Academia

• IMAPS ‐ UK is a member of the UK Electronics Alliance(UKEA) – working

as a Trade Association to support development of the UK industry

Individual 50 Corporate (33 x 2) 66 Academics 4 Students 2 Life members 8 TOTALS 130

Data ‐ September 2008 Trend is increasing membership

IMAPS Future

Packaging Trends

• The Packaging market
• Packaging in Europe
• Trends in

– Technology – Values – Volumes

Courtesy – FICO NL

December 2008 7 PandA Europe

December 2008 PandA Europe 8

IC Package units growth

Since the end of 2001, annual IC unit shipments have grown an astounding 120% from 68.5 billion in 2001 to 151.1 billion in 2007.

• 2007 = 151 bn ‐ CAGR: 9.55%
• 2012 = 261 bn

DCA WLP QFN DFN FBGA BGA QFP SOT TSOP SO CC PGA DIP

Source - Electronic Trends

Package Market ‐ Summary

From 2007 – 2012 .... a 70% increase Volumes – CAGR = 9.55% Value – CAGR = 11.46% Average price is up 8.61% ..... Cost of packaging will increase

December 2008 PandA Europe 9

December 2008 PandA Europe 10

Package Technology Drivers

• ITRS Roadmaps

ITRS Roadmaps … …

• Market Pull or

Market Pull or “ “envelope envelope” ” push push

• Effect of package parameters

Effect of package parameters … …

• Fabrication Infrastructure (design support?)

Fabrication Infrastructure (design support?)

• Time to Markets

Time to Markets

• Ways to lower cost

Ways to lower cost

… ….The Grand Challenge is .The Grand Challenge is

Cost Cost … … … …and who pays ? and who pays ?

December 2008 PandA Europe 11

Package Types:

1. Plastic IC Packages 2. Leadless IC 3. Discretes 4. Opto 5. Advanced (Embedded & TSV) 6. Ceramics and Metal can 7. MEMS (Cavity Plastic) 8. Custom (App Specific)

December 2008 PandA Europe 12

Package Market shares

9% 20% 26% 38% 2% 1% 3% 1%

IC plast IC leadless Discrete Opto Adv pkg Cer & Met MEMs Custom

2007 = 188 bn units

2012 = 295 bn units package types

20% 19% 31% 24% 1% 1% 3% 1%

Source – Electronic Trends / PandA

December 2008 PandA Europe 13

Packaging in Europe

• Advanced Packaging
• SiP & WLP
• MEMs
• PhotoVoltaics
• Opto’s

Market generators

Sector Innovation Design Manufacturing Utilisation Aerospace

USA Europe Europe USA

Automotive

Europe Europe Asia Europe

Broadcast

Europe USA Asia Europe

Communications

Europe USA USA USA

Computing

USA USA Asia USA

Consumer

Asia Asia Asia Asia

Industrial

Europe USA Asia Asia

Medical

USA Europe Europe Europe

Military

Europe USA Europe USA

Security

Europe USA USA USA

December 2008 PandA Europe 14

Source EPN / PandA

December 2008 PandA Europe 15

Packaging Market in Europe

• Application Driven ....

– Non Commercial

• Security, Medical, etc.

– Military – Aerospace

• Hermetic, Hi‐Rel

– Advanced designs

• Phones, Sensors
• Inherently… Low Volume
• Typically …. HIGH VALUE

December 2008 PandA Europe 16

The European (Packaging) process

• Application design (ASP)
• Prototype
• Pre‐production
• Outsource Production

– Export Designs

Courtesy – MENTOR

December 2008 PandA Europe 17

Europe’s Packaging Need …

– Capability Infrastructure of:

• Design ....Mentor, Synopsis, Cadence, etc. all developing package design

software – based on SiP

– Will add significant cost ...but achieve 1st time success

• Assembly ...New expertise is developing to address technology issues of

advanced packaging

– Institutes (IMEC, Fhg IZM, etc.) offer cost effective programmes

• Equipment ...Europe continues to lead in design and supply of machinery to

support new technology

– EVG, ASM, STS all offering WLP/TSV developments

• Facilities .... Limited large scale options, but a range of specialised units

continue to provide necessary services.

– Development of volumes require outsourcing

Smaller – Faster – Cheaper ....but what are the defining trends?

December 2008 PandA Europe 18

Trends in packaging

• Technology
• Values
• Volumes
• Locations

Development of Chip‐substrate Technology

Units/lot

Leadframes Substrates

SOIC QFP QFN(MLF) CUSTOM PDIP PWB Ceramic SmartCard BGA 2000 1980

K KK

CSP WLP

Pb-free

TECHNOLOGY OVERLAP

Sensors

Logic ICs

Memory

RF & ASIC

& 2010

Development of Advanced Packaging Technology

Units/lot

2000 2010 1980 CUSTOM PWB SmartCard BGA COB

K KK

CSP WLP

Pb-free

TECHNOLOGY OVERLAP

PWB technology Wafer

& CoC DCA Flip Chip Memory

21

1980 1990 2000 2010 2020 Package Size

2 2nd

nd Generation

Generation BGA BGA 3 3rd

rd Generation

Generation 3D SiP 3D SiP 4 4th

th Generation

Generation Opto/MEMS Opto/MEMS 1 1st

st Generation

Generation LF & TAB LF & TAB

DIP BB + Memory CPU + Cache Memory Memory Stack SOJ PLCC QFP PBGA TBGA FCBGA MCP PoP WLCSP aWLP aWLP

(w/ Heat Slug

/Shield)

aWLP

(w/ Active Die & Passive)

aWLPoP

IPD/AIC aEPS (Embedded Active & Passive) EPS (Passive Circuit) EPS (Embedded Discrete) EDS EDSi MCM‐ EDS Stacked EDS

Wireless Interconnect Optical Interconnect MEMS Devices TCP SOP Stacked Die PiP

source ‐ Jisso

Trends in Packaging

PandA Europe December 2008

22

Heterogeneous Integration to Maximize Utilization of Thickness Dimension

Assembly +

Assembly + Substrate Assembly + IC (WLCSP) PoP

(Package‐on‐package)

EPS

(Embedded Passive in Substrate)

aWLP

(Fan‐out WLCSP)

EDS

(Embedded Die in Substrate)

IPD

(Integrated Passive Device) TSV ‐ Via Last

(Through Silicon Via)

PiP

(Package‐in‐package)

Assembly + System

(Wireless Connectivity Modules)

Emerging (Advanced) Technology

source – ASE Group PandA Europe December 2008

TSV Trends

December 2008 PandA Europe 23

Multi-level 3D IC (CPU + Cache + DRAM + Analog + RF + Sensor + I/O) 3D Stacked DRAM/Flash

2007 2009 2012 >2014

Logic (CPU + Cache Memory) Baseband Via Size: 50 – 100 µm 5 - 30 µm ≦ 5 µm

CMOS Image Sensor (Sensor + DSP + RAM)

Au Stud FC Bump Pitch ITRS 65 nm Min Global Metal Pitch

1000 1 10 100

Vertical Device

• n CMOS

≦ 2 µm

FC Solder Bump Pitch

Via Last Via First

Source ‐ EMC‐3D & ASE Data Thickness Interconnect Minimum Pitch Dimension (µm) Courtesy ASE Group

December 2008 PandA Europe 24

Market trends 2007‐2012:

• 1. Values
• 2. Volumes

Package Market ‐ Downturn

Criteria: ‐Recent Forecast Changes due to Economic pressures .... ‐ Market Uncertainties ‐ No investment in “new” equipment ‐ Packaging “lags” IC build Latest Estimates: 2009 – Flat to down 5% 2010 – back on track 7‐8% growth

December 2008 PandA Europe 25?

December 2008 PandA Europe 26

Packaging Trends ?

Source ‐ Prismark

TO & DIP will not die

Package Market Values

2 4 6 8 10 12 14 16 bn $ I C P l a s t I C L e a d l e s s D i s c r e t e O p t

• A

d v P k g C e r & M e t M E M s C u s t

• m

2007 2012

Market $ 2007 – 35 bn 2012 – 58 bn

December 2008 27 PandA Europe

Advanced IC Packages

December 2008 PandA Europe 28 source – Philips/Gartner

2012 13bn 12.5 bn

Package Market volumes

45.0 40.0 55.0 45.0 0.5 1.0 0.8 1.0

32.1 65.0 75.6 112.5 7.0 0.8 2.0 0.5

2007 = 188 bn units

Source – Electronic Trends / PandA

IC plast IC leadless Discrete Opto Adv pkg Cer & Met MEMs Custom

2012 = 295 bn units

December 2008 PandA Europe 29

30

Source of Assembly, Test and Material Revenue

Revenue by End Application Revenue by PackageType

PandA Europe

Sub- Contract packaging trend

Source – ASE Group

December 2008

IMAPS Future ‐ Technology

Bill Bottoms

IMAPS Future ‐ Technology

IMAPS Traditionally Very Strong in this region We have to move up the pyramid To Survive we are going to have to expand the portfolio of the society

New Initiatives for IMAPS ?

Lab on a Chip

Solar

LED Packaging Materials ‐ Nano

What are the Implications For the Future

• f Micro Electronic Packaging?
• Embed passive and active die are here now. In the next few years they

will be in almost high density products

– This changes the way PCB shop will do business – Will PCB shop become assemblers – Will the assemblers become PCB shops

• If we do move into the age of replication what happens to the massive

factories we have now?

– Do we stop chasing low cost labor? – Will today's assemblers have to open outlets in shopping malls?

• What will be the future of Pick and Place machine manufactures and

today's passive component manufactures?

How Does IMAPS Stay Relevant

• On –line capabilities:
• As travel becomes more

expensive we will need to move to more ‘on line’ events

• Utilise more of the

“IknowMicroelectronics” – IMAPS ‘on line’ library

• Develop University contacts ..

– Student Paper awards ‐ Publishing opportunities

• Develop better communications

between Organisations, Chapters and Regions

• Develop key interest groups ….

……future directions

Everything about Chips in Systems ?

UK is still about the “Hybridisation” of …

• Sensors – Industrial / Military
• Medical Electronics
• Optical interconnection
• Energy Scavenging

PandA Europe 37

Innovation = New designs New processes New technologies Innovate for

• Cost reduction
• Manufacturability
• Functionality
• Standardisation

R&D ?…

= Research Development =

the bridge between innovation and cost

PandA Europe 38

Time to Market

• Research …

– 5 years typical to working innovation – typically 3 years funded in EU – 1‐2 years seeding

• Development …

– Minimum 3‐5 years

• SoP …

– 1‐2 possible – Typically 5 years (Automotive qualification etc )

IDEA gestation – 15 years !

IMAPS Nordic – 15 September 2008 PandA Europe 39

……future directions ...

Everything about Chips in Systems ?

IMAPS (in Europe) is still about the “Hybridisation” of …

• Sensors – Industrial / Military
• Medical Electronics
• Optical interconnection
• Energy Scavenging

IMAPS Nordic – 15 September 2008 PandA Europe 40

……future initiatives ...

Linking Industry to Academia ...

Provide a vehicle to support NOW technology in Microelectronic packaging and interconnection…

• Skills Academy – To get Graduates into Industry
• Collaborative development programmes
• Industry Related “themes”
• Joint working groups and events with other organisations
• UKEA, xKTN, NMI and Government interaction.

International Microelectronics And Packaging Society (IMAPS) Everything in electronics between the chip and the system!

….. involved with …

• Interconnection
• Microelectronics
• Packaging

International Microelectronics And Packaging Society “Everything in electronics between the chip and the system …”

Thank you for your attention